Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX25AEC
Rev. 10, 06/2013
i.MX25 Applications
Processor for
Automotive Products
Silicon Version 1.2
MCIMX25
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
1
Introduction
Ordering Information
See
Table 1 on page 3
for ordering information.
The i.MX25 family of processors are designed to
meet the connectivity requirements of today’s
automobile infotainment systems. To meet these
requirements, the i.MX25 processors provide
high-end features, such as CAN, USB connectivity,
and audio connectivity at a price point that is
suitable for all vehicles.
At the core of the i.MX25 is Freescale's fast,
proven, power-efficient implementation of the
ARM® 926EJ-S™ core, with speeds of up to
400 MHz. The i.MX25 includes support for up to
133 MHz DDR2 memory, integrated 10/100
Ethernet MAC, and two on-chip USB PHYs. The
automotive versions of the i.MX25 offer
AEC-Q100 grade 3 qualification to meet stringent
automotive quality requirements. The device is
suitable for a wide range of applications, including
the following:
• USB Connectivity for media
storage/playback, personal media device
interface, and firmware updates
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9
3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11
3.2. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18
3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 20
3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 20
3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 24
3.7. Module Timing and Electrical Parameters . . . . . . 41
4. Package Information and Contact Assignment . . . . . . 124
4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 124
4.2. Ground, Power, Sense, and Reference Contact
Assignments Case 17x17 mm, 0.8 mm Pitch . . . 125
4.3. Signal Contact Assignments—17 x 17 mm, 0.8 mm
Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 135
5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
© 2009-2013 Freescale Semiconductor, Inc. All rights reserved.
•
•
•
•
Bluetooth™ connectivity for hands free phone calling and streaming audio from wireless devices
like phones or PND
Control of the infotainment system through basic speech recognition or touch screen
Smart toll and metering applications
Secure data black box applications
Features of the i.MX25 processor include the following:
• Advanced power management—The heart of the device is a level of power management
throughout the IC that enables the multimedia features and peripherals to achieve minimum system
power consumption in active and various low-power modes. Power management techniques allow
the designer to deliver a feature-rich product that requires levels of power far lower than typical
industry expectations.
• Multimedia powerhouse—The multimedia performance of the i.MX25 processor is boosted by a
16 KB L1 instruction and data cache system and further enhanced by an LCD controller (with
alpha blending), a CMOS image sensor interface, an A/D controller (integrated touchscreen
controller), and a programmable Smart DMA (SDMA) controller.
• 128 Kbytes on-chip SRAM—The additional 128 Kbyte on-chip SRAM makes the device ideal for
eliminating external RAM in applications with small footprint RTOS. The on-chip SRAM allows
the designer to enable an ultra low power LCD refresh.
• Interface flexibility—The device interface supports connection to all common types of external
memories: MobileDDR, DDR, DDR2, NOR Flash, PSRAM, SDRAM and SRAM, NAND Flash,
and managed NAND.
• Increased security—Because the need for advanced security for tethered and untethered devices
continues to increase, the i.MX25 processor delivers hardware-enabled security features that
enable secure e-commerce, Digital Rights Management (DRM), information encryption, robust
tamper detection, secure boot, and secure software downloads.
• On-chip PHY—The device includes an HS USB OTG PHY and FS USB HOST PHY.
• Fast Ethernet—For rapid external communication, a Fast Ethernet Controller (FEC) is included.
• i.MX25 only supports Little Endian mode.
i.MX25 Applications Processor for Automotive Products, Rev. 10
2
Freescale Semiconductor
1.1
Ordering Information
Table 1. Ordering Information
Table 1
provides ordering information for the i.MX25.
Description
i.MX251
i.MX255
i.MX251
i.MX255
i.MX251
i.MX255
Part Number
MCIMX251AVM4
MCIMX255AVM4
MCIMX251AJM4
MCIMX255AJM4
MCIMX251AJM4A
MCIMX255AJM4A
Silicon
Version
1.1
1.1
1.1
1.1
1.2
1.2
Projected
Temperature
Range (°C)
–40 to +85
–40 to +85
–40 to +85
–40 to +85
–40 to +85
–40 to +85
Package
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Ballmap
Table 103
Table 103
Table 103
Table 103
Table 103
Table 103
Table 2
shows the functional differences between the different parts in the i.MX25 family.
Table 2. i.MX25 Parts Functional Differences
Features
Core
CPU Speed
L1 I/D Cache
On-chip SRAM
PATA/CE-ATA
LCD Controller
Touchscreen
CSI
FlexCAN (2)
ESAI
SIM (2)
Security
10/100 Ethernet
HS USB 2.0 OTG + PHY
HS USB 2.0 Host + PHY
12-bit ADC
SD/SDIO/MMC (2)
MCIMX251
ARM926EJ-S™
400 MHz
16K I/D
128 KB
—
—
—
—
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MCIMX255
ARM926EJ-S™
400MHz
16K I/D
128 KB
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
i.MX25 Applications Processor for Automotive Products, Rev. 10
Freescale Semiconductor
3
Table 2. i.MX25 Parts Functional Differences (continued)
Features
External Memory Controller
I
2
C (3)
SSI/I2S (2)
CSPI (2)
UART (5)
MCIMX251
Yes
Yes
Yes
Yes
Yes
MCIMX255
Yes
Yes
Yes
Yes
Yes
i.MX25 Applications Processor for Automotive Products, Rev. 10
4
Freescale Semiconductor
1.2
Block Diagram
NOR
Flash/
PSRAM
Figure 1
shows the simplified interface block diagram.
DDR2 /
MDDR
NAND
Flash
Ext. Graphics
Accelerator
Camera
Sensor
LCD Display 1
ARM Processor Domain (AP)
External Memory
Interface (EMI)
CSI
LCDC /
SLCDC
Smart
DMA
ARM9
Platform
ARM926EJ-S
L1 I/D cache
ARM Peripherals
SSI
AUDMUX
I
2
C(3)
HS USB OTG
HS USB OTG PHY
Shared
Domain
SPBA
HS USB Host
FS USB Host PHY
SDMA Peripherals
AVIC
MAX
AIPS(2)
ETM
UART(2)
CSPI
eSDHC(2)
FlexCAN(2)
ECT
ECT
IOMUX
IIM
RTICv3
RNGB
SCC
DRYICE
KPP
PWM(4)
Timers
RTC
WDOG
GPT(4)
GPIO(3)
EPIT(2)
SSI(1)
ESAI
UART(3)
CSPI(2)
ADC/TSC
SIM(2)
ATA
FEC
Internal
Memory
Fusebox
1-WIRE
Audio/Power
Management
JTAG
Bluetooth
MMC/SDIO
or WLAN
Keypad
Access.
Conn.
Figure 1. i.MX25 Simplified Interface Block Diagram
i.MX25 Applications Processor for Automotive Products, Rev. 10
Freescale Semiconductor
5
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
