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TB6608FNG(O,EL)

产品描述motor / motion / ignition controllers & drivers stepping motor driver
产品类别半导体    其他集成电路(IC)   
文件大小351KB,共31页
制造商Toshiba(东芝)
官网地址http://toshiba-semicon-storage.com/
标准
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TB6608FNG(O,EL)概述

motor / motion / ignition controllers & drivers stepping motor driver

TB6608FNG(O,EL)规格参数

参数名称属性值
ManufactureToshib
产品种类
Product Category
Motor / Motion / Ignition Controllers & Drivers
RoHSYes
ProducStepper Motor Controllers / Drivers
类型
Type
Stepper Motor Drive
工作电源电压
Operating Supply Voltage
3.3 V
Operating Temperature- 20 C to + 85 C
Supply Curre6 mA
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
SSOP-20
工厂包装数量
Factory Pack Quantity
2000

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TB6608FNG
TOSHIBA Bi−CD Integrated Circuit
Silicon Monolithic
TB6608FNG
Stepping Motor Driver IC
The TB6608FNG is a PWM constant-current type stepping
motor driver IC designed for sinusoidal-input micro-step control of
stepping motors.
The TB6608FNG can be used in applications that require
2-phase, 1-2-phase, W1-2-phase and 2W1-2 phase excitation
modes. The TB6608FNG is capable of forward and reverse driving
of a 2-phase bipolar stepping motor using only a clock signal.
Features
Motor power supply voltage: V
M
=
15 V (max)
Control power supply voltage: V
CC
=
2.7 to 6 V
Output current: Iout
0.8 A (max)
Output ON-resistance: Ron
=
1.5
Ω
(upper and lower sum@V
M
=
5 V)
Decoder that enables microstep control with the clock signal
Selectable phase excitation modes (2, 1-2, W1-2 and 2W1-2)
Internal pull-down resistors on inputs: 200 kΩ (typ.)
Output monitor pin (
MO
)
Thermal shutdown (TSD) and undervoltage lockout (UVLO) circuits
Small surface-mount package (SSOP20: 0.65 mm lead pitch)
Weight: 0.09 g (typ.)
This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product, ensure
that the environment is protected against electrostatic discharge by using an earth strap, a conductive mat and an
ionizer. Ensure also that the ambient temperature and relative humidity are maintained at reasonable levels.
Do not insert devices in the wrong orientation or incorrectly. Otherwise, it may cause the device breakdown,
damage and/or deterioration.
About solderability, following conditions were confirmed
Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature
=
230°C
· dipping time
=
5 seconds
· the number of times
=
once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature
=
245°C
· dipping time
=
5 seconds
· the number of times
=
once
· use of R-type flux
1
2007-12-17

 
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