TAZ Series
CWR29 - MIL-PRF-55365/11
Fully qualified to MIL-PRF-55365/4, this series represents the most flexible of surface mount form fac-
tors, offering eight case sizes (A through H). This series is fully interchangeable with CWR06 conformal
types, while offering the advantages of molded body/compliant termination construction, polarity and
capacitance. The molded construction is compatible with a wide range of SMT board assembly
processes including wave or reflow solder, conductive epoxy or compression bonding techniques. The
five smaller cases are characterized by their low profile construction, with the A case being the world’s
smallest molded military tantalum. There are three termination finishes available: fused solder plated
(“K” per MIL-PRF-55365), hot solder dipped (“C”) and gold plated (“B”). In addition, the molding com-
pound has been selected to meet the requirements of UL94V-0 and outgassing requirements of NASA
SP-R-0022A.
Check for up-to-date CV Tables at
http://www.avx.com/docs/catalogs/taz.pdf
HOW TO ORDER
CWR09
Tantalum
Surface Mount
J
Voltage
Code
C = 4Vdc
D = 6Vdc
F = 10Vdc
H = 15Vdc
J = 20Vdc
K = 25Vdc
M = 35Vdc
N = 50Vdc
^
Termination
Finish
K = Solder Fused
C = Hot Solder
Dipped
B = Gold Plated
225
Capacitance
Code
pF code:
1st two digits
represent
significant
figures 3rd digit
represents
multiplier
(number of zeros
to follow)
*
Capacitance
Tolerance
M = ±20%
K = ±10%
J = ±5%
@
Reliability
Grade
Weibull: B =
0.1%/1000 Hrs.
(90% C =
0.01%/1000
Hrs. conf.)
Comm: Z =
Non ER
+
Surge Test
Option
A = 10 cycles,
+25°C
B = 10 cycles,
-55°C &
+85°C
C = 10 cycles,
-55°C &
+85°C
before
Weibull
Packaging
Bulk = Standard
\TR = 7" T&R
\TR13 = 13" T&R
\W = Waffle
Type
Capacitance
µF
Code
0.10
104
0.15
154
0.22
224
0.33
334
0.47
474
0.68
684
1.0
105
1.5
155
2.2
225
3.3
335
4.7
475
6.8
685
10
106
15
156
22
226
33
336
47
476
68
686
100
107
150
157
220
227
330
337
4V (C)
6V (D)
10V (F)
Rated voltage DC (V
R
) at 85ºC
15V (H)
20V (J)
25V (K)
35V (M)
A
A
A
A
A/B
A/C
B/D
B/E
B/D
D/E/F
E
E/G
F/H
G
G
H
A/B
A/C
B/D
B/E
B/D/E
D/E/F
E
F/G
F/G/H
G
G
H
H
A/B
A/C
B/C/D
B/C/D/E
B/C/D/E
D/E/F
E
F/G
F/G/H
G
G/H
H/X
H
A
A
A/B
A/C
B/D
B/C/D/E
D/E
D/E/F
E/F
F/G
F/G/H
G/H
G/H
H
A
A/B
A/B
B/C
B/D
D/E
E
E/F
E/F
F/G
G/H
H
H/X
A
A
B
B/C
D
D/E
E
F
F/G
G
G/H
G/H/X
H/X
A
A
B
C
D
E
F
G
G/H
H
X
50V (N)
A
A
B
B
C
D
E
F
F
G
H
46
嵌入式系统
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