电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HCHP0805K2373FBTF

产品描述Fixed Resistor, Metal Glaze/thick Film, 0.2W, 237000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP
产品类别无源元件    电阻器   
文件大小156KB,共9页
制造商Vishay(威世)
官网地址http://www.vishay.com
标准
下载文档 详细参数 全文预览

HCHP0805K2373FBTF概述

Fixed Resistor, Metal Glaze/thick Film, 0.2W, 237000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP

HCHP0805K2373FBTF规格参数

参数名称属性值
是否Rohs认证符合
Objectid145114659628
包装说明SMT, 0805
Reach Compliance Codeunknown
ECCN代码EAR99
构造Rectangular
JESD-609代码e0
安装特点SURFACE MOUNT
端子数量2
最高工作温度155 °C
最低工作温度-55 °C
封装高度0.38 mm
封装长度1.85 mm
封装形式SMT
封装宽度1.25 mm
包装方法TR, PLASTIC
额定功率耗散 (P)0.2 W
额定温度70 °C
电阻237000 Ω
电阻器类型FIXED RESISTOR
尺寸代码0805
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数100 ppm/°C
端子面层Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
端子形状WRAPAROUND
容差1%
工作电压150 V

HCHP0805K2373FBTF文档预览

CHP, HCHP
www.vishay.com
Vishay Sfernice
High Stability Resistor Chips
(< 0.25 % at Pn at 70 °C during 1000 h) Thick Film Technology
FEATURES
• CHP: standard passivated version for
industrial, professional and military applications
Available
• Robust terminations
• Large ohmic value range 0.1
to 100 M
• Tight tolerance to 0.5 %
• HCHP: for high frequency applications
• ESCC approved see CHPHR
Available
DESIGN SUPPORT TOOLS
Models
Available
click logo to get started
• High temperature (245 °C) see CHPHT
• SMD wraparound chip resistor
• Halogen-free according to IEC 61249-2-21 definition
• Withstand moisture resistance test of AEC-Q200
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
Vishay Sfernice thick film resistor chips are specially
designed to meet very stringent specifications in terms
of reliability, stability < 0.25 % at Pn at +70 °C during
1000 h, homogeneity, reproducibility and quality.
They conform to specifications NFC 83-240 and
MIL-R-55342 D.
Evaluated to ESCC 4001/026 (see CHPHR datasheet).
Sputtered Thin Film terminations, with nickel barrier, are
very convenient for high operating conditions. They can
withstand thousands of very severe thermal shocks.
B (W/A), N (W/A), and F (one face) types are for solder reflow
assembly.
G (W/A) and W (one face) types are for wire bonding, gluing
and even high temperature solder reflow.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
SIZE
RATED
POWER
Pn
W
LIMITING
ELEMENT
VOLTAGE
V
MAX. OVERLOAD RESISTANCE
TEMPERATURE UNIT
TOLERANCE
VOLTAGE
RANGE
(1)
COEFFICIENT WEIGHT
±%
V
± ppm/°C
mg
1
3
2
4
5
8
8
26
25
21
42
12
CHP0502
0.050
50
100
0.1 to 25M
0.5, 1, 2, 5
100, 200
HCHP0502 0502
CHP0505
0505
0.125
50
100
0.1 to 10M
0.5, 1, 2, 5
100, 200
HCHP0505
CHP0603
0603
0.125
50
100
0.1 to 25M
0.5, 1, 2, 5
100, 200
HCHP0603
CHP0805
(2)
0.200
150
300
0.1 to 25M
0.5, 1, 2, 5
100, 200
HCHP0805 0805
CHP1005
1005
0.250
150
300
0.1 to 50M
0.5, 1, 2, 5
100, 200
HCHP1005
CHP1206
1206
0.250
200
400
0.1 to 50M
0.5, 1, 2, 5
100, 200
HCHP1206
CHP1505
0.500
200
400
0.1 to 75M
0.5, 1, 2, 5
100, 200
HCHP1505 1505
CHP2010
2010
1.000
(3)
200
400
0.1 to 100M
0.5, 1, 2, 5
100, 200
HCHP2010
CHP1020
1020
1.000
(3)
200
400
0.1 to 10M
0.5, 1, 2, 5
100, 200
HCHP1020
CHP2208
0.750
200
400
0.1 to 100M
0.5, 1, 2, 5
100, 200
HCHP2208 2208
CHP2512
2512
2.000
(3)
250
500
0.1 to 100M
0.5, 1, 2, 5
100, 200
CHP2512
CHP1010
1010
0.500
200
400
0.1 to 25M
0.5, 1, 2, 5
100, 200
CHP1010
Notes
(1)
Shall be read in conjunction with other tables
(2)
Model CHP0805 being same size than case 0705 with same performances, only codification of CHP0805 remains
(3)
With special assembly care
Revision: 24-Jan-18
Document Number: 52023
1
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
Vishay Sfernice
DIMENSIONS
in millimeters
(F) and (W)
(B), (G), and (N)
D
C
D
C
B
B
E
A
E
A
CASE
SIZE
0502
0505
0603
0805
1005
1010
1020
1206
1505
2010
2208
2512
A
± 0.152
1.22
1.22
1.60
1.85
2.49
2.49
2.49
3.00
3.70
5.03
5.53
6.30
B
± 0.127
0.70
1.25
0.90
1.25
1.25
2.64
5.18
1.73
1.25
2.64
2.05
3.30
C
± 0.127
0.38
0.38
0.38
0.38
0.38
0.38
0.50
0.38
0.50
0.50
0.50
0.50
D
± 0.127
0.20
0.20
0.31
0.31
0.31
0.31
0.31
0.40
0.50
0.50
0.50
0.50
E
± 0.127
0.31
0.31
0.40
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
SUGGESTED LAND PATTERN
(to IPC-7351A) in millimeters
G
min.
X
max.
Z
max.
CASE SIZE
0502
0505
0603
0805
1005
1010
1020
1206
1505
2010
2208
2512
Z
max.
1.77
1.77
2.15
2.70
3.34
3.34
3.34
3.85
4.55
5.88
6.38
7.15
G
min.
0.19
0.19
0.39
0.44
1.08
1.08
1.08
1.59
2.29
3.62
4.12
4.89
X
max.
0.83
1.38
1.03
1.38
1.38
2.77
5.31
1.85
1.38
2.77
2.18
3.43
Revision: 24-Jan-18
Document Number: 52023
2
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
POWER DERATING CURVE
Rated Power (%)
100
80
60
40
20
0
Vishay Sfernice
MECHANICAL SPECIFICATIONS
Substrate
Technology
Protection
Alumina
Thick film (ruthenium oxide)
0.5
<
R
< 100 M: epoxy coating
R
0.5
:
overglaze protection
(no epoxy coating)
B (W/A):
SnPb over nickel barrier
for solder reflow
N (W/A):
SnAg over nickel barrier
for solder reflow
F (Flip Chip):
SnAg over nickel barrier
for solder reflow
W (one face) and G (W/A) type:
gold over nickel barrier
for other applications
Terminations
0
20
40
60 70 80
100
120
140 155
Ambient Temperature in °C
PACKAGING
ESD packaging available: Waffle pack and plastic tape and
reel (low conductivity). Paper tapes available on request
(ESD only).
NUMBER OF PIECES PER
WAFFLE
TAPE AND
PACK
MIN. MAX.
400
4000
100
221
140
60
100
60
60
50
5000
8 mm
4000
100
2000
2500
4000
1000
2000
8 mm
8 mm
8 mm
8 mm
8 mm
Note
• Refer to Application Note “Guidelines for Vishay
Sfernice
Resistive
and
Inductive
Components”
(www.vishay.com/doc?52029) for recommended reflow profile.
Profile #3 applies
SIZE
MOQ
TAPE
WIDTH
CLIMATIC SPECIFICATIONS
Operating temperature
range
-55 °C; +155 °C
0502
0505
0603
0805
1005
1206
1505
2010
1010
2208
1020
2512
Note
• For temperature up to 215 °C please consult Vishay Sfernice
BEST TOL. AND TCR VS. OHMIC VALUE
OHMIC VALUE
RANGE in
10
<
R
< 5M
5
<
R
< 10M
1
<
R
<
R
max.
0.1
<
R
<
R
max.
TIGHTEST
TOLERANCE
(%)
0.5 % (D)
1 % (F)
2 % (G)
5 % (J)
(1)
100
BEST
TCR
(ppm/°C)
100 (K)
100 (K)
200 (L)
200 (L)
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the
top of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay Sfernice for specific ordering
code
Tape and Reel
See Part Numbering information to get the quantity desired
by tape.
Note
(1)
Improved performance on request
CHIPS FOR HIGH FREQUENCY APPLICATIONS
The HF performance of flip chip and W/A types can be
improved on request.
Please ask for HCHP
Revision: 24-Jan-18
Document Number: 52023
3
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
TYPICAL HF PERFORMANCE OF HCHP
2.0
1.8
1.6
1.4
1.2
2.0
1
Ω
10
Ω
1.8
1.6
1.4
1.2
1
Ω
10
Ω
Vishay Sfernice
|Z|/R
|Z|/R
1.0
0.8
0.6
0.4
0.2
0
1
10
100
1000
1 MΩ
100 kΩ
10 kΩ
100
Ω
200
Ω
1.0
0.8
0.6
100
Ω
1 kΩ
200
Ω
1 kΩ
0.4
0.2
0
10 000
1
10
100
1000
1 MΩ
100 kΩ
10 kΩ
10 000
Size 0603 (W/A)
f (MHz)
Size 0603 (Flip chip)
f (MHz)
POPULAR OPTIONS
For any option it is recommended to consult Vishay Sfernice for availability first.
Option: Enlarged terminations:
0063
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat
sinks (see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film,
PRA Arrays, CHP Thick Film)
www.vishay.com/doc?53048.
Option to order: 0063 (applies to size 1206 / 1505 / 1020 / 2010 / 2512).
DIMENSIONS
(Option 0063) in millimeters
Bottom view for mounting
Uncoated
ceramic
Enlarged
termination
C
E
B
D
A
CASE
SIZE
1206
1505
2010
1020
2208
2512
A
± 0.152
3.00
3.70
5.03
2.49
5.53
6.30
B
± 0.127
1.73
1.25
2.64
5.18
2.05
3.30
C
± 0.127
0.38
0.50
0.50
0.50
0.50
0.50
D
± 0.127
0.40
0.50
0.50
0.31
0.50
0.50
E
± 0.127
1.19
1.54
2.20
0.93
2.45
2.84
Revision: 24-Jan-18
Document Number: 52023
4
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
Vishay Sfernice
SUGGESTED LAND PATTERN
(Option 0063)
G
min.
X
max.
Z
max.
CASE SIZE
1206
1505
2010
1020
2208
2512
DIMENSIONS (IN MILLIMETERS)
Z
max.
3.85
4.55
5.88
3.34
6.38
7.15
G
min.
0.50
0.50
0.50
0.50
0.50
0.50
X
max.
1.86
1.38
2.77
5.31
2.18
3.43
OPTION: MARKING
Option to order 0013:
Marking of ohmic value and tolerance:
Sizes: 0805 to 1005: 3 digits marking (according to EIA-96)
Sizes: 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)
Tolerance indicated by a color dot.
Option to order 0014:
Marking of ohmic value:
Sizes 0805 to 1005: 3 digits marking (according to EIA-96)
Sizes 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)
No standard marking available for smaller sizes.
A price adder will apply to the unit price of the parts for options 0013 and 0014.
PERFORMANCE
TESTS
Termination adhesion
Resistance to solder heat
CONDITIONS
5N for 10 s
Immersion 10 s
in Sn/Pb 60/40
at +260 °C
5 cycles
-55 °C
+155 °C
Phase A dry heat
Phase B damp heat
Phase C cold -55 °C
Phase D damp heat 5 cycles
56 days
AEC-Q200
85 °C / 85 % RH / Pn / 10
1000 h
6.25 Pr
for 2 s
1000 h at rated power
90’/30’ at +70 °C
REQUIREMENTS
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
TYPICAL VALUES
AND DRIFTS
< ± 0.1 %
< ± 0.1 %
Rapid temperature change
< ± 0.1 %
Climatic sequence
Humidity (steady state)
Moisture resistance
Short time overload
Load life
± (1 % + 0.05
)
± (1 % + 0.05
)
5 % + 0.05
± (0.25 % + 0.05
)
1000 h
± (1 % + 0.05
)
1000 h
< 0.25 %
< ± 0.2 %
< ± 0.2 %
Max. < 3 % + 0.05
< ± 0.1 %
2000 h
< 0.5 %
10 000 h
<1%
Revision: 24-Jan-18
Document Number: 52023
5
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
avr128单片机USART通信必须要用中断方式接收数据吗?
资料上讲AVR128单片机的串口通信,一般都是讲用中断方式接收数据,我想问一下能不能不用中断方式呢,我把程序改了一下,但还没有实验,请各位大侠看看,有什么问题,多多指导!!! #include ......
huaji1100 Microchip MCU
用51单片机做16×16点阵,P0、P2口接三极管控制列,用74154控制行,但总是出现闪屏
用51单片机做16×16点阵,P0、P2口接三极管控制列,用74154控制行,但总是出现闪屏,不能成功的显示整个字,没有设置三极管驱动时就可以成功显示,我不知道为什么。实际上单片机的输出电流太小 ......
xiaoyuan518 51单片机
MAX4173 或者其他的电流检测芯片哪个用过??
进来说下心的...
消防 单片机
QFN封装怎么用排针引出来呢
各位大哥,请问有没有什么器件产品可以把QFN48的封装用排针引出来的,多谢了!...
boyhaisong PCB设计
【连载】【ALIENTEK MiniSTM32 开发板】STM32不完全手册--IIC实验(实验十六)
53245 53246 53247 53248 53249 53250 53251 53252 53253 53254 53255 53256 53257 53258 ...
正点原子 stm32/stm8
R4明明是130欧,为何仿真出来却是是412.147M
用的multisim仿真,R4明明是130欧,为何仿真出来却是是412.147M ...
zlb0183 模拟电子

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1425  2453  2828  1853  2230  29  50  57  38  45 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved