voltage references ref='/w_1ua.html'>1ua precision shunt voltage ref
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SOT-23 |
| 包装说明 | TSOP, TO-236 |
| 针数 | 3 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| Samacsys Description | MAXIM INTEGRATED PRODUCTS - MAX6009BEUR+T - VOLTAGE REF, SHUNT, 3V, SOT23-3 |
| 模拟集成电路 - 其他类型 | TWO TERMINAL VOLTAGE REFERENCE |
| JESD-30 代码 | R-PDSO-G3 |
| JESD-609代码 | e3 |
| 长度 | 2.92 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 输出次数 | 1 |
| 端子数量 | 3 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 最大输出电压 | 3.015 V |
| 最小输出电压 | 2.985 V |
| 标称输出电压 | 3 V |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP |
| 封装等效代码 | TO-236 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.12 mm |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 最大电压温度系数 | 75 ppm/°C |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.95 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 微调/可调输出 | NO |
| 最大电压容差 | 0.5% |
| 宽度 | 1.3 mm |
| Base Number Matches | 1 |
| MAX6009BEUR+T | MAX6008BEUR+T | MAX6006AEUR+T | MAX6009AEUR+T | MAX6007AEUR+T | MAX6006BEUR+T | MAX6006BESA+T | MAX6006AESA+T | MAX6008AEUR+T | |
|---|---|---|---|---|---|---|---|---|---|
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| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | SOT-23 | SOT-23 | SOT-23 | SOT-23 | SOT-23 | SOT-23 | SOIC | SOIC | SOT-23 |
| 包装说明 | TSOP, TO-236 | SOT-23, 3 PIN | TSOP, TO-236 | TSOP, TO-236 | TSOP, TO-236 | TSOP, TO-236 | SO-8 | SO-8 | TSOP, TO-236 |
| 针数 | 3 | 3 | 3 | 3 | 3 | 3 | 8 | 8 | 3 |
| Reach Compliance Code | compliant | compli | compli | compliant | compli | compli | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks |
| 模拟集成电路 - 其他类型 | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE |
| JESD-30 代码 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G3 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 2.92 mm | 2.92 mm | 2.92 mm | 2.92 mm | 2.92 mm | 2.92 mm | 4.9 mm | 4.9 mm | 2.92 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 3 | 3 | 3 | 3 | 3 | 3 | 8 | 8 | 3 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 最大输出电压 | 3.015 V | 2.5125 V | 1.2525 V | 3.006 V | 2.0521 V | 1.2563 V | 1.2563 V | 1.2525 V | 2.505 V |
| 最小输出电压 | 2.985 V | 2.4875 V | 1.2475 V | 2.994 V | 2.0439 V | 1.2438 V | 1.2438 V | 1.2475 V | 2.495 V |
| 标称输出电压 | 3 V | 2.5 V | 1.25 V | 3 V | 2.048 V | 1.25 V | 1.25 V | 1.25 V | 2.5 V |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP | TSOP | TSOP | TSOP | TSOP | TSOP | SOP | SOP | TSOP |
| 封装等效代码 | TO-236 | TO-236 | TO-236 | TO-236 | TO-236 | TO-236 | SOP8,.25 | SOP8,.25 | TO-236 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.12 mm | 1.12 mm | 1.12 mm | 1.12 mm | 1.12 mm | 1.12 mm | 1.75 mm | 1.75 mm | 1.12 mm |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 最大电压温度系数 | 75 ppm/°C | 75 ppm/°C | 30 ppm/°C | 30 ppm/°C | 30 ppm/°C | 75 ppm/°C | 75 ppm/°C | 30 ppm/°C | 30 ppm/°C |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | 1.27 mm | 1.27 mm | 0.95 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 微调/可调输出 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 最大电压容差 | 0.5% | 0.5% | 0.2% | 0.2% | 0.2% | 0.5% | 0.5% | 0.2% | 0.2% |
| 宽度 | 1.3 mm | 1.3 mm | 1.3 mm | 1.3 mm | 1.3 mm | 1.3 mm | 3.9 mm | 3.9 mm | 1.3 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | 1 | - |
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