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IS42S86400B-7TL

产品描述dram 512m (64mx8) 143mhz sdr sdrAM, 3.3V
产品类别半导体    其他集成电路(IC)   
文件大小886KB,共62页
制造商All Sensors
标准  
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IS42S86400B-7TL概述

dram 512m (64mx8) 143mhz sdr sdrAM, 3.3V

IS42S86400B-7TL规格参数

参数名称属性值
ManufactureISSI
产品种类
Product Category
DRAM
RoHSYes
Data Bus Width8 bi
Organizati64 M x 8
封装 / 箱体
Package / Case
TSOP-54
Memory Size512 Mbi
Maximum Clock Frequency143 MHz
Access Time6 ns
电源电压-最大
Supply Voltage - Max
3.6 V
Supply Voltage - Mi3 V
Maximum Operating Curre150 mA
最大工作温度
Maximum Operating Temperature
+ 70 C
系列
Packaging
Tray
最小工作温度
Minimum Operating Temperature
0 C
安装风格
Mounting Style
SMD/SMT
工厂包装数量
Factory Pack Quantity
108

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IS42S86400B
IS42S16320B, IS45S16320B
64M x 8, 32M x 16
512Mb SYNCHRONOUS DRAM
FEATURES
• Clock frequency: 166, 143, 133 MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access/precharge
• Power supply
V
dd
V
ddq
IS42/45S16320B 3.3V 3.3V
IS42S86400B
• LVTTL interface
• Programmable burst length
– (1, 2, 4, 8, full page)
• Programmable burst sequence:
Sequential/Interleave
• Auto Refresh (CBR)
• Self Refresh
• 8K refresh cycles every 16ms (A2 grade) or
64 ms (Commercial, Industrial, A1 grade)
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and precharge
command
• Available in 54-pin TSOP-II and 54-ball W-BGA
(x16 only)
• Operating Temperature Range:
Commercial: 0
o
C to +70
o
C
Industrial: -40
o
C to +85
o
C
Automotive, A1: -40
o
C to +85
o
C
Automotive, A2: -40
o
C to +105
o
C
Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time with-
out notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain
the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such ap-
plications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
DECEMBER 2011
OVERVIEW
ISSI
's 512Mb Synchronous DRAM achieves high-speed
data transfer using pipeline architecture. All inputs and
outputs signals refer to the rising edge of the clock input.
The 512Mb SDRAM is organized as follows.
IS42S86400B
16Mx8x4 Banks
54-pin TSOPII
IS42/45S16320B
8M x16x4 Banks
54-pin TSOPII
54-ball W-BGA
3.3V 3.3V
KEY TIMING PARAMETERS
Parameter
Clk Cycle Time
CAS Latency = 3
CAS Latency = 2
Clk Frequency
CAS Latency = 3
CAS Latency = 2
Access Time from Clock
CAS Latency = 3
CAS Latency = 2
-6
6
10
166
100
5.4
6
-7
7
10
143
100
5.4
6
-75E
7.5
133
5.5
Unit
ns
ns
Mhz
Mhz
ns
ns
Integrated Silicon Solution, Inc. — www.issi.com
Rev. H
12/01/2011
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