digital signal processors & controllers - dsp, dsc 30mips 144 KB
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | QFP |
包装说明 | TFQFP, TQFP64,.47SQ |
针数 | 64 |
Reach Compliance Code | compli |
ECCN代码 | 3A991.A.2 |
Factory Lead Time | 7 weeks |
Samacsys Confidence | 3 |
Samacsys Status | Released |
Samacsys PartID | 458385 |
Samacsys Pin Cou | 64 |
Samacsys Part Category | Integrated Circui |
Samacsys Package Category | Quad Flat Packages |
Samacsys Footprint Name | (PT)64-Lead(TQFP)2003ve |
Samacsys Released Date | 2017-01-11 17:13:05 |
Is Samacsys | N |
具有ADC | YES |
其他特性 | ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10 MHZ |
地址总线宽度 | |
位大小 | 16 |
最大时钟频率 | 40 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | |
格式 | FIXED-POINT |
JESD-30 代码 | S-PQFP-G64 |
JESD-609代码 | e3 |
长度 | 10 mm |
湿度敏感等级 | 3 |
I/O 线路数量 | 52 |
端子数量 | 64 |
片上程序ROM宽度 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TFQFP |
封装等效代码 | TQFP64,.47SQ |
封装形状 | SQUARE |
封装形式 | FLATPACK, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 3/5 V |
认证状态 | Not Qualified |
RAM(字节) | 8192 |
RAM(字数) | 8192 |
ROM(单词) | 49152 |
ROM可编程性 | FLASH |
座面最大高度 | 1.2 mm |
速度 | 30 MHz |
最大压摆率 | 250 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 10 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
Base Number Matches | 1 |
DSPIC30F6012A-30I/PT | DSPIC30F6012A-20E/PT | DSPIC30F6012A-20E/PF | DSPIC30F6013A-20E/PT | DSPIC30F6013A-20E/PF | |
---|---|---|---|---|---|
描述 | digital signal processors & controllers - dsp, dsc 30mips 144 KB | digital signal processors & controllers - dsp, dsc 20mips 144 KB | digital signal processors & controllers - dsp, dsc 20mips 144 KB | digital signal processors & controllers - dsp, dsc 20mips 132 KB | digital signal processors & controllers - dsp, dsc 20mips 132 KB |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | QFP | QFP | QFP | QFP | QFP |
包装说明 | TFQFP, TQFP64,.47SQ | 10 X 10 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-64 | TQFP, TQFP64,.63SQ,32 | 12 X 12 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-80 | 14 X 14 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-80 |
针数 | 64 | 64 | 64 | 80 | 80 |
Reach Compliance Code | compli | compliant | compli | compli | compli |
ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
具有ADC | YES | YES | YES | YES | YES |
其他特性 | ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10 MHZ | ALSO OPERATES AT 3V MINIMUM SUPPLY AT 15 MHZ | ALSO OPERATES AT 3V MINIMUM SUPPLY AT 15 MHZ | ALSO OPERATES AT 3V MINIMUM SUPPLY AT 15 MHZ | ALSO OPERATES AT 3V MINIMUM SUPPLY AT 15 MHZ |
位大小 | 16 | 16 | 16 | 16 | 16 |
最大时钟频率 | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
DAC 通道 | NO | NO | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO |
格式 | FIXED-POINT | FIXED POINT | FIXED-POINT | FIXED POINT | FIXED POINT |
JESD-30 代码 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G80 | S-PQFP-G80 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
长度 | 10 mm | 10 mm | 14 mm | 12 mm | 14 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 |
I/O 线路数量 | 52 | 52 | 52 | 68 | 68 |
端子数量 | 64 | 64 | 64 | 80 | 80 |
片上程序ROM宽度 | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TFQFP | TFQFP | TQFP | TFQFP | TQFP |
封装等效代码 | TQFP64,.47SQ | TQFP64,.47SQ | TQFP64,.63SQ,32 | TQFP80,.55SQ | TQFP80,.63SQ,25 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 |
电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 8192 | 8192 | 8192 | 6144 | 6144 |
RAM(字数) | 8192 | 8192 | 8192 | 6144 | 6144 |
ROM(单词) | 49152 | 49152 | 49152 | 45056 | 45056 |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
速度 | 30 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
最大压摆率 | 250 mA | 250 mA | 180 mA | 180 mA | 250 mA |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.8 mm | 0.5 mm | 0.65 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 |
宽度 | 10 mm | 10 mm | 14 mm | 12 mm | 14 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
Factory Lead Time | 7 weeks | 13 weeks | - | 13 weeks | 13 weeks |
厂商名称 | - | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved