Freescale Semiconductor
Technical Data
Document Number: MC56F825X
Rev. 4, 06/2014
MC56F825x/MC56F824x
44-pin LQFP
Case:
10 x 10 mm
2
48-pin LQFP
Case:
7 x 7 mm
2
MC56F825x/MC56F824x
Digital Signal Controller
The MC56F825x/MC56F824x is a member of the 56800E
core-based family of digital signal controllers (DSCs). It
combines, on a single chip, the processing power of a DSP
and the functionality of a microcontroller with a flexible set of
peripherals to create a cost-effective solution. Because of its
low cost, configuration flexibility, and compact program
code, it is well-suited for many applications. The
MC56F825x/MC56F824x includes many peripherals that are
especially useful for cost-sensitive applications, including:
• Industrial control
• Home appliances
• Smart sensors
• Fire and security systems
• Solar inverters
• Battery chargers and management
• Switched-mode power supplies and power management
• Power metering
• Motor control (ACIM, BLDC, PMSM, SR, and stepper)
• Handheld power tools
• Arc detection
• Medical devices/equipment
• Instrumentation
• Lighting ballast
The 56800E core is based on a modified Harvard-style
architecture consisting of three execution units operating in
parallel, allowing as many as six operations per instruction
cycle. The MCU-style programming model and optimized
instruction set allow straightforward generation of efficient,
compact DSP and control code. The instruction set is also
highly efficient for C compilers to enable rapid development
of optimized control applications.
The MC56F825x/MC56F824x supports program execution
from internal memories. Two data operands per instruction
cycle can be accessed from the on-chip data RAM. A full set
of programmable peripherals supports various applications.
Each peripheral can be independently shut down to save
power. Any pin, except Power pins and the Reset pin, can also
be configured as General Purpose Input/Outputs (GPIOs).
64-pin LQFP
Case:
10 x 10 mm
2
On-chip features include:
• 60 MHz operation frequency
• DSP and MCU functionality in a unified, C-efficient
architecture
• On-chip memory
– 56F8245/46: 48 KB (24K x 16) flash memory; 6 KB
(3K x 16) unified data/program RAM
– 56F8247: 48 KB (24K x 16) flash memory; 8 KB
(4K x 16) unified data/program RAM
– 56F8255/56/57: 64 KB (32K x 16) flash memory; 8 KB
(4K x 16) unified data/program RAM
• eFlexPWM with up to 9 channels, including 6 channels
with high (520 ps) resolution NanoEdge placement
• Two 8-channel, 12-bit analog-to-digital converters (ADCs)
with dynamic x2 and x4 programmable amplifier,
conversion time as short as 600 ns, and input
current-injection protection
• Three analog comparators with integrated 5-bit DAC
references
• Cyclic Redundancy Check (CRC) Generator
• Two high-speed queued serial communication interface
(QSCI) modules with LIN slave functionality
• Queued serial peripheral interface (QSPI) module
• Two SMBus-compatible inter-integrated circuit (I
2
C) ports
• Freescale’s scalable controller area network (MSCAN) 2.0
A/B module
• Two 16-bit quad timers (2 x 4 16-bit timers)
• Computer operating properly (COP) watchdog module
• On-chip relaxation oscillator: 8 MHz (400 kHz at standby
mode)
• Crystal/resonator oscillator
• Integrated power-on reset (POR) and low-voltage interrupt
(LVI) and brown-out reset module
• Inter-module crossbar connection
• Up to 54 GPIOs
• 44-pin LQFP, 48-pin LQFP, and 64-pin LQFP packages
• Single supply: 3.0 V to 3.6 V
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© Freescale Semiconductor, Inc., 2009-2011, 2014. All rights reserved.
Table of Contents
1
2
MC56F825x/MC56F824x Family Configuration . . . . . . . . . . . .3
Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2.1 MC56F825x/MC56F824x Features. . . . . . . . . . . . . . . . .4
2.2 Award-Winning Development Environment . . . . . . . . . .8
2.3 Architecture Block Diagram . . . . . . . . . . . . . . . . . . . . . .8
2.4 Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . 11
Signal/Connection Descriptions . . . . . . . . . . . . . . . . . . . . . . . 11
3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.2 Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
3.3 MC56F825x/MC56F824x Signal Pins . . . . . . . . . . . . . .18
Memory Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
4.2 Program Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
4.3 Data Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
4.4 Interrupt Vector Table and Reset Vector . . . . . . . . . . . .33
4.5 Peripheral Memory-Mapped Registers . . . . . . . . . . . . .34
4.6 EOnCE Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . .35
General System Control Information . . . . . . . . . . . . . . . . . . .36
5.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
5.2 Power Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
5.3 Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
5.4 On-chip Clock Synthesis. . . . . . . . . . . . . . . . . . . . . . . .37
5.5 Interrupt Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
5.6 System Integration Module (SIM) . . . . . . . . . . . . . . . . .39
5.7 Inter-Module Connections. . . . . . . . . . . . . . . . . . . . . . .40
5.8 Joint Test Action Group (JTAG)/Enhanced On-Chip
Emulator (EOnCE) . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
Security Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
6.1 Operation with Security Enabled. . . . . . . . . . . . . . . . . .46
6.2 Flash Access Lock and Unlock Mechanisms . . . . . . . .47
6.3 Product Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
7.1 General Characteristics . . . . . . . . . . . . . . . . . . . . . . . .48
7.2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . .49
7.3 ESD Protection and Latch-up Immunity . . . . . . . . . . . .50
7.4 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .50
7.5 Recommended Operating Conditions. . . . . . . . . . . . . .52
7.6 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . 53
7.7 Supply Current Characteristics . . . . . . . . . . . . . . . . . . 55
7.8 Power-On Reset, Low Voltage Detection Specification 56
7.9 Voltage Regulator Specifications . . . . . . . . . . . . . . . . . 56
7.10 AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . 56
7.11 Enhanced Flex PWM Characteristics . . . . . . . . . . . . . 57
7.12 Flash Memory Characteristics . . . . . . . . . . . . . . . . . . . 57
7.13 External Clock Operation Timing . . . . . . . . . . . . . . . . . 57
7.14 Phase Locked Loop Timing . . . . . . . . . . . . . . . . . . . . . 58
7.15 External Crystal or Resonator Requirement . . . . . . . . 59
7.16 Relaxation Oscillator Timing . . . . . . . . . . . . . . . . . . . . 59
7.17 Reset, Stop, Wait, Mode Select, and Interrupt Timing. 60
7.18 Queued Serial Peripheral Interface (SPI) Timing . . . . 60
7.19 Queued Serial Communication Interface (SCI) Timing 64
7.20 Freescale’s Scalable Controller Area Network (MSCAN)65
7.21 Inter-Integrated Circuit Interface (I2C) Timing . . . . . . . 65
7.22 JTAG Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
7.23 Quad Timer Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
7.24 COP Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
7.25 Analog-to-Digital Converter (ADC) Parameters. . . . . . 68
7.26 Digital-to-Analog Converter (DAC) Parameters. . . . . . 70
7.27 5-Bit Digital-to-Analog Converter (DAC) Parameters . 71
7.28 HSCMP Specifications. . . . . . . . . . . . . . . . . . . . . . . . . 71
7.29 Optimize Power Consumption . . . . . . . . . . . . . . . . . . . 71
8 Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
8.1 Thermal Design Considerations . . . . . . . . . . . . . . . . . 72
8.2 Electrical Design Considerations. . . . . . . . . . . . . . . . . 73
9 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
10 Package Mechanical Outline Drawings. . . . . . . . . . . . . . . . . 76
10.1 44-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
10.2 48-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
10.3 64-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
11 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Appendix A
Interrupt Vector Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
3
4
5
6
7
MC56F825x/MC56F824x Digital Signal Controller, Rev. 4
2
Freescale Semiconductor
MC56F825x/MC56F824x Family Configuration
1
MC56F825x/MC56F824x Family Configuration
Table 1. MC56F825x/MC56F824x Device Comparison
Feature
56F8245 56F8246 56F8247 56F8255 56F8256 56F8257
60
120
48
6
6
0
4
48
6
6
0
4
48
8
6
3
4
64
8
6
0
4
64
8
6
0
4
64
8
6
3
4
Table 1
compares the MC56F825x/MC56F824x devices.
Operation Frequency (MHz)
High Speed Peripheral Clock (MHz)
Flash memory size (KB) with 1024 words per page
RAM size (KB)
Enhanced
High resolution NanoEdge PWM (520 ps res.)
Flex PWM
Enhanced Flex PWM with Input Capture
(eFlexPWM)
PWM Fault Inputs (from Crossbar Input)
12-bit ADC with x1, 2x, 4x Programmable Gain
Analog comparators (ACMP) each with integrated 5-bit DAC
12-bit DAC
Cyclic Redundancy Check (CRC)
Inter-Integrated Circuit (I
2
C) / SMBus
Queued Serial peripheral Interface (QSPI)
High speed Queued Serial Communications Interface (QSCI)
1
Controller Area Network (MSCAN)
High Speed 16-bit multi-purpose timers (TMR)
2
Computer operating properly (COP) watchdog timer
Integrated Power-On Reset and low voltage detection
Phase-locked loop (PLL)
8 MHz (400 kHz at standby mode) on-chip ROSC
Crystal/resonator oscillator
Crossbar
Input pins
Output pins
General purpose I/O (GPIO)
3
IEEE 1149.1 Joint Test Action Group (JTAG) interface
Enhanced on-chip emulator (EOnCE)
Operating
temperature
range
Package
1
2
3
2 x 4Ch 2 x 5Ch 2 x 8Ch 2 x 4Ch 2 x 5 Ch 2 x 8 Ch
3
1
Yes
2
1
2
0
8
Yes
Yes
Yes
Yes
Yes
6
2
35
6
2
39
6
6
54
Yes
Yes
–40 °C to 105 °C
–40 °C to 125 °C
44LQFP 48LQFP 64LQFP 44LQFP 48LQFP 64LQFP
6
2
35
6
2
39
6
6
54
1
V temperature devices
M temperature devices
Can be clocked by high speed peripheral clock up to 120 MHz
Can be clocked by high speed peripheral clock up to 120 MHz
Shared with other function pins
MC56F825x/MC56F824x Digital Signal Controller, Rev. 4
Freescale Semiconductor
3
Overview
2
2.1
2.1.1
•
Overview
MC56F825x/MC56F824x Features
Core
Efficient 56800E digital signal processor (DSP) engine with modified Harvard architecture
— Three internal address buses
— Four internal data buses
As many as 60 million instructions per second (MIPS) at 60 MHz core frequency
155 basic instructions in conjunction with up to 20 address modes
32-bit internal primary data buses supporting 8-bit, 16-bit, and 32-bit data movement, addition, subtraction, and logical
operation
Single-cycle 16
16-bit parallel multiplier-accumulator (MAC)
Four 36-bit accumulators, including extension bits
32-bit arithmetic and logic multi-bit shifter
Parallel instruction set with unique DSP addressing modes
Hardware DO and REP loops
Instruction set supports DSP and controller functions
Controller-style addressing modes and instructions for compact code
Efficient C compiler and local variable support
Software subroutine and interrupt stack with depth limited only by memory
JTAG/enhanced on-chip emulation (EOnCE) for unobtrusive, processor speed–independent, real-time debugging
•
•
•
•
•
•
•
•
•
•
•
•
•
2.1.2
•
•
•
Operation Range
3.0 V to 3.6 V operation (power supplies and I/O)
From power-on-reset: approximately 2.7 V to 3.6 V
Ambient temperature operating range
— V temperature devices: –40 °C to +105 °C
— M temperature devices: –40 °C to +125 °C
2.1.3
•
•
•
•
•
•
Memory
Dual Harvard architecture that permits as many as three simultaneous accesses to program and data memory
48 KB (24K x 16) to 64 KB (32K x 16) on-chip flash memory with 2048 bytes (1024 x 16) page size
6 KB (3K x 16) to 8 KB (4K x 16) on-chip RAM with byte addressable
EEPROM emulation capability using flash
Support for 60 MHz program execution from both internal flash and RAM memories
Flash security and protection that prevent unauthorized users from gaining access to the internal flash
MC56F825x/MC56F824x Digital Signal Controller, Rev. 4
4
Freescale Semiconductor
Overview
2.1.4
•
Interrupt Controller
Five interrupt priority levels
— Three user programmable priority levels for each interrupt source: Level 0, 1, 2
— Unmaskable level 3 interrupts include: illegal instruction, hardware stack overflow, misaligned data access, and
SWI3 instruction
— Maskable level 3 interrupts include: EOnCE step counter, EOnCE breakpoint unit, and EOnCE trace buffer
— Lowest-priority software interrupt: level LP
Nested interrupts: higher priority level interrupt request can interrupt lower priority interrupt subroutine
Two programmable fast interrupts that can be assigned to any interrupt source
Notification to system integration module (SIM) to restart clock out of wait and stop states
Ability to relocate interrupt vector table
•
•
•
•
The masking of interrupt priority level is managed by the 56800E core.
2.1.5
•
Peripheral Highlights
One Enhanced Flex Pulse Width Modulator (eFlexPWM) module
— Up to nine output channels
— 16-bit resolution for center aligned, edge aligned, and asymmetrical PWMs
— Each complementary pair can operate with its own PWM frequency based and deadtime values
– 4 Time base
– Independent top and bottom deadtime insertion
— PWM outputs can operate as complimentary pairs or independent channels
— Independent control of both edges of each PWM output
— 6-channel NanoEdge high resolution PWM
– Fractional delay for enhanced resolution of the PWM period and edge placement
– Arbitrary eFlexPWM edge placement - PWM phase shifting
– NanoEdge implementation: 520 ps PWM frequency resolution
— 3 Channel PWM with full Input Capture features
– Three PWM Channels - PWMA, PWMB, and PWMX
– Enhanced input capture functionality
— Support for synchronization to external hardware or other PWM
— Double buffered PWM registers
– Integral reload rates from 1 to 16
– Half cycle reload capability
— Multiple output trigger events can be generated per PWM cycle via hardware
— Support for double switching PWM outputs
— Up to four fault inputs can be assigned to control multiple PWM outputs
– Programmable filters for fault inputs
— Independently programmable PWM output polarity
— Individual software control for each PWM output
— All outputs can be programmed to change simultaneously via a FORCE_OUT event
— PWMX pin can optionally output a third PWM signal from each submodule
— Channels not used for PWM generation can be used for buffered output compare functions
— Channels not used for PWM generation can be used for input capture functions
— Enhanced dual edge capture functionality
MC56F825x/MC56F824x Digital Signal Controller, Rev. 4
Freescale Semiconductor
5
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