Operating Temperature Range ......................... -40NC to +85NC
Storage Temperature Range .......................... -65NC to +150NC
Lead Temperature (soldering, 10s)……………… ...........+300NC
Soldering Temperature (reflow)……..………………….. ..+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS
(V
DD
= V
RST
to V
DD(MAX)
, T
A
= -40NC to +85NC, unless otherwise noted. Typical values are measured at T
A
= +25NC. AC electrical
specifications and all specifications to T
A
= -40NC are guaranteed by design and are not production tested.)
PARAMETER
Supply Voltage
1.8V Internal Regulator
Power-Fail Warning Voltage
Power-Fail Reset Voltage
Power-On Reset Voltage
Supply Current
Idle Current
SYMBOL
V
DD
V
REG18
V
PFW
V
RST
V
POR
I
DD1
I
IDLE
I
STOP1
PF Off
Stop Mode Current
I
STOP2
PF On
Stop Mode Resume Time
Power-Fail Monitor Startup Time
Power-Fail Warning Detection
Time
CLOCK SOURCE
Internal Ring Oscillator
Frequency
Ring Oscillator Duty Cycle
System Clock Frequency
System Clock Period
DIGITAL I/O
Input Hysteresis
Input Low Voltage
Input High Voltage
Maxim Integrated
CONDITIONS
MIN
V
RST
1.62
TYP
1.7
2.6
2.4
2.6
MAX
3.6
1.98
2.75
2.45
1.45
4.5
850
3.0
12
16
35.0
42.0
45
UNITS
V
V
V
V
V
mA
FA
Monitors V
DD
(Notes 1, 2)
Monitors V
DD
(Note 3)
Monitors V
DD
f
CK
= 20MHz (Note 4)
(Note 5)
T
A
= +25NC
T
A
= 0NC to +70NC
T
A
= -40NC to +85NC
T
A
= +25NC
T
A
= 0NC to +70NC
T
A
= -40NC to +85NC
(Note 6)
2.45
2.35
1.0
1.0
750
0.3
1
2
22.0
22.0
22.0
300
FA
t
ON
t
PFM_ON
t
PFW
Fs
150
Fs
Fs
10
f
CLK
t
CLK_DUTY
t
CK
f
CK
V
IHYS
V
IL
V
IH
±5%
45
20
55
f
CK
1/f
CK
MHz
%
MHz
ns
mV
0.3 x V
DD
V
DD
V
V
2
V
DD
= 3.3V, T
A
= +25NC
V
GND
0.7 x V
DD
300
MAXQ615
16-Bit MAXQ Microcontroller with
Hardware Multiplier
RECOMMENDED DC OPERATING CONDITIONS (continued)
(V
DD
= V
RST
to V
DD(MAX)
, T
A
= -40NC to +85NC, unless otherwise noted. Typical values are measured at T
A
= +25NC. AC electrical
specifications and all specifications to T
A
= -40NC are guaranteed by design and are not production tested.)
PARAMETER
Output Low Voltage (Note 7)
Output High Voltage
Input Leakage Current
Input Capacitance
Input Pullup Resistance
FLASH MEMORY
System Clock During Flash
Programming
Flash Erase Time
Flash Programming Time Per
Word
Write/Erase Cycles
Data Retention
T
A
= +25NC
t
ME
t
ERASE
t
PMG
Mass erase
Page erase
2
20
20
20
20,000
100
40
40
100
MHz
ms
Fs
Cycles
Years
SYMBOL
V
OL
V
OH
I
L
C
IO
R
PU
V
DD
= 3.0V, V
OL
= 0.4V
16
28
CONDITIONS
V
DD
= 3.6V, I
OL
= 11mA
V
DD
= 2.4V, I
OL
= 8mA
I
OH
= -2mA (Note 7)
Internal pullup disabled
V
DD
- 0.5
-100
MIN
TYP
0.4
0.4
MAX
0.5
0.5
V
DD
+100
15
39
UNITS
V
V
V
nA
pF
kI
SPI ELECTRICAL CHARACTERISTICS
(V
DD
= 1.7V to 3.6V, T
A
= -40NC to +85NC, unless otherwise noted. AC electrical specifications are guaranteed by design and are
not production tested.) (Figures
1, 2)
PARAMETER
SPI Master Operating
Frequency
SPI Slave Operating
Frequency
SPI I/O Rise/Fall Time
SCLK Output Pulse-Width High/
Low
MOSI Output Hold Time After
SCLK Sample Edge
MOSI Output Valid to Sample
Edge
MISO Input Valid to SCLK Sample
Edge Rise/Fall Setup
MISO Input to SCLK Sample
Edge Rise/Fall Hold
SCLK Inactive to MOSI Inactive
SYMBOL
1/t
MCK
1/t
SCK
t
SPI_RF
t
MCH
, t
MCL
t
MOH
t
MOV
t
MIS
t
MIH
t
MLH
C
L
= 15pF, pullup = 560W
8.3
t
MCK
/2 - t
SPI_RF
t
MCK
/2 - t
SPI_RF
t
MCK
/2 - t
SPI_RF
25
0
t
MCK
/2 - t
SPI_RF
CONDITIONS
MIN
TYP
MAX
f
CK
/2
f
CK
/4
23.6
UNITS
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
Maxim Integrated
3
MAXQ615
16-Bit MAXQ Microcontroller with
Hardware Multiplier
SPI ELECTRICAL CHARACTERISTICS (continued)
(V
DD
= 1.7V to 3.6V, T
A
= -40NC to +85NC, unless otherwise noted. AC electrical specifications are guaranteed by design and are
not production tested.) (Figures
1, 2)
PARAMETER
SCLK Input Pulse-Width High/
Low
SSEL Active to First Shift
Edge
MOSI Input to SCLK Sample
Edge Rise/Fall Setup
MOSI Input from SCLK Sample
Edge Transition Hold
MISO Output Valid After SCLK
Shift Edge Transition
SSEL Inactive
SCLK Inactive to SSEL Rising
MISO Output Disabled After
SSEL Edge Rise
SYMBOL
t
SCH
, t
SCL
t
SSE
t
SIS
t
SIH
t
SOV
t
SSH
t
SD
t
SLH
t
CK
+ t
SPI_RF
t
SPI_RF
2t
CK
+ 2t
SPI_RF
t
SPI_RF
t
SPI_RF
t
SPI_RF
2t
SPI_RF
CONDITIONS
MIN
TYP
t
SCK
/2
MAX
UNITS
ns
ns
ns
ns
ns
ns
ns
ns
SHIFT
SSEL
(SAS = 0)
SAMPLE
SHIFT
SAMPLE
1/0
SCLK
CKPOL/CKPHA
0/1
t
MCK
1/0
0/1
1/1
SCLK
CKPOL/CKPHA
0/0
t
MCH
t
MCL
1/1
0/0
t
MOH
t
MOV
MOSI
MSB
MSB-1
t
RF
LSB
t
MLH
t
MIS
MISO
MSB
MSB-1
t
MIH
LSB
Figure 1. SPI Master Communications Timing
Maxim Integrated
4
MAXQ615
16-Bit MAXQ Microcontroller with
Hardware Multiplier
SHIFT
SSEL
(SAS = 1)
SAMPLE
SHIFT
SAMPLE
t
SSH
t
SD
1/0
0/1
t
SSE
t
SCK
1/0
SCLK
CKPOL/CKPHA
0/1
1/1
SCLK
CKPOL/CKPHA
0/0
t
SCH
t
SCL
1/1
0/0
t
SIS
MOSI
MSB
MSB-1
t
SIH
LSB
t
SOV
MISO
MSB
MSB-1
t
RF
LSB
t
SLH
Figure 2. SPI Slave Communications Timing
I
2
C ELECTRICAL CHARACTERISTICS
(V
DD
= V
RST
to V
DD(MAX)
, T
A
= -40°C to +85°C, unless otherwise noted. AC electrical specifications and all specifications to
T
A
= -40°C are guaranteed by design and are not production tested.) (Figure
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