instrumentation amplifiers 3V/5V single-supply rail-rail
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP8,.25 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| Samacsys Descripti | Maxim MAX4460ESA+ Instrumentation Amplifier, ±425μV Offset 2.5MHz GBW, CMMR 120dB, 2.85 → 5.25 V, 8-Pin SOIC |
| 放大器类型 | INSTRUMENTATION AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.0001 µA |
| 标称带宽 (3dB) | 2.5 MHz |
| 最小共模抑制比 | 80 dB |
| 最大输入失调电压 | 950 µV |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 4.9 mm |
| 湿度敏感等级 | 1 |
| 标称负供电电压 (Vsup) | |
| 最大非线性 | 0.25% |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 标称压摆率 | 0.5 V/us |
| 最大压摆率 | 1.1 mA |
| 供电电压上限 | 6 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 最大电压增益 | 100 |
| 最小电压增益 | 1 |
| 标称电压增益 | 10 |
| 宽度 | 3.9 mm |

| MAX4460ESA+ | MAX4462HESA+ | MAX4461UESA+ | MAX4461TESA+T | MAX4462TETT+T | MAX4462HETT+T | MAX4461TETT+T | MAX4461UESA+T | MAX4460ESA+T | MAX4460ETT+T | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | instrumentation amplifiers 3V/5V single-supply rail-rail | instrumentation amplifiers 3V/5V single-supply rail-rail | instrumentation amplifiers 3V/5V single-supply rail-rail | instrumentation amplifiers 3V/5V single-supply rail-rail | instrumentation amplifiers 3V/5V single-supply rail-rail | instrumentation amplifiers 3V/5V single-supply rail-rail | instrumentation amplifiers 3V/5V single-supply rail-rail | instrumentation amplifiers 3V/5V single-supply rail-rail | instrumentation amplifiers 3V/5V single-supply rail-rail | instrumentation amplifiers 3V/5V single-supply rail-rail |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SON | SON | SON | SOIC | SOIC | SON |
| 包装说明 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, | SOP, | HVSON, SOLCC6,.12,38 | HVSON, SOLCC6,.12,38 | HVSON, SOLCC6,.12,38 | 0.150 INCH, MS-012AA, SOIC-8 | SOP, SOP8,.25 | HVSON, SOLCC6,.12,38 |
| 针数 | 8 | 8 | 8 | 8 | 6 | 6 | 6 | 8 | 8 | 6 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | INSTRUMENTATION AMPLIFIER | INSTRUMENTATION AMPLIFIER | INSTRUMENTATION AMPLIFIER | INSTRUMENTATION AMPLIFIER | INSTRUMENTATION AMPLIFIER | INSTRUMENTATION AMPLIFIER | INSTRUMENTATION AMPLIFIER | INSTRUMENTATION AMPLIFIER | INSTRUMENTATION AMPLIFIER | INSTRUMENTATION AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.0001 µA | 0.0001 µA | 0.0001 µA | 0.0001 µA | 0.0001 µA | 0.0001 µA | 0.0001 µA | 0.0001 µA | 0.0001 µA | 0.0001 µA |
| 标称带宽 (3dB) | 2.5 MHz | 0.025 MHz | 2.5 MHz | 2.5 MHz | 2.5 MHz | 2.5 MHz | 2.5 MHz | 2.5 MHz | 2.5 MHz | 2.5 MHz |
| 最小共模抑制比 | 80 dB | 80 dB | 80 dB | 80 dB | 80 dB | 80 dB | 80 dB | 80 dB | 80 dB | 80 dB |
| 最大输入失调电压 | 950 µV | 750 µV | 950 µV | 950 µV | 1300 µV | 1300 µV | 1900 µV | 950 µV | 950 µV | 1900 µV |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-XDSO-N6 | S-XDSO-N6 | S-XDSO-N6 | R-PDSO-G8 | R-PDSO-G8 | S-XDSO-N6 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 3 mm | 3 mm | 3 mm | 4.9 mm | 4.9 mm | 3 mm |
| 最大非线性 | 0.25% | 0.25% | 0.25% | 0.25% | 0.25% | 0.25% | 0.25% | 0.25% | 0.25% | 0.25% |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 6 | 6 | 6 | 8 | 8 | 6 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | SOP | SOP | SOP | SOP | HVSON | HVSON | HVSON | SOP | SOP | HVSON |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 0.8 mm | 0.8 mm | 0.8 mm | 1.75 mm | 1.75 mm | 0.8 mm |
| 标称压摆率 | 0.5 V/us | 0.25 V/us | 0.5 V/us | 0.5 V/us | 0.5 V/us | 0.5 V/us | 0.5 V/us | 0.5 V/us | 0.5 V/us | 0.5 V/us |
| 供电电压上限 | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 3 V | 5 V | 5 V | 5 V | 3 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | MATTE TIN | MATTE TIN | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.95 mm | 0.95 mm | 0.95 mm | 1.27 mm | 1.27 mm | 0.95 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 |
| 标称电压增益 | 10 | 100 | 1 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3 mm | 3 mm | 3 mm | 3.9 mm | 3.9 mm | 3 mm |
| Factory Lead Time | 6 weeks | 6 weeks | - | 12 weeks | 12 weeks | - | 1 week | - | 6 weeks | 9 weeks |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 封装等效代码 | SOP8,.25 | SOP8,.25 | - | - | SOLCC6,.12,38 | SOLCC6,.12,38 | SOLCC6,.12,38 | - | SOP8,.25 | SOLCC6,.12,38 |
| 电源 | 3/5 V | 3/5 V | - | - | 3/5 V | 3/5 V | 3/5 V | - | 3/5 V | 3/5 V |
| 最大压摆率 | 1.1 mA | 1 mA | - | - | 1.1 mA | 1.1 mA | 1.1 mA | - | 1.1 mA | 1.1 mA |
| 最大电压增益 | 100 | - | - | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| 最小电压增益 | 1 | - | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Base Number Matches | - | - | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved