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74LVC1G58GV

产品描述Low-power configurable multiple function gate
产品类别逻辑    逻辑   
文件大小78KB,共18页
制造商Philips Semiconductors (NXP Semiconductors N.V.)
官网地址https://www.nxp.com/
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74LVC1G58GV概述

Low-power configurable multiple function gate

74LVC1G58GV规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Philips Semiconductors (NXP Semiconductors N.V.)
包装说明TSOP, TSOP6,.11,37
Reach Compliance Codeunknow
JESD-30 代码R-PDSO-G6
JESD-609代码e0
负载电容(CL)50 pF
最大I(ol)0.024 A
端子数量6
最高工作温度125 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码TSOP
封装等效代码TSOP6,.11,37
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
包装方法TAPE AND REEL
电源3.3 V
Prop。Delay @ Nom-Su7.9 ns
认证状态Not Qualified
施密特触发器YES
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.95 mm
端子位置DUAL

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74LVC1G58
Low-power configurable multiple function gate
Rev. 01 — 15 September 2004
Product data sheet
1. General description
The 74LVC1G58 is a high-performance, low-power, low-voltage, Si-gate CMOS device,
superior to most advanced CMOS compatible TTL families.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this
device in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using I
off
. The I
off
circuitry
disables the output, preventing the damaging backflow current through the device when it
is powered down.
The 74LVC1G58 provides configurable multiple functions. The output state is determined
by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND,
NOR, XOR, inverter and buffer. All inputs can be connected to V
CC
or GND.
The three inputs (A, B and C) are capable of transforming slowly changing input signals
into sharply defined, jitter-free output signals.
The gate switches at different points for positive and negative-going signals. The
difference between the positive voltage V
T+
and the negative voltage V
T−
is defined as the
hysteresis voltage V
H
.
2. Features
s
s
s
s
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant input/output for interfacing with 5 V logic
High noise immunity
Complies with JEDEC standard:
x
JESD8-7 (1.65 V to 1.95 V)
x
JESD8-5 (2.3 V to 2.7 V)
x
JESD8B/JESD36 (2.7 V to 3.6 V).
±24
mA output drive (V
CC
= 3.0 V)
ESD protection:
x
HBM EIA/JESD22-A114-B exceeds 2000 V
x
MM EIA/JESD22-A115-A exceeds 200 V.
CMOS low power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Inputs accept voltages up to 5 V
Multiple package options
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C.
s
s
s
s
s
s
s
s

74LVC1G58GV相似产品对比

74LVC1G58GV 74LVC1G58 74LVC1G58GM 74LVC1G58GW
描述 Low-power configurable multiple function gate Low-power configurable multiple function gate Low-power configurable multiple function gate Low-power configurable multiple function gate
是否Rohs认证 不符合 - 不符合 不符合
厂商名称 Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
包装说明 TSOP, TSOP6,.11,37 - SON, SOLCC6,.04,20 TSSOP, TSSOP6,.08
Reach Compliance Code unknow - unknow unknow
JESD-30 代码 R-PDSO-G6 - R-PDSO-N6 R-PDSO-G6
JESD-609代码 e0 - e0 e0
负载电容(CL) 50 pF - 50 pF 50 pF
最大I(ol) 0.024 A - 0.024 A 0.024 A
端子数量 6 - 6 6
最高工作温度 125 °C - 125 °C 125 °C
最低工作温度 -40 °C - -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP - SON TSSOP
封装等效代码 TSOP6,.11,37 - SOLCC6,.04,20 TSSOP6,.08
封装形状 RECTANGULAR - RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法 TAPE AND REEL - TAPE AND REEL TAPE AND REEL
电源 3.3 V - 3.3 V 3.3 V
Prop。Delay @ Nom-Su 7.9 ns - 7.9 ns 7.9 ns
认证状态 Not Qualified - Not Qualified Not Qualified
施密特触发器 YES - YES YES
标称供电电压 (Vsup) 3.3 V - 3.3 V 3.3 V
表面贴装 YES - YES YES
技术 CMOS - CMOS CMOS
温度等级 AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
端子面层 Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING - NO LEAD GULL WING
端子节距 0.95 mm - 0.5 mm 0.635 mm
端子位置 DUAL - DUAL DUAL

 
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