supervisory circuits 3.3/5V micromanager
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP8,.3 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDIP-T8 |
| JESD-609代码 | e3 |
| 长度 | 9.375 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.2/5.5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.58 mm |
| 最大供电电流 (Isup) | 0.055 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.2 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 阈值电压标称 | +2.72V |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| DS1836C-20+ | DS1836CS-10+T&R | DS1836DS-20+T&R | DS1836DS-10+ | DS1836CS-20+ | DS1836D-10+ | DS1836CS-10+ | DS1836DS-20+ | DS1836CS-10/T&R | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | supervisory circuits 3.3/5V micromanager | supervisory circuits 3.3/5V micromanager | supervisory circuits 3.3/5V micromanager | supervisory circuits 3.3/5V micromanager | supervisory circuits 3.3/5V micromanager | supervisory circuits 3.3/5V micromanager | supervisory circuits 3.3/5V micromanager | supervisory circuits 3.3/5V micromanager | supervisory circuits 3.3/5V micromanager |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 |
| 零件包装代码 | DIP | SOIC | SOIC | SOIC | SOIC | DIP | SOIC | SOIC | SOIC |
| 包装说明 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | 0.150 INCH, SOIC-8 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compliant | compli | compli | _compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e0 |
| 长度 | 9.375 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 9.375 mm | 4.9 mm | 4.9 mm | 4.9 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | SOP | SOP | DIP | SOP | SOP | SOP |
| 封装等效代码 | DIP8,.3 | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 | DIP8,.3 | SOP8,.25 | SOP8,.25 | SOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 245 |
| 电源 | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.58 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 4.58 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 最大供电电流 (Isup) | 0.055 mA | 0.055 mA | 0.055 mA | 0.055 mA | 0.055 mA | 0.055 mA | 0.055 mA | 0.055 mA | 0.055 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | YES | YES | YES | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | MATTE TIN | Matte Tin (Sn) | Matte Tin (Sn) | Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 阈值电压标称 | +2.72V | +2.88V | +2.72V | +2.88V | +2.72V | +2.88V | +2.88V | +2.72V | 2.88v |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | - | Maxim(美信半导体) | - |
| Base Number Matches | 1 | 1 | - | - | 1 | 1 | 1 | - | 1 |
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