fpga - field programmable gate array auto grade latticexp2-8E
参数名称 | 属性值 |
Manufacture | Lattice |
产品种类 Product Category | FPGA - Field Programmable Gate Array |
RoHS | Yes |
Produc | XP2 |
Number of Logic Elements | 8000 |
Number of Logic Array Blocks - LABs | 1000 |
Total Memory | 239 kbi |
Number of I/Os | 201 |
工作电源电压 Operating Supply Voltage | 1.2 V |
最大工作温度 Maximum Operating Temperature | + 125 C |
安装风格 Mounting Style | SMD/SMT |
封装 / 箱体 Package / Case | ftBGA-256 |
Distributed RAM | 18 kbi |
Embedded Block RAM - EBR | 221 kbi |
最小工作温度 Minimum Operating Temperature | - 40 C |
系列 Packaging | Tray |
工厂包装数量 Factory Pack Quantity | 90 |
LAXP2-8E-5FTN256E | LAXP2-8E-5MN132E | LAXP2-8E-5TN144E | LAXP2-5E-5FTN256E | LAXP2-5E-5QN208E | LAXP2-5E-5MN132E | LAXP2-5E-5TN144E | LAXP2-8E-5QN208E | LAXP2-17E-5QN208E | LAXP2-17E-5FTN256E | |
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Manufacture | Lattice | Lattice | Lattice | Lattice | Lattice | Lattice | Lattice | Lattice | Lattice | Lattice |
产品种类 Product Category |
FPGA - Field Programmable Gate Array | FPGA - Field Programmable Gate Array | FPGA - Field Programmable Gate Array | FPGA - Field Programmable Gate Array | FPGA - Field Programmable Gate Array | FPGA - Field Programmable Gate Array | FPGA - Field Programmable Gate Array | FPGA - Field Programmable Gate Array | FPGA - Field Programmable Gate Array | FPGA - Field Programmable Gate Array |
RoHS | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Produc | XP2 | XP2 | XP2 | XP2 | XP2 | XP2 | XP2 | XP2 | XP2 | XP2 |
Number of Logic Elements | 8000 | 8000 | 8000 | 5000 | 5000 | 5000 | 5000 | 8000 | 17000 | 17000 |
Number of Logic Array Blocks - LABs | 1000 | 1000 | 1000 | 625 | 625 | 625 | 625 | 1000 | 2125 | 2125 |
Total Memory | 239 kbi | 239 kbi | 239 kbi | 176 kbi | 176 kbi | 176 kbi | 176 kbi | 239 kbi | 311 kbi | 311 kbi |
Number of I/Os | 201 | 86 | 100 | 172 | 146 | 86 | 100 | 146 | 146 | 201 |
工作电源电压 Operating Supply Voltage |
1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
最大工作温度 Maximum Operating Temperature |
+ 125 C | + 125 C | + 125 C | + 125 C | + 125 C | + 125 C | + 125 C | + 125 C | + 125 C | + 125 C |
安装风格 Mounting Style |
SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT |
封装 / 箱体 Package / Case |
ftBGA-256 | CSBGA-132 | TQFP-144 | ftBGA-256 | PQFP-208 | CSBGA-132 | TQFP-144 | PQFP-208 | PQFP-208 | ftBGA-256 |
Distributed RAM | 18 kbi | 18 kbi | 18 kbi | 10 kbi | 10 kbi | 10 kbi | 10 kbi | 18 kbi | 35 kbi | 35 kbi |
Embedded Block RAM - EBR | 221 kbi | 221 kbi | 221 kbi | 166 kbi | 166 kbi | 166 kbi | 166 kbi | 221 kbi | 276 kbi | 276 kbi |
最小工作温度 Minimum Operating Temperature |
- 40 C | - 40 C | - 40 C | - 40 C | - 40 C | - 40 C | - 40 C | - 40 C | - 40 C | - 40 C |
系列 Packaging |
Tray | Tray | Tray | Tray | Tray | Tray | Tray | Tray | Tray | Tray |
工厂包装数量 Factory Pack Quantity |
90 | 360 | 60 | 90 | 24 | 360 | 60 | 24 | 24 | 90 |
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