digital to analog converters - dac 12-bit 4ch precision dac
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | DIP |
包装说明 | DIP, DIP24,.3 |
针数 | 24 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
Factory Lead Time | 13 weeks |
转换器类型 | D/A CONVERTER |
输入位码 | BINARY |
输入格式 | PARALLEL, WORD |
JESD-30 代码 | R-PDIP-T24 |
JESD-609代码 | e3 |
长度 | 30.545 mm |
最大线性误差 (EL) | 0.0244% |
湿度敏感等级 | 1 |
标称负供电电压 | -5 V |
位数 | 12 |
功能数量 | 4 |
端子数量 | 24 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP24,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | 260 |
电源 | +-5 V |
认证状态 | Not Qualified |
座面最大高度 | 4.572 mm |
标称安定时间 (tstl) | 5 µs |
最大压摆率 | 18 mA |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
Base Number Matches | 1 |
MAX527DCNG+ | MAX526CCNG+ | MAX526CEWG+ | MAX527DEWG+ | MAX527DEWG+T | MAX526DCWG+T | MAX527DCWG+T | MAX527DENG+ | MAX526CEWG+T | MAX526DEWG+T | |
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是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | DIP | DIP | SOIC | SOIC | SOIC | SOIC | SOIC | DIP | SOIC | SOIC |
包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | SOP, SOP24,.4 | SOP, SOP24,.4 | SOP, SOP24,.4 | SOP, SOP24,.4 | SOP, SOP24,.4 | DIP, DIP24,.3 | SOP, SOP24,.4 | SOP, SOP24,.4 |
针数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | 3A001.A.5.B | EAR99 | EAR99 | EAR99 | EAR99 | - |
转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | - | D/A CONVERTER | D/A CONVERTER | - | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | BINARY | BINARY | BINARY | - | BINARY | BINARY | - | BINARY | BINARY | BINARY |
输入格式 | PARALLEL, WORD | - | PARALLEL, WORD | - | PARALLEL, WORD | PARALLEL, WORD | - | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
JESD-30 代码 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 | - | R-PDSO-G24 | R-PDSO-G24 | - | R-PDIP-T24 | R-PDSO-G24 | R-PDSO-G24 |
JESD-609代码 | e3 | e3 | e3 | - | e3 | e3 | - | e3 | e3 | e3 |
长度 | 30.545 mm | - | 15.4 mm | - | 15.4 mm | 15.4 mm | - | 30.545 mm | 15.4 mm | 15.4 mm |
最大线性误差 (EL) | 0.0244% | 0.012% | 0.0122% | - | 0.0244% | 0.0244% | - | 0.0244% | 0.0122% | 0.0244% |
湿度敏感等级 | 1 | 1 | 1 | - | - | 1 | - | 1 | 1 | 1 |
标称负供电电压 | -5 V | - | -5 V | - | -5 V | -5 V | - | -5 V | -5 V | -5 V |
位数 | 12 | 12 | 12 | - | 12 | 12 | - | 12 | 12 | 12 |
功能数量 | 4 | 4 | 4 | - | 4 | 4 | - | 4 | 4 | 4 |
端子数量 | 24 | 24 | 24 | - | 24 | 24 | - | 24 | 24 | 24 |
最高工作温度 | 70 °C | 70 °C | 85 °C | - | 85 °C | 70 °C | - | 85 °C | 85 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | SOP | - | SOP | SOP | - | DIP | SOP | SOP |
封装等效代码 | DIP24,.3 | DIP24,.3 | SOP24,.4 | - | SOP24,.4 | SOP24,.4 | - | DIP24,.3 | SOP24,.4 | SOP24,.4 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE | - | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | 260 | - | 260 | 260 | - | 260 | 260 | 260 |
电源 | +-5 V | 15,-5 V | 15,-5 V | - | +-5 V | 15,-5 V | - | +-5 V | 15,-5 V | 15,-5 V |
认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.572 mm | - | 2.65 mm | - | 2.65 mm | 2.65 mm | - | 4.572 mm | 2.65 mm | 2.65 mm |
标称安定时间 (tstl) | 5 µs | - | 3 µs | - | 5 µs | 3 µs | - | 5 µs | 3 µs | 3 µs |
最大压摆率 | 18 mA | 28 mA | 28 mA | - | 18 mA | 28 mA | - | 18 mA | 28 mA | 28 mA |
标称供电电压 | 5 V | - | 15 V | - | 5 V | 15 V | - | 5 V | 15 V | 15 V |
表面贴装 | NO | NO | YES | - | YES | YES | - | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | - | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | - | INDUSTRIAL | COMMERCIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | - | GULL WING | GULL WING | - | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | - | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | - | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | - | 7.5 mm | - | 7.5 mm | 7.5 mm | - | 7.62 mm | 7.5 mm | 7.5 mm |
厂商名称 | - | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
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