analog to digital converters - adc 12-bit 8ch 300ksps 3.6V precision adc
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOIC |
| 包装说明 | SSOP, SSOP16,.25 |
| 针数 | 16 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 1.26 V |
| 最小模拟输入电压 | -1.24 V |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e3 |
| 长度 | 4.89 mm |
| 最大线性误差 (EL) | 0.0244% |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 8 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出位码 | BINARY, 2'S COMPLEMENT BINARY |
| 输出格式 | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/3.3 V |
| 认证状态 | Not Qualified |
| 采样速率 | 0.3 MHz |
| 采样并保持/跟踪并保持 | TRACK |
| 座面最大高度 | 1.75 mm |
| 标称供电电压 | 2.7 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.9 mm |
| Base Number Matches | 1 |
| MAX1227BCEE+T | MAX1231BCEG+T | MAX1231BCTI+T | MAX1231BCEG+ | MAX1231BETI+T | |
|---|---|---|---|---|---|
| 描述 | analog to digital converters - adc 12-bit 8ch 300ksps 3.6V precision adc | analog to digital converters - adc 12-bit 16ch 300ksps 3.6V precision adc | analog to digital converters - adc 12-bit 16ch 300ksps 3.6V precision adc | analog to digital converters - adc 12-bit 16ch 300ksps 3.6V precision adc | analog to digital converters - adc 12-bit 16ch 300ksps 3.6V precision adc |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | QFN | SOIC | QFN |
| 包装说明 | SSOP, SSOP16,.25 | SSOP, SSOP24,.24 | HVQCCN, LCC28,.2SQ,20 | SSOP, SSOP24,.24 | HVQCCN, LCC28,.2SQ,20 |
| 针数 | 16 | 24 | 28 | 24 | 28 |
| Reach Compliance Code | compli | compli | compli | compli | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 1.26 V | 1.26 V | 1.26 V | 1.26 V | 1.26 V |
| 最小模拟输入电压 | -1.24 V | -1.24 V | -1.24 V | -1.24 V | -1.24 V |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G24 | S-XQCC-N28 | R-PDSO-G24 | S-XQCC-N28 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 4.89 mm | 8.65 mm | 5 mm | 8.65 mm | 5 mm |
| 最大线性误差 (EL) | 0.0244% | 0.0244% | 0.0244% | 0.0244% | 0.0244% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 模拟输入通道数量 | 8 | 16 | 16 | 16 | 16 |
| 位数 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 24 | 28 | 24 | 28 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| 输出位码 | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | SSOP | SSOP | HVQCCN | SSOP | HVQCCN |
| 封装等效代码 | SSOP16,.25 | SSOP24,.24 | LCC28,.2SQ,20 | SSOP24,.24 | LCC28,.2SQ,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | NOT SPECIFIED | 260 |
| 电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 0.3 MHz | 0.3 MHz | 0.3 MHz | 0.3 MHz | 0.3 MHz |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | 1.75 mm | 1.75 mm | 0.8 mm | 1.75 mm | 0.8 mm |
| 标称供电电压 | 2.7 V | 2.7 V | 2.7 V | 3 V | 2.7 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | NO LEAD | GULL WING | NO LEAD |
| 端子节距 | 0.635 mm | 0.635 mm | 0.5 mm | 0.635 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.9 mm | 3.9 mm | 5 mm | 3.9 mm | 5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
| Factory Lead Time | - | 6 weeks | 17 weeks | 17 weeks | 9 weeks |
stm32/stm8
嵌入式系统
嵌入式系统
嵌入式系统
RF/无线
PCB设计
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
