Freescale Semiconductor
Advance Information
Document Number: MC20XS4200
Rev. 5.0, 11/2013
Dual
24 V,
20 mOhmHigh Side
Switch
The 20XS4200 device is part of a 24 V dual high side switch product
family with integrated control, and a high number of protective and
diagnostic functions. It has been designed for truck, bus, and industrial
applications. The low R
DS(ON)
channels (<20 m) can control different
load types; bulbs, solenoids, or DC motors. Control, device
configuration, and diagnostics are performed through a 16-bit serial
peripheral interface (SPI), allowing easy integration into existing
applications. This device is powered by SMARTMOS technology
Both channels can be controlled individually by external/internal
clock signals, or by direct inputs. Using the internal clock allows fully
autonomous device operation. Programmable output voltage slew-
rates (individually programmable) helps improve electromagnetic
compatibility (EMC) performance. To avoid shutting off the device upon
inrush current, while still being able to closely track the load current, a
dynamic overcurrent threshold profile is featured. Switching current of
each channel can be sensed with a programmable sensing ratio.
Whenever communication with the external microcontroller is lost, the
device enters a Fail-safe operation mode, but remains operational,
controllable, and protected.
Features
•
•
•
•
•
•
•
•
•
Two fully-protected 20 m (@ 25 °C) high side switches
Up to 3.0 A steady-state current per channel
Separate bulb and DC motor latched overcurrent handling
Individually programmable internal/external PWM clock signals
Overcurrent, short-circuit, and overtemperature protection with
programmable autoretry functions
Accurate temperature and current sensing
OpenLoad detection (channel in OFF and ON state), also for LED
applications (7.0 mA typ.)
Normal operating range: 8.0 - 36 V, extended range: 6.0 - 58 V
3.3 V and 5.0 V compatible 16-bit SPI port for device control,
configuration and diagnostics at rates up to 8.0 MHz
V
DD
V
DD
V
PWR
20XS4200
HIGH SIDE SWITCH
FK SUFFIX (PB-FREE)
98ASA00428D
23 PIN PQFN
(12 X12 mm)
20XS4200
I/O
I/O
SCLK
CSB
SI
MCU
I/O
SO
I/O
I/O
VDD
VPWR
CLOCK
FSB
SCLK
HS0
CSB
SO
RSTB
SI
HS1
IN0
IN1
CONF0
CONF1
FSOB
SYNC
CSNS GND
LOAD
M
LOAD
GND
I/O
A/D
A/D
Figure 1. Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2012-2013. All rights reserved.
ORDERABLE PARTS
ORDERABLE PARTS
Table 1. Simplified Orderable Part VariationsTable
Orderable Part Number
MC20XS4200FK
MC20XS4200BFK
(1)
MC20XS4200BAFK
(1)
Version
–
B
(2)
BA
(2), (3)
Reverse Battery
Voltage (V)
-28 V
-32 V
Negative Clamp
Voltage (V)
-24 V
-32 V
Slew Rate
Product ID Bit
Loss of Ground
Hardware
Hardward +
Software
Standard
Accelerated
01
00
Notes
1. Recommended for all new designs
2. Version B and BA devices can support negative voltage battery and ground loss down to -32V, the overcurrent profile can be selected
by the SPI. It is no longer recommended to disable the off-state OpenLoad for the HS1 output in parallel mode, errata sheet MC24XS4ER
is no longer valid.
3. Version BA devices have faster slew rates to reduce switching losses.
20XS4200
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VDD
VPWR
I
UP
CSB
SCLK
I
DWN
SO
SI
RSTB
FSB
IN0
IN1
FSOB
CONF0
CONF1
R
DWN
I
DWN
V
DD
Failure
Detection
Internal
Regulator
V
REG
POR
Over/Undervoltage
Protections
Charge
Pump
Drain/Gate
Clamp
Selectable Slew Rate
Gate Driver
Selectable Overcurrent
Detection
Severe Short-circuit
Detection
Control
HS0
Logic
Short-circuit to
VPWR detec.
Overtemperature
Detect.
OpenLoad
Detect
HS0
I
UP
V
REG
Calibratable
Oscillator *
HS1
HS1
CLOCK
I
DWN
PWM
Module
*
Temperature
Feedback
Output
Current Sense
Analog MUX
Overtemperature
Prewarning
*blocks marked in grey have been implemented
independently for each of both channels
GND
CSNS
SYNC
Figure 2. Internal Block Diagram
20XS4200
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
TABLE OF CONTENTS
TABLE OF CONTENTS
Orderable Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Static Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Dynamic Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Assignment and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Internal Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operation and Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Commands and SPI Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Soldering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
3
5
7
7
9
16
23
26
26
26
28
29
29
44
51
53
53
53
62
20XS4200
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN ASSIGNMENT
PIN ASSIGNMENT
Transparent Top View
CSNS
IN0
IN1
FSOB
CONF0
CONF1
FSB
CLOCK
RSTB
CSB
SCLK
SI
VDD
3
4
5
6
7
8
9
10
11
12
13
16
17
18
GND
14
VPWR
15
19
HS1
20
HS0
1
2
SO
GND
VPWR
23
22
21
SYNC
GND
VPWR
PQFN Package
Figure 3. 20XS4200 Device Pin Assignments
The function of each pin is described in the section
Functional Description
Table 2. 20XS4200 Pin Description
Pin
Number
1
Pin Name
CSNS
Function
Output
Formal Name
Output Current/
Temperature
Monitoring
Definition
This pin either outputs a current proportional to the channel’s output current or
a voltage proportional to the temperature of the GND pin (pin 14). Selection
between current and temperature sensing, as well as setting the current
sensing sensitivity are performed through the SPI interface. An external pull-
down resistor must be connected between CSNS and GND.
The IN[0 : 1] input pins are used to directly control the switching state of both
switches and consequently the voltage on the HS0 : HS1 output pins. The pins
are connected to GND by internal pull-down resistors
FSOB is asserted (active-low) upon entering Fail-safe mode (see
Functional
Description)
This open-drain output requires an external pull-up resistor to
VPWR
The CONF[0 : 1] input pins are used to select the appropriate overcurrent
detection profile (bulb/DC motor) for each of both channels. CONF requires a
pull-down resistor to GND.
This open-drain output pin (external pull-up resistor to VDD required) is set
when the device enters Fault mode (see
Fault Mode)
The clock input gives the time-base when the device is operated in external
clock/internal PWM mode.
This pin has an internal pull-down current source.
This input pin is used to initialize the device’s configuration - and fault registers.
Reset puts the device in Sleep mode (low current consumption) provided it is
not stimulated by direct input signals.This pin is connected to GND by an
internal pull-down resistor.
This input pin is connected to the SPI chip-select output of an external micro-
controller. CSB is internally pulled up to V
DD
by a current source I
UP
.
2
3
4
IN0
IN1
FSOB
Input
Direct Inputs
Output
Fail-safe Output
(Active Low)
Configuration Input
5
6
7
8
CONF0
CONF1
FSB
CLOCK
Input
Output
Input
Fault Status
(Active Low)
PWM Clock
9
RSTB
Input
Reset
10
CSB
Input
Chip Select
(Active Low)
20XS4200
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
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