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MCP2221T-I/SL

产品描述usb interface IC usb to i2c bridge device
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小1MB,共82页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
标准
下载文档 详细参数 选型对比 全文预览

MCP2221T-I/SL概述

usb interface IC usb to i2c bridge device

MCP2221T-I/SL规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Microchip(微芯科技)
包装说明SOIC-14
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time8 weeks
JESD-30 代码R-PDSO-G14
JESD-609代码e3
长度8.65 mm
湿度敏感等级1
端子数量14
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)260
座面最大高度1.75 mm
最大供电电压5.5 V
最小供电电压3 V
标称供电电压3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn) - annealed
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间40
宽度3.9 mm
uPs/uCs/外围集成电路类型MICROPROCESSOR CIRCUIT

文档预览

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MCP2221
USB 2.0 to I
2
C/UART Protocol Converter with GPIO
Features
Universal Serial Bus (USB)
• Supports Full-Speed USB (12 Mb/s)
• Implements USB Protocol Composite Device:
- Communication Device Class (CDC) for
USB-to-UART Conversion
- Human Interface Device (HID) for I
2
C Device
Control and Configuration
• 128-Byte Buffer to Handle Data Throughput at
Any Supported UART Baud Rate:
- 64-Byte Transmit
- 64-Byte Receive
• Human Interface Device (HID) for Both
I
2
C Communication and Control:
64-Byte Buffer to Handle Data Throughput at
Any I
2
C Baud Rate
• Fully-Configurable VID and PID Assignments and
String Descriptors
• Bus-Powered or Self-Powered
• USB 2.0-Compliant: TID# 40001594
I
2
C/SMBus
• The Device Runs as an I
2
C Master. The Data to
Write/Read on the I
2
C Bus is Conveyed by the
USB Interface
• I
2
C Master
- Up to 400 kHz Clock Rate
- Supports 7-Bit or 10-Bit Addressable
Devices; 10-Bit Addressable Devices are
Supported through the PC Host Library
- Supports Block Reads/Writes of up to 65,535
Bytes
• SMBus Master
- Supports All of the SMBus Transfers
- SMBus Functionality Is Achieved through a
Combination of Chip and Support Library
Processing
- Up to 400 kHz Clock Rate
General-Purpose Input/Output (GPIO) Pins
• Four General-Purpose Input/Output Pins
• All GP Pins Can Be Assigned to Other
Functionalities
USB Driver and Software Support
• Enumerates as a Composite USB Device (CDC
and HID) Using Standard Drivers for Virtual Com
Port (VCP) on the Following Windows
®
Operating
Systems: XP
®
(SP3), Vista
®
, 7, 8 and 8.1
• Configuration Utility for Establishing a Custom
Boot-Up Configuration
• I
2
C/SMBus Terminal
• Windows DLL
Other Functionalities
• UART Activity LED Outputs (UT
X
and UR
X
)
• SSPND Output Pin
• USBCFG Output Pin (Indicates When the
Enumeration Has Completed)
• Three ADC Inputs
• One DAC with Two Possible Output Options
• Clock Reference Output: 12 MHz or Other
Configurable Values
• External Interrupt Edge Detection
CDC and Universal Asynchronous
Receiver/Transmitter (UART) Options
• Communications Device Class (CDC) for the
USB-to-UART Option
• Responds to
SET LINE CODING
Commands to
Dynamically Change Baud Rates
• Supports Baud Rates: 300-115200
• UART T
X
and R
X
Pins Only
• Serial Number Used During the CDC
Enumeration Can Be Enabled by Using the
Microchip-Provided Configuration Utility or by
Calling the Proper API from the Support Libraries
for this Device
Other
• Operating Voltage: 3.0 to 5.5V
• Electrostatic Discharge (ESD) Protection: > 4 kV
Human Body Model (HBM)
• Industrial (I) Operating Temperature: –40°C to
+85°C
• Automotive AEC-Q100 Qualified
2014-2017 Microchip Technology Inc.
DS20005292C-page 1

MCP2221T-I/SL相似产品对比

MCP2221T-I/SL MCP2221T-I/ST MCP2221-I/ST MCP2221-I/P MCP2221-I/ML ADM00559
描述 usb interface IC usb to i2c bridge device usb interface IC usb to i2c bridge device usb interface IC usb to i2c bridge device usb interface IC usb to i2c bridge device usb interface IC usb to i2c bridge device board eval for mcp2221
是否Rohs认证 符合 符合 符合 符合 符合 -
厂商名称 Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) -
包装说明 SOIC-14 SSOP-14 SSOP-14 DIP-14 QFN-16 -
Reach Compliance Code compliant compli compli compli compli -
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 -
Factory Lead Time 8 weeks 8 weeks 11 weeks 9 weeks 8 weeks -
JESD-30 代码 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDIP-T14 S-PQCC-N16 -
JESD-609代码 e3 e3 e3 e3 e3 -
长度 8.65 mm 5 mm 5 mm 19.05 mm 4 mm -
湿度敏感等级 1 1 1 - 1 -
端子数量 14 14 14 14 16 -
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C -
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 SOP TSSOP TSSOP DIP HVQCCN -
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE -
封装形式 SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE -
峰值回流温度(摄氏度) 260 260 260 NOT APPLICABLE 260 -
座面最大高度 1.75 mm 1.2 mm 1.2 mm 5.334 mm 1 mm -
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V -
最小供电电压 3 V 3 V 3 V 3 V 3 V -
标称供电电压 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V -
表面贴装 YES YES YES NO YES -
技术 CMOS CMOS CMOS CMOS CMOS -
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL -
端子面层 Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed -
端子形式 GULL WING GULL WING GULL WING THROUGH-HOLE NO LEAD -
端子节距 1.27 mm 0.65 mm 0.65 mm 2.54 mm 0.4 mm -
端子位置 DUAL DUAL DUAL DUAL QUAD -
处于峰值回流温度下的最长时间 40 40 40 NOT APPLICABLE 40 -
宽度 3.9 mm 4.4 mm 4.4 mm 7.62 mm 4 mm -
uPs/uCs/外围集成电路类型 MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT -
封装等效代码 - TSSOP14,.25 TSSOP14,.25 DIP14,.3 LCC16,.16SQ,25 -
电源 - 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V -
认证状态 - Not Qualified Not Qualified Not Qualified Not Qualified -
最大压摆率 - 15 mA 15 mA 15 mA 15 mA -

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