电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

KSS029-811GT

产品描述IC Socket, SIP29, 29 Contact(s),
产品类别连接器    插座   
文件大小499KB,共4页
制造商Advanced Interconnections Corp
下载文档 详细参数 全文预览

KSS029-811GT概述

IC Socket, SIP29, 29 Contact(s),

KSS029-811GT规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
Objectid1622691951
Reach Compliance Codecompliant
ECCN代码EAR99
其他特性SIP SOCKET
联系完成配合TIN LEAD OVER NICKEL
联系完成终止Gold (Au) - with Nickel (Ni) barrier
触点材料BERYLLIUM COPPER
设备插槽类型IC SOCKET
使用的设备类型SIP29
外壳材料POLYIMIDE
JESD-609代码e4
触点数29

文档预览

下载PDF文档
SIP Sockets
Table of Models
SIP Sockets
Molded and Peel-A-Way Insulators
Description:
Peel-A-Way
®
Strips (KSS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
®
.005 Typ.
(.13)
Description:
Molded Snap Strips (HSS/HLSS)
Mat’l: Glass Filled Thermoplastic (PPS)
Index: -60°C to 220°C (-76°F to 428°F)
.030 Typ.
(.76)
.095 Typ.
(2.41)
.095 Typ.
(2.41)
Features:
• Available in three body types:
Peel-A-Way
®
Removable Terminal
Carriers, molded Solid Strips, and
molded Snap Strips [breakable at
.100/(2.54mm)].
• Tapered entry for ease of
insertion.
• Multi-finger contacts for reliability.
• Closed bottom sleeve for 100%
anti-wicking of solder.
• Custom configurations available.
Description:
Molded Solid Strips (RNB, RLNB)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
Head Above
Plastic
.030 Typ.
(.76)
Head Flush
with Plastic
.095 Typ.
(2.41)
.095 Typ.
(2.41)
HSS/HLSS replaces RSS/RLSS and SS/LSS. RNB/RLNB replaces HNB/HLNB and NB/LNB.
Head Above
Plastic
Head Flush
with Plastic
Options
• Removable tape seal protects plated contact in harsh environments.
Tape Seal - add 3M to end of part number
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
• Material - Silicone Backed Polyimide Film, -74°C to 260°C (-100°F
to 500°F) Intermittent to 371°C (700°F)
• Spray flux without contaminating contact area.
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers.
Dimensional Information
Molded
Body Types
.100 Typ.
(2.54)
.100
(2.54)
A
.095
A Dimension = number of pins X .100/(2.54)
.100
(2.54)
Peel-A-Way
®
Body Types
.100 Typ.
(2.54)
A
A Dimension = [number of pins X .100/(2.54)] + .200/(5.08)
How To Order
KSS
Body Type
RoHS Compliant:
032
-85
M
G
Contact Plating
RoHS Compliant:
KSS - Peel-A-Way
RNB - Molded Solid (head above)
RLNB - Molded Solid (head flush)
HSS* - Molded Snap (head above)
HLSS* - Molded Snap (head flush)
Number of Pins
KSS: 2-100 pos.
HSS/HLSS: 20, 30 or 32 pos.
RNB/RLNB: 3-20, 30 or 32 pos.
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16A
*PSS Insulators (HSS/HLSS) are not suitable for high temperature, lead-free (RoHS) solder profiles.
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
請問WCE Application做出來的軟件,為何在wince下無法拖曳視窗
請問WCE Application做出來的軟件,為何在wince下無法拖曳視窗 ???還是有什麼方法可以做到拖曳視窗...
sucuiqin 嵌入式系统
请教下为什么我一按外中断按钮系统就复位
请教下为什么我一按外中断按钮系统就复位 ...
simonprince 单片机
关于allegro pcb中的封装问题。
例如实际中需要画一块8层的PCB板子(TOP GND ART03 POWER GND ART06 GND BOT),在画插件封装时,焊盘的各层的参数设置中,是否需要设置除DEFAULT INTERNALR外再加上"GND ART03 POWER GND ART06 ......
feaven PCB设计
太阳能跟随系统
效果: 系统启动后,太阳板,会左右旋转寻找太阳的中心位置。当太阳板正对太阳之后,停止。随着时间推移,太阳板会自动跟随旋转,始终保持与光线垂直角度。遇到阴天或者夜晚,太阳板会旋 ......
victorlee1988 能源基础设施
Wi-Fi6已到,细数设计上的两大挑战
科技一直在进步,所以Wi-Fi 6来了。与前几代Wi-Fi 标准相比,Wi-Fi 6纳入很多新的技术。Wi-Fi 6无论是带宽、频段和天线等多个方面都迎来了重大的升级,著名的手机生产厂家Samsung、LG、Huawei、 ......
alan000345 无线连接
采用低成本FPGA 构建IP 监视摄像系统
519510 ...
至芯科技FPGA大牛 FPGA/CPLD

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 620  2440  2861  2397  2307  13  50  58  49  47 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved