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MAX9175EUB+T

产品描述lvds interface IC 670mhz lvds->lvds & X->lvds 1:2 splitter
产品类别逻辑    逻辑   
文件大小820KB,共14页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
标准
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MAX9175EUB+T概述

lvds interface IC 670mhz lvds->lvds & X->lvds 1:2 splitter

MAX9175EUB+T规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Maxim(美信半导体)
零件包装代码TSSOP
包装说明TSSOP,
针数10
Reach Compliance Codecompli
ECCN代码EAR99
Factory Lead Time6 weeks
Samacsys DescriptiLVDS Interface IC 670MHz LVDS-to-LVDS and Anything-to-LVDS 1:2 Splitters
输入调节DIFFERENTIAL
JESD-30 代码S-PDSO-G10
JESD-609代码e3
长度3 mm
逻辑集成电路类型CLOCK DRIVER
湿度敏感等级1
功能数量1
反相输出次数
端子数量10
实输出次数2
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装形状SQUARE
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)260
传播延迟(tpd)3.23 ns
认证状态Not Qualified
Same Edge Skew-Max(tskwd)0.045 ns
座面最大高度1.1 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度3 mm

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19-2827; Rev 1; 4/04
670MHz LVDS-to-LVDS and Anything-to-LVDS
1:2 Splitters
General Description
The MAX9174/MAX9175 are 670MHz, low-jitter, low-
skew 1:2 splitters ideal for protection switching, loop-
back, and clock and signal distribution. The devices
feature ultra-low 1.0ps
(RMS)
random jitter (max) that
ensures reliable operation in high-speed links that are
highly sensitive to timing errors.
The MAX9174 has a fail-safe LVDS input and LVDS out-
puts. The MAX9175 has an anything differential input
(CML/LVDS/LVPECL) and LVDS outputs. The outputs
can be put into high impedance using the power-down
inputs. The MAX9174 features a fail-safe circuit that dri-
ves the outputs high when the input is open, undriven
and shorted, or undriven and terminated. The MAX9175
has a bias circuit that forces the outputs high when the
input is open. The power-down inputs are compatible
with standard LVTTL/LVCMOS logic. The power-down
inputs tolerate undershoot of -1V and overshoot of V
CC
+ 1V. The MAX9174/MAX9175 are available in 10-pin
µMAX and 10-lead thin QFN with exposed pad pack-
ages, and operate from a single +3.3V supply over the
-40°C to +85°C temperature range.
1.0ps
(RMS)
Jitter (max) at 670MHz
80ps
(P-P)
Jitter (max) at 800Mbps Data Rate
+3.3V Supply
LVDS Fail-Safe Inputs (MAX9174)
Anything Input (MAX9175) Accepts Differential
CML/LVDS/LVPECL
Power-Down Inputs Tolerate -1.0V and V
CC
+ 1.0V
Low-Power CMOS Design
10-Lead µMAX and Thin QFN Packages
-40°C to +85°C Operating Temperature Range
Conform to ANSI TIA/EIA-644 LVDS Standard
IEC 61000-4-2 Level 4 ESD Rating
Features
MAX9174/MAX9175
Ordering Information
PART
MAX9174EUB
MAX9174ETB*
MAX9175EUB
MAX9175ETB*
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
10 µMAX
10 Thin QFN-EP**
10 µMAX
10 Thin QFN-EP**
Applications
Protection Switching
Loopback
Clock Distribution
Functional Diagram and Pin Configurations appear at end
of data sheet.
*Future
product—contact factory for availability.
**EP
= Exposed paddle.
Typical Application Circuit
CLOCK DISTRIBUTION
ASIC
MAX9174
MAX9176
CLK IN
CLK1
ASIC
MAX9174
MAX9176
CLK IN
CLK2
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX9175EUB+T相似产品对比

MAX9175EUB+T LHL10683J MAX9174EUB+T
描述 lvds interface IC 670mhz lvds->lvds & X->lvds 1:2 splitter RADIAL LEADED INDUCTORS lvds interface IC 670mhz lvds-to-lvds & X-lvds 1:2 split
是否无铅 不含铅 - 不含铅
是否Rohs认证 符合 - 符合
厂商名称 Maxim(美信半导体) - Maxim(美信半导体)
零件包装代码 TSSOP - TSSOP
包装说明 TSSOP, - TSSOP,
针数 10 - 10
Reach Compliance Code compli - compliant
ECCN代码 EAR99 - EAR99
Factory Lead Time 6 weeks - 6 weeks
输入调节 DIFFERENTIAL - DIFFERENTIAL
JESD-30 代码 S-PDSO-G10 - S-PDSO-G10
JESD-609代码 e3 - e3
长度 3 mm - 3 mm
逻辑集成电路类型 CLOCK DRIVER - LOW SKEW CLOCK DRIVER
湿度敏感等级 1 - 1
功能数量 1 - 1
端子数量 10 - 10
实输出次数 2 - 2
最高工作温度 85 °C - 85 °C
最低工作温度 -40 °C - -40 °C
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 TSSOP - TSSOP
封装形状 SQUARE - SQUARE
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 260 - 260
传播延迟(tpd) 3.23 ns - 3.23 ns
认证状态 Not Qualified - Not Qualified
Same Edge Skew-Max(tskwd) 0.045 ns - 0.045 ns
座面最大高度 1.1 mm - 1.1 mm
最大供电电压 (Vsup) 3.6 V - 3.6 V
最小供电电压 (Vsup) 3 V - 3 V
标称供电电压 (Vsup) 3.3 V - 3.3 V
表面贴装 YES - YES
技术 CMOS - CMOS
温度等级 INDUSTRIAL - INDUSTRIAL
端子面层 Matte Tin (Sn) - Matte Tin (Sn)
端子形式 GULL WING - GULL WING
端子节距 0.5 mm - 0.5 mm
端子位置 DUAL - DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED - NOT SPECIFIED
宽度 3 mm - 3 mm

 
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