operational amplifiers - Op amps low-distortion rail-rail Op amp
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Maxim(美信半导体) |
包装说明 | TSSOP, |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
Factory Lead Time | 6 weeks |
放大器类型 | OPERATIONAL AMPLIFIER |
最大平均偏置电流 (IIB) | 0.00005 µA |
标称共模抑制比 | 115 dB |
最大输入失调电压 | 750 µV |
JESD-30 代码 | S-PDSO-G10 |
长度 | 3 mm |
功能数量 | 2 |
端子数量 | 10 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED |
座面最大高度 | 1.1 mm |
标称压摆率 | 0.3 V/us |
供电电压上限 | 6 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
标称均一增益带宽 | 3000 kHz |
宽度 | 3 mm |
MAX4253EUB+G65 | MAX4253EUB+T | MAX4251EUA+T | MAX4253EUB+TG65 | MAX4256EUA+T | MAX4257EUA+T | MAX4249ESD+T | |
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是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | TSSOP, | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP8,.19 | TSSOP, | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.19 | SOP, SOP14,.25 |
Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
最大平均偏置电流 (IIB) | 0.00005 µA | 0.0001 µA | 0.0001 µA | 0.00005 µA | 0.0001 µA | 0.0001 µA | 0.0001 µA |
标称共模抑制比 | 115 dB | 115 dB | 115 dB | 115 dB | 115 dB | 115 dB | 115 dB |
最大输入失调电压 | 750 µV | 750 µV | 750 µV | 750 µV | 750 µV | 750 µV | 750 µV |
JESD-30 代码 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G8 | S-PDSO-G10 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G14 |
长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 8.65 mm |
功能数量 | 2 | 2 | 1 | 2 | 1 | 2 | 2 |
端子数量 | 10 | 10 | 8 | 10 | 8 | 8 | 14 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | SOP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | 260 | 260 | 260 |
座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.75 mm |
标称压摆率 | 0.3 V/us | 0.3 V/us | 0.3 V/us | 0.3 V/us | 2.1 V/us | 2.1 V/us | 2.1 V/us |
供电电压上限 | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm | 0.65 mm | 0.65 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
标称均一增益带宽 | 3000 kHz | 3000 kHz | 3000 kHz | 3000 kHz | 22000 kHz | 22000 kHz | 22000 kHz |
宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3.9 mm |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | - | - |
是否无铅 | - | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 |
零件包装代码 | - | SOIC | SOIC | - | SOIC | SOIC | SOIC |
针数 | - | 10 | 8 | - | 8 | 8 | 14 |
架构 | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
频率补偿 | - | YES | YES | - | YES (AVCL>=10) | YES (AVCL>=10) | YES (AVCL>=10) |
JESD-609代码 | - | e3 | e3 | - | e3 | e3 | e3 |
低-偏置 | - | YES | YES | - | YES | YES | YES |
低-失调 | - | YES | YES | - | YES | YES | YES |
微功率 | - | YES | YES | - | YES | YES | YES |
湿度敏感等级 | - | 1 | 1 | - | 1 | 1 | - |
封装等效代码 | - | TSSOP10,.19,20 | TSSOP8,.19 | - | TSSOP8,.19 | TSSOP8,.19 | SOP14,.25 |
包装方法 | - | TAPE AND REEL | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
功率 | - | NO | NO | - | NO | NO | NO |
电源 | - | 5 V | 5 V | - | +-1.2/+-2.75/2.4/5.5 V | +-1.2/+-2.75/2.4/5.5 V | 5 V |
可编程功率 | - | NO | NO | - | NO | NO | NO |
认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
最大压摆率 | - | 1.15 mA | 0.575 mA | - | 0.575 mA | 1.15 mA | 1.15 mA |
技术 | - | BICMOS | BICMOS | - | BICMOS | BICMOS | BICMOS |
端子面层 | - | Matte Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
最小电压增益 | - | 10000 | 10000 | - | 10000 | 10000 | 10000 |
宽带 | - | NO | NO | - | NO | NO | NO |
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