Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MC9S08PT60
Rev. 3, 4/2012
MC9S08PT60 Series
Support: MC9S08PT60 and
MC9S08PT32
Features
• 8-Bit S08 central processor unit (CPU)
– Up to 20 MHz bus at 2.7 V to 5.5 V across
temperature range of -40 °C to 105 °C
– Supporting up to 40 interrupt/reset sources
– Supporting up to four-level nested interrupt
– On-chip memory
– Up to 60 KB flash read/program/erase over full
operating voltage and temperature
– Up to 256 byte EEPROM; 2-byte erase sector;
program and erase while executing flash
– Up to 4096 byte random-access memory (RAM)
– Flash and RAM access protection
• Power-saving modes
– One low-power stop mode; reduced power wait
mode
– Peripheral clock enable register can disable clocks to
unused modules, reducing currents; allows clocks to
remain enabled to specific peripherals in stop3 mode
• Clocks
– Oscillator (XOSC) - loop-controlled Pierce
oscillator; crystal or ceramic resonator range of
31.25 kHz to 39.0625 kHz or 4 MHz to 20 MHz
– Internal clock source (ICS) - containing a frequency-
locked-loop (FLL) controlled by internal or external
reference; precision trimming of internal reference
allowing 1% deviation across temperature range of 0
°C to 70 °C and 2% deviation across temperature
range of -40 °C to 105 °C; up to 20 MHz
• System protection
– Watchdog with independent clock source
– Low-voltage detection with reset or interrupt;
selectable trip points
– Illegal opcode detection with reset
– Illegal address detection with reset
MC9S08PT60
• Development support
– Single-wire background debug interface
– Breakpoint capability to allow three breakpoints
setting during in-circuit debugging
– On-chip in-circuit emulator (ICE) debug module
containing two comparators and nine trigger modes
• Peripherals
– ACMP - one analog comparator with both positive
and negative inputs; separately selectable interrupt
on rising and falling comparator output; filtering
– ADC - 16-channel, 12-bit resolution; 2.5 µs
conversion time; data buffers with optional
watermark; automatic compare function; internal
bandgap reference channel; operation in stop mode;
optional hardware trigger
– CRC - programmable cyclic redundancy check
module
– FTM - three flex timer modulators modules
including one 6-channel and two 2-channel ones;
16-bit counter; each channel can be configured for
input capture, output compare, edge- or center-
aligned PWM mode
– IIC - One inter-integrated circuit module; up to 400
kbps; multi-master operation; programmable slave
address; supporting broadcast mode and 10-bit
addressing
– MTIM - Two modulo timers with 8-bit prescaler and
overflow interrupt
– RTC - 16-bit real timer counter (RTC)
– SCI - three serial communication interface (SCI/
UART) modules optional 13-bit break; full duplex
non-return to zero (NRZ); LIN extension support
– SPI - one 8-bit and one 16-bit serial peripheral
interface (SPI) modules; full-duplex or single-wire
bidirectional; master or slave mode
– TSI - supporting up to 16 external electrodes;
configurable software or hardware scan trigger; fully
support freescale touch sensing software library;
capability to wake MCU from stop3 mode
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2011–2012 Freescale Semiconductor, Inc.
• Input/Output
– 57 GPIOs including one output-only pin
– Two 8-bit keyboard interrupt modules (KBI)
– Two true open-drain output pins
– Eight, ultra-high current sink pins supporting 20 mA source/sink current
• Package options
– 64-pin LQFP; 64-pin QFP
– 48-pin LQFP
– 44-pin LQFP
– 32-pin LQFP
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
2
Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts...........................................................................4
1.1 Determining valid orderable parts......................................4
2 Part identification......................................................................4
2.1 Description.........................................................................4
2.2 Format...............................................................................4
2.3 Fields.................................................................................4
2.4 Example............................................................................5
3 Parameter Classification...........................................................5
4 Ratings......................................................................................5
4.1 Thermal handling ratings...................................................5
4.2 Moisture handling ratings..................................................6
4.3 ESD handling ratings.........................................................6
4.4 Voltage and current operating ratings...............................6
5 General.....................................................................................7
5.1 Nonswitching electrical specifications...............................7
5.1.1
5.1.2
5.1.3
DC characteristics.................................................7
Supply current characteristics...............................12
EMC performance.................................................13
5.2.2
5.2.3
Debug trace timing specifications.........................15
FTM module timing...............................................16
5.3 Thermal specifications.......................................................17
5.3.1
Thermal characteristics.........................................17
6 Peripheral operating requirements and behaviors....................18
6.1 External oscillator (XOSC) and ICS characteristics...........18
6.2 NVM specifications............................................................20
6.3 Analog...............................................................................21
6.3.1
6.3.2
ADC characteristics...............................................21
Analog comparator (ACMP) electricals.................25
6.4 Communication interfaces.................................................25
6.4.1
SPI switching specifications..................................25
6.5 Human-machine interfaces (HMI)......................................28
6.5.1
TSI electrical specifications...................................28
7 Dimensions...............................................................................29
7.1 Obtaining package dimensions.........................................29
8 Pinout........................................................................................29
8.1 Signal multiplexing and pin assignments...........................29
8.2 Device pin assignment......................................................33
9 Revision history.........................................................................36
5.2 Switching specifications.....................................................14
5.2.1
Control timing........................................................14
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
Freescale Semiconductor, Inc.
3
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
http://www.freescale.com
and perform a part number
search for the following device numbers: PT60 and PT32.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
MC 9 S08 PT AA B CC
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
MC
9
S08
PT
AA
B
Qualification status
Memory
Core
Device family
Approximate flash size in KB
Temperature range (°C)
Description
Values
• MC = fully qualified, general market flow
• 9 = flash based
• S08 = 8-bit CPU
• PT
• 60 = 60 KB
• 32 = 32 KB
• V = –40 to 105
• C = –40 to 85
Table continues on the next page...
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
4
Freescale Semiconductor, Inc.
Parameter Classification
Field
CC
Package designator
Description
•
•
•
•
•
Values
QH = 64-pin QFP
LH = 64-pin LQFP
LF = 48-pin LQFP
LD = 44-pin LQFP
LC = 32-pin LQFP
2.4 Example
This is an example part number:
MC9S08PT60VQH
3 Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods.
To give the customer a better understanding, the following classification is used and the
parameters are tagged accordingly in the tables where appropriate:
Table 1. Parameter Classifications
P
C
T
D
Those parameters are guaranteed during production testing on each individual device.
Those parameters are achieved by the design characterization by measuring a statistically relevant sample size
across process variations.
Those parameters are achieved by design characterization on a small sample size from typical devices under
typical conditions unless otherwise noted. All values shown in the typical column are within this category.
Those parameters are derived mainly from simulations.
NOTE
The classification is shown in the column labeled “C” in the
parameter tables where appropriate.
4 Ratings
4.1 Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
Freescale Semiconductor, Inc.
5
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