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MAX307CPI+

产品描述multiplexer switch ics 8:1 2ch precision
产品类别模拟混合信号IC    信号电路   
文件大小1MB,共12页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
标准
下载文档 详细参数 选型对比 全文预览

MAX307CPI+概述

multiplexer switch ics 8:1 2ch precision

MAX307CPI+规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Maxim(美信半导体)
零件包装代码DIP
包装说明DIP, DIP28,.6
针数28
Reach Compliance Codecompli
ECCN代码EAR99
Factory Lead Time6 weeks
Samacsys DescriptiMAX307CPI+, Multiplexer Dual 8:1, 12 V, 15 V, 18 V, 24 V, 28 V, 5 V, 9 V, 28-Pin, PDIP, 2
其他特性CONFIGURABLE AS 16-CHANNEL SINGLE ENDED MUX
模拟集成电路 - 其他类型DIFFERENTIAL MULTIPLEXER
JESD-30 代码R-PDIP-T28
JESD-609代码e3
长度36.83 mm
湿度敏感等级1
负电源电压最大值(Vsup)-20 V
负电源电压最小值(Vsup)-4.5 V
标称负供电电压 (Vsup)-15 V
信道数量8
功能数量1
端子数量28
标称断态隔离度69 dB
通态电阻匹配规范1.5 Ω
最大通态电阻 (Ron)100 Ω
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP28,.6
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)260
电源12/+-15 V
认证状态Not Qualified
座面最大高度5.08 mm
最大信号电流0.03 A
最大供电电压 (Vsup)20 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)15 V
表面贴装NO
最长断开时间150 ns
最长接通时间200 ns
切换BREAK-BEFORE-MAKE
技术CMOS
温度等级COMMERCIAL
端子面层Tin (Sn)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度15.24 mm

文档预览

下载PDF文档
MAX306/MAX307
Precision, 16-Channel/Dual 8-Channel,
High-Performance, CMOS Analog Multiplexers
General Description
The MAX306/MAX307 precision, monolithic, CMOS ana-
log multiplexers (muxes) offer low on-resistance (less
than 100Ω), which is matched to within 5Ω between
channels and remains flat over the specified analog sig-
nal range (7Ω, max). They also offer low leakage over
temperature (I
NO(OFF)
less than 2.5nA at +85°C) and fast
switching speeds (t
TRANS
less than 250ns). The MAX306
is a single-ended 1-of-16 device, and the MAX307 is a
differential 2-of-8 device.
The MAX306/MAX307 are fabricated with Maxim’s
improved 44V silicon-gate process. Design improvements
yield extremely low charge injection (less than 10pC) and
guarantee electrostatic discharge (ESD) protection greater
than 2000V.
These muxes operate with a single +5V to +30V supply,
or bipolar ±4.5V to ±20V supplies, while retaining TTL/
CMOS-logic input compatibility and fast switching. CMOS
inputs provide reduced input loading. These improved
parts are plug-in upgrades for the industrystandard
DG406, DG407, DG506A, and DG507A.
Features
● Guaranteed On-Resistance Match Between
Channels, < 5Ω Max
● Low On-Resistance, < 100Ω Max
● Guaranteed Flat On-Resistance Over Specified
Signal Range, 7Ω Max
● Guaranteed Charge Injection, < 10pC
I
NO(OFF)
Leakage < 2.5nA at +85°C
I
COM(OFF)
Leakage < 20nA at +85°C
● ESD Protection > 2000V
● Plug-In Upgrade for Industry-Standard
DG406/DG407/DG506A/DG507A
● Single-Supply Operation (+5V to +30V)
Bipolar-Supply Operation (±4.5V to ±20V)
● Low Power Consumption, < 1.25mW
● Rail-to-Rail Signal Handling
● TTL/CMOS-Logic Compatible
Ordering Information
PART
MAX306CPI
MAX306CWI
MAX306C/D
MAX306EPI
MAX306EWI
MAX306EQI
MAX306EUI
MAX306MJI
TEMP RANGE
0°C to +70°C
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-55°C to +125°C
PIN-PACKAGE
28 PDIP
28 Wide SO
Dice*
28 PDIP
28 Wide SO
28 PLCC
28 TSSOP
28 CERDIP
Applications
● Sample-and-Hold Circuits
● Test Equipment
● Heads-Up Displays
● Guidance and Control
Systems
● Military Radios
● Communications Systems
● Battery-Operated Sys-
tems PBX, PABX
● Audio Signal Routing
Ordering Information continued at end of data sheet.
*Contact factory for dice specifications.
Pin Configurations/Functional Diagrams/Truth Tables
TOP VIEW
V+ 1
N.C. 2
N.C. 3
NO16 4
NO15 5
NO14 6
NO13 7
NO12 8
NO11 9
NO10 10
NO9 11
GND 12
N.C. 13
A3 14
28 COM
27 V-
26 NO8
25 NO7
24 NO6
A3
X
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
A2
X
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
A1
X
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
A0
X
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
EN
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
None
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MAX306
23 NO5
22 NO4
21 NO3
20 NO2
19 NO1
18 EN
17 A0
16 A1
15 A2
MAX306
LOGIC “0” V
AL
0.8V, LOGIC “1” = V
AH
2.4V
PDIP/SO/TSSOP
Pin Configurations/Functional Diagrams/Truth Tables
continued at end of data sheet.
19-0270; Rev 5; 5/14

MAX307CPI+相似产品对比

MAX307CPI+ MAX307EUI+ MAX307CWI+ MAX306EPI+ MAX306CWI+ MAX307EPI+ MAX306EUI+ MAX307EWI+ PT7V4050TACCB32.000/20.480
描述 multiplexer switch ics 8:1 2ch precision multiplexer switch ics 8:1 2ch precision multiplexer switch ics 8:1 2ch precision multiplexer switch ics 16:1 precision multiplexer switch ics 16:1 precision multiplexer switch ics 8:1 2ch precision multiplexer switch ics 16:1 precision multiplexer switch ics 8:1 2ch precision PLL/Frequency Synthesis Circuit,
包装说明 DIP, DIP28,.6 TSSOP, TSSOP28,.25 SOP, SOP28,.4 DIP, DIP28,.6 SOP, SOP28,.4 DIP, TSSOP, TSSOP28,.25 SOP, SOP28,.4 ,
Reach Compliance Code compli compli compli compliant compli compli compliant compli unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 -
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 -
厂商名称 Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) - Maxim(美信半导体) Maxim(美信半导体) -
零件包装代码 DIP TSSOP SOIC DIP SOIC DIP TSSOP SOIC -
针数 28 28 28 28 28 28 28 28 -
Factory Lead Time 6 weeks 6 weeks 9 weeks 6 weeks 6 weeks 6 weeks 6 weeks 6 weeks -
模拟集成电路 - 其他类型 DIFFERENTIAL MULTIPLEXER DIFFERENTIAL MULTIPLEXER DIFFERENTIAL MULTIPLEXER SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER SINGLE-ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER -
JESD-30 代码 R-PDIP-T28 R-PDSO-G28 R-PDSO-G28 R-PDIP-T28 R-PDSO-G28 R-PDIP-T28 R-PDSO-G28 R-PDSO-G28 -
JESD-609代码 e3 e3 e3 e3 e3 e3 e3 e3 -
长度 36.83 mm 9.7 mm 17.9 mm 36.83 mm 17.9 mm 36.83 mm 9.7 mm 17.9 mm -
湿度敏感等级 1 1 1 1 1 1 1 1 -
负电源电压最大值(Vsup) -20 V -20 V -20 V -20 V -20 V -20 V -20 V -20 V -
负电源电压最小值(Vsup) -4.5 V -4.5 V -4.5 V -4.5 V -4.5 V -4.5 V -4.5 V -4.5 V -
标称负供电电压 (Vsup) -15 V -15 V -15 V -15 V -15 V -15 V -15 V -15 V -
信道数量 8 8 8 16 16 8 16 8 -
功能数量 1 1 1 1 1 1 1 1 -
端子数量 28 28 28 28 28 28 28 28 -
标称断态隔离度 69 dB 69 dB 69 dB 69 dB 69 dB 69 dB 69 dB 69 dB -
通态电阻匹配规范 1.5 Ω 1.5 Ω 1.5 Ω 1.5 Ω 1.5 Ω 1.5 Ω 1.5 Ω 1.5 Ω -
最大通态电阻 (Ron) 100 Ω 100 Ω 100 Ω 100 Ω 100 Ω 100 Ω 100 Ω 100 Ω -
最高工作温度 70 °C 85 °C 70 °C 85 °C 70 °C 85 °C 85 °C 85 °C -
最低工作温度 - -40 °C - -40 °C - -40 °C -40 °C -40 °C -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 DIP TSSOP SOP DIP SOP DIP TSSOP SOP -
封装等效代码 DIP28,.6 TSSOP28,.25 SOP28,.4 DIP28,.6 SOP28,.4 - TSSOP28,.25 SOP28,.4 -
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
封装形式 IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE -
峰值回流温度(摄氏度) 260 260 260 260 260 260 260 260 -
电源 12/+-15 V 12/+-15 V 12/+-15 V 12/+-15 V 12/+-15 V - 12/+-15 V 12/+-15 V -
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
座面最大高度 5.08 mm 1.1 mm 2.65 mm 5.08 mm 2.65 mm 5.08 mm 1.1 mm 2.65 mm -
最大信号电流 0.03 A 0.03 A 0.03 A 0.03 A 0.03 A - 0.03 A 0.03 A -
最大供电电压 (Vsup) 20 V 20 V 20 V 20 V 20 V 20 V 20 V 20 V -
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V -
标称供电电压 (Vsup) 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V -
表面贴装 NO YES YES NO YES NO YES YES -
最长断开时间 150 ns 150 ns 150 ns 150 ns 150 ns 150 ns 150 ns 150 ns -
最长接通时间 200 ns 200 ns 200 ns 200 ns 200 ns 200 ns 200 ns 200 ns -
切换 BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE - BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE -
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS -
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL -
端子面层 Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Tin (Sn) Matte Tin (Sn) TIN Matte Tin (Sn) Matte Tin (Sn) -
端子形式 THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING GULL WING -
端子节距 2.54 mm 0.65 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 0.65 mm 1.27 mm -
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL -
处于峰值回流温度下的最长时间 30 30 30 NOT SPECIFIED 30 NOT SPECIFIED 30 30 -
宽度 15.24 mm 4.4 mm 7.5 mm 15.24 mm 7.5 mm 15.24 mm 4.4 mm 7.5 mm -

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