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IS46LR32160B-6BLA1-TR

产品描述dram 512m (16mx32) mobile ddr 1.8v
产品类别半导体    其他集成电路(IC)   
文件大小2MB,共42页
制造商All Sensors
标准  
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IS46LR32160B-6BLA1-TR概述

dram 512m (16mx32) mobile ddr 1.8v

IS46LR32160B-6BLA1-TR规格参数

参数名称属性值
ManufactureISSI
产品种类
Product Category
DRAM
RoHSYes
Data Bus Width32 bi
Organizati16 M x 32
封装 / 箱体
Package / Case
BGA-90
Memory Size512 Mbi
Maximum Clock Frequency166 MHz
Access Time5.5 ns
电源电压-最大
Supply Voltage - Max
1.95 V
Supply Voltage - Mi1.7 V
Maximum Operating Curre110 mA
最大工作温度
Maximum Operating Temperature
+ 85 C
系列
Packaging
Reel
最小工作温度
Minimum Operating Temperature
- 40 C
安装风格
Mounting Style
SMD/SMT
工厂包装数量
Factory Pack Quantity
2500

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IS43LR16320B, IS46LR16320B
8M
x
16Bits
x
4Banks Mobile DDR SDRAM
Description
The IS43/46LR16320B is a 536,870,912 bits CMOS Mobile Double Data Rate Synchronous DRAM organized as 4 banks of 8,388,608 words x
16 bits. This product uses a double-data-rate architecture to achieve high-speed operation. The Data Input/ Output signals are transmitted
on a 16bit bus. The double data rate architecture is essentially a 2
N
prefetch architecture with an interface designed to transfer two data
words per clock cycle at the I/O pins. This product offers fully synchronous operations referenced to both rising and falling edges of the clock.
The data paths are internally pipelined and 2n-bits prefetched to achieve very high bandwidth. All input and output voltage levels are
compatible with LVCMOS.
Features
• JEDEC standard 1.8V power supply.
• VDD = 1.8V, VDDQ = 1.8V
• Four internal banks for concurrent operation
• MRS cycle with address key programs
- CAS latency 2, 3 (clock)
- Burst length (2, 4, 8, 16)
- Burst type (sequential & interleave)
• Fully differential clock inputs (CK, /CK)
• All inputs except data & DM are sampled at the rising
edge of the system clock
• Data I/O transaction on both edges of data strobe
• Bidirectional data strobe per byte of data (DQS)
• DM for write masking only
• Edge aligned data & data strobe output
• Center aligned data & data strobe input
• 64ms refresh period (8K cycle)
• Auto & self refresh
• Concurrent Auto Precharge
• Maximum clock frequency up to 166MHZ
• Maximum data rate up to 333Mbps/pin
• Power Saving support
- PASR (Partial Array Self Refresh)
- Auto TCSR (Temperature Compensated Self Refresh)
- Deep Power Down Mode
- Programmable Driver Strength Control by Full Strength
or 1/2, 1/4, 1/8 of Full Strength
• LVCMOS compatible inputs/outputs
• 60-Ball FBGA package
Copyright © 2010 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its
products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services
described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information
and before placing orders for products.
Rev. A | Apr. 2012
www.issi.com
- dram@issi.com
1

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