电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CRMV2512BF36M5FLDW

产品描述Fixed Resistor, Metal Glaze/thick Film, 0.5W, 36500000ohm, 800V, 1% +/-Tol, -150,150ppm/Cel, 2512,
产品类别无源元件    电阻器   
文件大小131KB,共3页
制造商Vishay(威世)
官网地址http://www.vishay.com
标准
下载文档 详细参数 全文预览

CRMV2512BF36M5FLDW概述

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 36500000ohm, 800V, 1% +/-Tol, -150,150ppm/Cel, 2512,

CRMV2512BF36M5FLDW规格参数

参数名称属性值
是否Rohs认证符合
Objectid993335704
Reach Compliance Codeunknown
ECCN代码EAR99
构造Chip
端子数量2
最高工作温度150 °C
最低工作温度-55 °C
封装高度0.64 mm
封装长度6.35 mm
封装形式SMT
封装宽度3.2 mm
包装方法Waffle Pack
额定功率耗散 (P)0.5 W
电阻36500000 Ω
电阻器类型FIXED RESISTOR
系列CRMV
尺寸代码2512
技术METAL GLAZE/THICK FILM
温度系数150 ppm/°C
容差1%
工作电压800 V

CRMV2512BF36M5FLDW文档预览

CRMV
www.vishay.com
Vishay Techno
Thick Film Chip Resistors, Medium Voltage
FEATURES
• Voltages up to 800 V
• Automatic placement capability
• Termination style: 3-sided wraparound
termination or single termination flip chip
available
• Tape and reel packaging available
• Suitable for solderable, epoxy bondable, or
wire bondable applications
• Internationally standardized sizes, custom sizes available
• Termination material: Solder-coated nickel barrier
standard; gold, palladium silver, platinum gold, platinum
silver or platinum palladium gold terminations available
• Multiple styles, termination materials and configurations,
allow wide design flexibility
• Non-magnetic terminations available
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
Note
*
Lead (Pb)-containing terminations are not RoHS-compliant. Exemptions may apply.
STANDARD ELECTRICAL SPECIFICATIONS
GLOBAL MODEL
CASE
SIZE
POWER RATING
P
70 °C
W
0.25
0.30
0.40
0.45
0.50
MAX. WORKING
VOLTAGE
(2)
V
300
400
500
750
800
RESISTANCE
RANGE
(1)
150 to 15M
300 to 20M
500 to 40M
1K to 60M
1K to 75M
TOLERANCE
±%
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
TEMPERATURE
COEFFICIENT
± ppm/°C
150
150
150
150
150
CRMV1206
1206
CRMV1210
1210
CRMV2010
2010
CRMV2510
2510
CRMV2512
2512
Notes
• For non-standard sizes, lower values or higher power rating requirement, contact factory.
(1)
Resistance values calibrated at 10 V . Calibration at other voltages available upon request.
DC
(2)
Continuous working voltage shall be
P
x
R
or Maximum Working Voltage, whichever is less.
TECHNICAL SPECIFICATIONS
PARAMETER
Rated dissipation at 70 °C
Limiting element voltage
Insulation resistance
Category temperature range
Weight/1000 (typical)
UNIT
W
V
°C
g
CRMV1206
0.25
300
10
11
- 55 to + 150
12.2
CRMV1210
0.30
400
10
11
- 55 to + 150
19.6
CRMV2010
0.40
500
10
11
- 55 to + 150
32.2
CRMV2510
0.45
750
10
11
- 55 to + 150
39.8
CRMV2512
0.50
800
10
11
- 55 to + 150
49.7
VOLTAGE COEFFICIENT OF RESISTANCE
MODEL
CRMV1206
CRMV1210
CRMV2010
CRMV2510
CRMV2512
VALUE ()
150 to 15M
300 to 20M
500 to 40M
1K to 60M
1K to 75M
VCR (ppm/V)
FURTHER INSTRUCTIONS
Consult factory
Consult factory
Consult factory
Consult factory
Consult factory
GLOBAL PART NUMBER INFORMATION
Global Part Numbering: CRMV1210AF1K00FLET (preferred part number format)
C
GLOBAL
MODEL
CRMV
R
SIZE
1206
1210
2010
2510
2512
M
V
1
2
1
0
A
F
1
K
0
TCR
0
F
L
E
T
PACKAGING
B
= Bulk
F
= T/R
(full reel)
1
= T/R
(1000 pcs)
5
= T/R
(500 pcs)
T
= T/R
(250 pcs min.)
W
= Waffle tray
TERMINAL
STYLE
A
= 3-sided
B
= Top only
TERMINAL
MATERIAL
F
= Nickel barrier
A
= Palladium
silver
B
= Palladium
gold
C
= Gold
D
= Platinum
silver
E
= Platinum
palladium gold
RESISTANCE
VALUE
R
=
K
= k
M
= M
110R
= 110
49K9
= 49.9 k
10M0
= 10 M
TOLERANCE
F
=±1%
G
=±2%
J
=±5%
K
= ± 10 %
M
= ± 20 %
SOLDER
TERMINATION
D
= Sn95/Ag5, HSD
E
= Sn100
F
= Sn95/Ag5
N
= No solder
S
= Sn62/Pb36/Ag2,
HSD
T
= Sn90/Pb10
L
= 150 ppm
Note
• For additional information on packaging, refer to the Surface Mount Resistor Packaging document (www.vishay.com/doc?31543).
Revision: 14-Jan-13
Document Number: 68037
1
For technical questions, contact:
te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CRMV
www.vishay.com
Vishay Techno
LENGTH
(1)
(L)
0.125 ± 0.006
(3.18 ± 0.15)
0.125 ± 0.006
(3.18 ± 0.15)
0.200 ± 0.006
(5.08 ± 0.15)
0.250 ± 0.006
(6.35 ± 0.15)
0.250 ± 0.006
(6.35 ± 0.15)
WIDTH
(1)
(W)
0.063 ± 0.006
(1.60 ± 0.15)
0.100 ± 0.006
(2.54 ± 0.15)
0.100 ± 0.006
(2.54 ± 0.15)
0.100 ± 0.006
(2.54 ± 0.15)
0.126 ± 0.006
(3.20 ± 0.15)
THICKNESS
(1)
(T)
0.025 ± 0.002
(0.64 ± 0.05)
0.025 ± 0.002
(0.64 ± 0.05)
0.025 ± 0.002
(0.64 ± 0.05)
0.025 ± 0.002
(0.64 ± 0.05)
0.025 ± 0.002
(0.64 ± 0.05)
DIMENSIONS
in inches (millimeters)
TERMINATION STYLE A
(3-SIDED WRAPAROUND)
TERMINATION STYLE B
(TOP CONDUCTOR ONLY)
MODEL
CRMV1206
W
L
T
0.025 (0.635)
Max.
T
0.025 (0.635)
Max.
L
W
CRMV1210
CRMV2010
CRMV2510
CRMV2512
Note
(1)
All dimensions are before solder coating.
TYPE
Solderable
Epoxy
bondable/solderable
Wire bondable/
epoxy bondable
Epoxy bondable
TERMINATION
MATERIAL
Nickel barrier
Platinum palladium gold
Gold
Palladium silver
(3)
Platinum gold
Platinum silver
TERMINATION
STYLE
3-sided (wraparound)
Top only (flip chip)
Top only (flip chip)
Top only (flip chip)
Top only (flip chip)
TERMINATION STYLE/
MATERIAL CODE
AF
BF
BE
BC
BA
BB
BD
SOLDER TERMINATION
CODE
E or T (standard);
D, F, or S (optional)
(4)
N (standard);
D or S (optional)
(2)
N
N
Notes
(2)
Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations D or S for applications requiring
solderable mounting.
(3)
While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.
If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then
the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for
solderability and/or solder joint issues.
(4)
Standard solder plating for the nickel barrier parts are solder terminations E or T. Plated termination F and hot solder dipped terminations D
or S are also available.
DERATING CURVE
Rated Power in %
120
100
80
60
40
20
0
- 55
- 25
0
25
50
75 100 125 150 175
70
Ambient Temperature in °C
MATERIAL SPECIFICATIONS
Resistive element
Encapsulation
Substrate
Ruthenium oxide
Epoxy
96 % alumina
Solder-coated nickel barrier standard.
Gold, palladium silver, platinum gold,
platinum silver, platinum palladium gold
terminations available.
Pure tin or tin/lead solder alloys standard.
Tin/silver or tin/lead/silver solder
alloys available.
Termination
Solder finish
PERFORMANCE
TEST
Life
Short time overload
Thermal shock
Low temperature operation
Resistance to bonding exposure
Moisture resistance
Solder mounting integrity
Solderability
Revision: 14-Jan-13
CONDITIONS OF TEST
MIL-STD-202, method 108
1000 h rated power at + 70 °C
MIL-PRF-55342, paragraph 4.8.6
MIL-STD-202, method 107
- 55 °C to + 150 °C
MIL-PRF-55342, paragraph 4.8.5
MIL-STD-202, methods 210
MIL-PRF-55342, paragraph 4.8.9
MIL-PRF-55342, paragraph 4.8.13
2 kg for 30 s
MIL-STD-202, method 208
TEST RESULTS (TYPICAL TEST LOTS)
± 0.50 %
± 0.02 %
± 0.50 %
± 0.02 %
± 0.05 %
± 0.06 %
No evidence of mechanical damage
95 % coverage
Document Number: 68037
2
For technical questions, contact:
te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000
美资企业招贤纳士Driver development engineer(SW 4#)
公司名称: Carrier Access 公司网址: http://www.carrieraccess.com 电子邮箱: lshi@carrieraccess.com,简历请注明信息出处 工作地点: 上海 外语要求: 英文良好 简历接收方式: 英文及 ......
xinbt 嵌入式系统
PB5.0升级2008全年升级包后 定制内核 生成的NK.nb0无法运行
第一步:把PB5.0升级2008全年升级包,在优龙2410开发板资料提供的ARMSYS2410.pbxml基础上把.net compact framework 2.0 add to OS,编译通过,生成的NK.nb0(大小为29M),在DNW下可以通过USB下 ......
zzh 产业风云
M4与DAC芯片进行I2C输出正弦波,波形畸变原因
正弦序列经过I2C通信,怎么总是断开呢?可能是什么原因啊?大家都猜猜看,赠芯币哦!!!不确定没关系,说不定可以启发我呢。 ...
1301120345 微控制器 MCU
PCB 工艺设计规范
PCB 工艺设计规范 42322...
sixwater PCB设计
南华大学黄智伟 分析2012年湖南省大学生电子设计竞赛仪器设备与元器件清单
本帖最后由 paulhyde 于 2014-9-15 03:24 编辑 南华大学黄智伟 分析2012年湖南省大学生电子设计竞赛仪器设备与元器件清单(仅供参考) ...
黄智伟 电子竞赛
创意立方
本帖最后由 是最帅的啊 于 2021-8-25 20:10 编辑 之前做了一款WS2812灯球,https://bbs.eeworld.com.cn/thread-1172553-1-1.html 做完之后觉得还是有很大的改进方案。比如说灯球上的WS2812 ......
是最帅的啊 MicroPython开源版块

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 976  629  830  1649  1878  20  13  17  34  38 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved