digital to analog converters - dac 12-bit 4ch precision dac
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP20,.3 |
| 针数 | 20 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 9 weeks |
| 最大模拟输出电压 | 5 V |
| 最小模拟输出电压 | |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY |
| 输入格式 | SERIAL |
| JESD-30 代码 | R-PDIP-T20 |
| JESD-609代码 | e3 |
| 长度 | 26.16 mm |
| 最大线性误差 (EL) | 0.0122% |
| 湿度敏感等级 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.572 mm |
| 标称安定时间 (tstl) | 12 µs |
| 最大压摆率 | 0.98 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| MAX525ACPP+ | MAX525BCAP+ | MAX525AEAP+T | MAX525BCPP+ | MAX525AEPP+ | MAX525AEAP+ | MAX525BEAP+T | |
|---|---|---|---|---|---|---|---|
| 描述 | digital to analog converters - dac 12-bit 4ch precision dac | digital to analog converters - dac 12-bit 4ch precision dac | digital to analog converters - dac 12-bit 4ch precision dac | digital to analog converters - dac 12-bit 4ch precision dac | digital to analog converters - dac 12-bit 4ch precision dac | digital to analog converters - dac 12-bit 4ch precision dac | digital to analog converters - dac 12-bit 4ch precision dac |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | DIP | SSOP | SSOP | DIP | DIP | SSOP | SSOP |
| 包装说明 | DIP, DIP20,.3 | SSOP, SSOP20,.3 | SSOP, SSOP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | SSOP, SSOP20,.3 | SSOP, SSOP20,.3 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 9 weeks | 9 weeks | 9 weeks | 6 weeks | 6 weeks | 9 weeks | 9 weeks |
| 最大模拟输出电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
| 输入格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| JESD-30 代码 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 26.16 mm | 7.2 mm | 7.2 mm | 26.16 mm | 26.16 mm | 7.2 mm | 7.2 mm |
| 最大线性误差 (EL) | 0.0122% | 0.0244% | 0.0122% | 0.0244% | 0.0122% | 0.0122% | 0.0244% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SSOP | SSOP | DIP | DIP | SSOP | SSOP |
| 封装等效代码 | DIP20,.3 | SSOP20,.3 | SSOP20,.3 | DIP20,.3 | DIP20,.3 | SSOP20,.3 | SSOP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | IN-LINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.572 mm | 1.99 mm | 1.99 mm | 4.572 mm | 4.572 mm | 1.99 mm | 1.99 mm |
| 标称安定时间 (tstl) | 12 µs | 12 µs | 12 µs | 12 µs | 12 µs | 12 µs | 12 µs |
| 最大压摆率 | 0.98 mA | 0.98 mA | 0.98 mA | 0.98 mA | 0.98 mA | 0.98 mA | 0.98 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 0.65 mm | 0.65 mm | 2.54 mm | 2.54 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 5.29 mm | 5.29 mm | 7.62 mm | 7.62 mm | 5.29 mm | 5.29 mm |
无线连接
模拟与混合信号
传感器
嵌入式系统
嵌入式系统
嵌入式系统
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
