supervisory circuits mpu supervisor
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e3 |
| 长度 | 19.175 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.572 mm |
| 最大供电电流 (Isup) | 7 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| MAX696EPE+ | MAX697EWE+ | MAX696EWE+ | MAX697EPE+ | 5962-9204102MEA | MAX696EWE+T | MAX697EWE+T | MAX697CWE+T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | supervisory circuits mpu supervisor | supervisory circuits mpu supervisor | supervisory circuits mpu supervisor | supervisory circuits mpu supervisor | multiplexer switch ics quad spst cmos analog mux | supervisory circuits mpu supervisor | supervisory circuits mpu supervisor | supervisory circuits mpu supervisor |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | DIP | SOIC | SOIC | DIP | DIP | SOIC | SOIC | SOIC |
| 包装说明 | DIP, DIP16,.3 | SOP, SOP16,.4 | SOP, SOP16,.4 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.4 | SOP, SOP16,.4 | SOP, SOP16,.4 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compli | compli | compli | compli | _compli | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | SPST | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-GDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e0 | e3 | e3 | e3 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 4 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 70 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | DIP | DIP | SOP | SOP | SOP |
| 封装等效代码 | DIP16,.3 | SOP16,.4 | SOP16,.4 | DIP16,.3 | DIP16,.3 | SOP16,.4 | SOP16,.4 | SOP16,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 240 | 260 | 260 | 260 |
| 电源 | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 12/+-15 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | YES | YES | NO | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 20 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| Factory Lead Time | 1 week | 6 weeks | 6 weeks | - | 18 weeks | 6 weeks | 6 weeks | 9 weeks |
| 可调阈值 | NO | NO | NO | NO | - | NO | NO | NO |
| 长度 | 19.175 mm | 10.3 mm | 10.3 mm | 19.175 mm | - | 10.3 mm | 10.3 mm | 10.3 mm |
| 座面最大高度 | 4.572 mm | 2.65 mm | 2.65 mm | 4.572 mm | - | 2.65 mm | 2.65 mm | 2.65 mm |
| 最大供电电流 (Isup) | 7 mA | 0.3 mA | 7 mA | 0.3 mA | - | 7 mA | 0.3 mA | 0.3 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V |
| 宽度 | 7.62 mm | 7.5 mm | 7.5 mm | 7.62 mm | - | 7.5 mm | 7.5 mm | 7.5 mm |
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