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MAX3863ETJ+

产品描述laser drivers 2.7gbps laser driver w/modulation comp
产品类别模拟混合信号IC    驱动程序和接口   
文件大小398KB,共15页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
标准
下载文档 详细参数 选型对比 全文预览

MAX3863ETJ+概述

laser drivers 2.7gbps laser driver w/modulation comp

MAX3863ETJ+规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Maxim(美信半导体)
零件包装代码QFN
包装说明HVQCCN, LCC32,.2SQ,20
针数32
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time1 week
接口集成电路类型INTERFACE CIRCUIT
JESD-30 代码S-XQCC-N32
JESD-609代码e3
长度5 mm
湿度敏感等级1
功能数量1
端子数量32
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料UNSPECIFIED
封装代码HVQCCN
封装等效代码LCC32,.2SQ,20
封装形状SQUARE
封装形式CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)260
电源3.3 V
认证状态Not Qualified
座面最大高度0.8 mm
最大供电电压3.6 V
最小供电电压3.15 V
标称供电电压3.3 V
表面贴装YES
技术BIPOLAR
温度等级INDUSTRIAL
端子面层Tin (Sn)
端子形式NO LEAD
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度5 mm
Base Number Matches1

文档预览

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19-2281; Rev 4; 11/08
2.7Gbps Laser Driver with Modulation
Compensation
General Description
The MAX3863 is designed for direct modulation of laser
diodes at data rates up to 2.7Gbps. An automatic
power-control (APC) loop is incorporated to maintain a
constant average optical power. Modulation compensa-
tion is available to increase the modulation current in
proportion to the bias current. The optical extinction
ratio is then maintained over temperature and lifetime.
The laser driver can modulate laser diodes at ampli-
tudes up to 80mA. Typical (20% to 80%) edge speeds
are 50ps. The MAX3863 can supply a bias current up
to 100mA. External resistors can set the laser output
levels.
The MAX3863 includes adjustable pulse-width control
to minimize laser pulse-width distortion. The device
offers a failure monitor output to indicate when the APC
loop is unable to maintain the average optical power.
The MAX3863 accepts differential CML clock and data
input signals with on-chip 50Ω termination resistors. If a
clock signal is available, an input data-retiming latch
can be used to reject input pattern-dependent jitter.
The laser driver is fabricated with Maxim’s in-house
second-generation SiGe process.
Features
Single +3.3V Power Supply
58mA Power-Supply Current
Up to 2.7Gbps (NRZ) Operation
On-Chip Termination Resistors
Automatic Power Control (APC)
Compensation for Constant Extinction Ratio
Programmable Modulation Current Up to 80mA
Programmable Bias Current Up to 100mA
50ps Typical Rise/Fall Time
Pulse-Width Adjustment Circuit
Selectable Data-Retiming Latch
Failure Detector
Mark-Density Monitor
Current Monitors
ESD Protection
MAX3863
Ordering Information
PART
MAX3863ETJ+
MAX3863EGJ
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
32 TQFN-EP*
32 QFN-EP*
+Denotes
a lead-free/RoHS-compliant package.
*EP
= Exposed pad.
Applications
30
BIASMAX
Pin Configuration
28 MODCOMP
32 RTEN
3.2Gbps Data Communications
Add/Drop Multiplexers
Digital Cross-Connects
Section Regenerators
Long-Reach Optical Transmitters
V
CC
27
V
CC
31 EN
WDM Transmission Systems
TOP VIEW
26
BIASMON
29 MODSET
25
MODMON
SONET and SDH Transmission Systems
1
2
3
4
5
6
7
8
*EP
APCFILT1 10
APCFILT2 11
PWC+ 12
PWC- 13
MK+
15
MK-
16
V
CC
14
24
23
22
MDMON
MD
V
CC
DATA+
DATA-
V
CC
V
CC
MAX3863
21
20
19
18
17
MODN
MOD
V
CC
CLK+
CLK-
V
CC
BIAS
FAIL
APCSET
9
Cs
p.
TQFN-EP
QFN-EP
*THE EXPOSED PAD MUST BE SOLDERED TO GND ON THE CIRCUIT BOARD.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

MAX3863ETJ+相似产品对比

MAX3863ETJ+ MAX3863ETJ+T
描述 laser drivers 2.7gbps laser driver w/modulation comp laser drivers 2.7gbps laser driver w/modulation comp
是否无铅 不含铅 不含铅
是否Rohs认证 符合 符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 QFN QFN
包装说明 HVQCCN, LCC32,.2SQ,20 HVQCCN, LCC32,.2SQ,20
针数 32 32
Reach Compliance Code compliant compliant
ECCN代码 EAR99 EAR99
接口集成电路类型 INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 代码 S-XQCC-N32 S-XQCC-N32
JESD-609代码 e3 e3
长度 5 mm 5 mm
湿度敏感等级 1 1
功能数量 1 1
端子数量 32 32
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
封装主体材料 UNSPECIFIED UNSPECIFIED
封装代码 HVQCCN HVQCCN
封装等效代码 LCC32,.2SQ,20 LCC32,.2SQ,20
封装形状 SQUARE SQUARE
封装形式 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度) 260 260
电源 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified
座面最大高度 0.8 mm 0.8 mm
最大供电电压 3.6 V 3.6 V
最小供电电压 3.15 V 3.15 V
标称供电电压 3.3 V 3.3 V
表面贴装 YES YES
技术 BIPOLAR BIPOLAR
温度等级 INDUSTRIAL INDUSTRIAL
端子面层 Tin (Sn) Tin (Sn)
端子形式 NO LEAD NO LEAD
端子节距 0.5 mm 0.5 mm
端子位置 QUAD QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 5 mm 5 mm
Base Number Matches 1 1

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