analog switch ics phase-reversal analog switch
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| Samacsys Confidence | 3 |
| Samacsys Status | Released |
| Samacsys PartID | 1382 |
| Samacsys Pin Cou | 8 |
| Samacsys Part Category | Integrated Circui |
| Samacsys Package Category | Small Outline Packages |
| Samacsys Footprint Name | 8 SO |
| Samacsys Released Date | 2015-04-16 09:48:08 |
| Is Samacsys | N |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 4.9 mm |
| 湿度敏感等级 | 1 |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 1 |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 标称断态隔离度 | 65 dB |
| 通态电阻匹配规范 | 0.5 Ω |
| 最大通态电阻 (Ron) | 175 Ω |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | YES |
| 最长断开时间 | 0.1 ns |
| 最长接通时间 | 0.1 ns |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.9 mm |
| Base Number Matches | 1 |

| MAX4526CSA+ | MAX4527CSA+ | MAX4526EUA+ | MAX4527CPA+ | MAX4526ESA+T | MAX4527ESA+T | MAX4527EUA+T | MAX4527CUA+ | MAX4526ESA+ | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | analog switch ics phase-reversal analog switch | analog switch ics phase-reversal analog switch | analog switch ics phase-reversal analog switch | analog switch ics phase-reversal analog switch | analog switch ics phase-reversal analog switch | analog switch ics phase-reversal analog switch | analog switch ics phase-reversal analog switch | analog switch ics phase-reversal analog switch | analog switch ics phase-reversal analog switch |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | DIP | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | SOP, | SOP, SOP8,.25 | TSSOP, TSSOP8,.19 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compliant | compli | compliant | compli | compli | compli | compliant | compliant |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 4.9 mm | 4.9 mm | 3 mm | 9.375 mm | 4.9 mm | 4.9 mm | 3 mm | 3 mm | 4.9 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 标称断态隔离度 | 65 dB | 65 dB | 65 dB | 65 dB | 65 dB | 65 dB | 65 dB | 65 dB | 65 dB |
| 通态电阻匹配规范 | 0.5 Ω | 0.5 Ω | 0.5 Ω | 0.5 Ω | 0.5 Ω | 0.5 Ω | 0.5 Ω | 0.5 Ω | 0.5 Ω |
| 最大通态电阻 (Ron) | 175 Ω | 175 Ω | 175 Ω | 175 Ω | 175 Ω | 175 Ω | 175 Ω | 175 Ω | 175 Ω |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C |
| 最低工作温度 | - | - | -40 °C | - | -40 °C | -40 °C | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | TSSOP | DIP | SOP | SOP | TSSOP | TSSOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.1 mm | 4.572 mm | 1.75 mm | 1.75 mm | 1.1 mm | 1.1 mm | 1.75 mm |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | YES | YES | YES | NO | YES | YES | YES | YES | YES |
| 最长断开时间 | 0.1 ns | 0.2 ns | 0.1 ns | 0.2 ns | 0.1 ns | 0.2 ns | 0.2 ns | 0.2 ns | 0.1 ns |
| 最长接通时间 | 0.1 ns | 0.2 ns | 0.1 ns | 0.2 ns | 0.1 ns | 0.2 ns | 0.2 ns | 0.2 ns | 0.1 ns |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 0.65 mm | 2.54 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 |
| 宽度 | 3.9 mm | 3.9 mm | 3 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3 mm | 3 mm | 3.9 mm |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | - | EAR99 | EAR99 |
| Factory Lead Time | 6 weeks | 6 weeks | - | 6 weeks | 7 weeks | 7 weeks | 6 weeks | 6 weeks | 6 weeks |
| Is Samacsys | N | - | N | - | N | N | N | - | - |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 | - | 1 |
| 厂商名称 | - | Maxim(美信半导体) | - | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - |
| 封装等效代码 | - | SOP8,.25 | TSSOP8,.19 | DIP8,.3 | SOP8,.25 | SOP8,.25 | TSSOP8,.19 | TSSOP8,.19 | SOP8,.25 |
| 电源 | - | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| 切换 | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
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