Freescale Semiconductor
Data Sheet:
Technical Data
An Energy-Efficient Solution from Freescale
Document Number: MC9S08MM128
Rev. 3, 10/2010
MC9S08MM128 series
Covers: MC9S08MM128, and MC9S08MM64, MC9S08MM32,
and MC9S08MM32A
8-Bit HCS08 Central Processor Unit (CPU)
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Up to 48-MHz CPU above 2.4 V, 40 MHz CPU above 2.1 V, and
20 MHz CPU above 1.8 V across temperature of -40°C to 105°C
HCS08 instruction set with added BGND instruction
Support for up to 33 interrupt/reset sources
128 K Dual Array Flash read/program/erase over full operating
voltage and temperature
12 KB Random-access memory (RAM)
Security circuitry to prevent unauthorized access to RAM and
Flash
Two ultra-low power stop modes. Peripheral clock enable register
can disable clocks to unused modules to reduce currents
Time of Day (TOD) — Ultra-low power 1/4 sec counter with up to
64s timeout.
Ultra-low power external oscillator that can be used in stop modes
to provide accurate clock source to the TOD. 6 usec typical wake
up time from stop3 mode
Oscillator (XOSC1) — Loop-control Pierce oscillator; 32.768 kHz
crystal or ceramic resonator dedicated for TOD operation.
Oscillator (XOSC2) — for high frequency crystal input for MCG
reference to be used for system clock and USB operations.
Multipurpose Clock Generator (MCG) — PLL and FLL; precision
trimming of internal reference allows 0.2% resolution and 2%
deviation over temperature and voltage; supports CPU
frequencies from 4 kHz to 48 MHz.
Watchdog computer operating properly (COP) reset Watchdog
computer operating properly (COP) reset with option to run from
dedicated 1-kHz internal clock source or bus clock
Low-voltage detection with reset or interrupt; selectable trip points;
separate low-voltage warning with optional interrupt; selectable
trip points
Illegal opcode and illegal address detection with reset
Flash block protection for each array to prevent accidental
write/erasure
Hardware CRC to support fast cyclic redundancy checks
Single-wire background debug interface
Real-time debug with 6 hardware breakpoints (4 PC, 1 address
and 1 data) Breakpoint capability to allow single breakpoint setting
during in-circuit debugging
On-chip in-circuit emulator (ICE) debug module containing 3
comparators and 9 trigger modes
CMT—
Carrier Modulator timer for remote control
communications. Carrier generator, modulator and driver for
dedicated infrared out. Can be used as an output compare timer.
IIC—
Up to 100 kbps with maximum bus loading; Multi-master
operation; Programmable slave address; Interrupt driven
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64-LQFP 10mm x 10mm
80-LQFP 12mm x 12mm
81-MapBGA 10mm x10mm
On-Chip Memory
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Power-Saving Modes
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Clock Source Options
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System Protection
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Development Support
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byte-by-byte data transfer; supports broadcast mode and 11-bit
addressing
PRACMP
— Analog comparator with selectable interrupt;
compare option to programmable internal reference voltage;
operation in stop3
SCI
— Two serial communications interfaces with optional 13-bit
break; option to connect Rx input to PRACMP output on SCI1 and
SCI2; High current drive on Tx on SCI1 and SCI2; wake-up from
stop3 on Rx edge
SPI1—
Serial peripheral interface (SPI) with 64-bit FIFO buffer;
16-bit or 8-bit data transfers; full-duplex or single-wire
bidirectional; double-buffered transmit and receive; master or
slave mode; MSB-first or LSB-first shifting
SPI2—
Serial peripheral interface with full-duplex or single-wire
bidirectional; Double-buffered transmit and receive; Master or
Slave mode; MSB-first or LSB-first shifting
TPM
— Two 4-channel Timer/PWM Module; Selectable input
capture, output compare, or buffered edge- or center-aligned
PWM on each channel; external clock input/pulse accumulator
USB
— Supports USB in full-speed device configuration. On-chip
transceiver and 3.3V regulator help save system cost, fully
compliant with USB Specification 2.0. Allows control, bulk,
interrupt and isochronous transfers. Not available on
MC9S08MM32A devices.
ADC16
— 16-bit Successive approximation ADC with up to 4
dedicated differential channels and 8 single-ended channels;
range compare function; 1.7 mV/C temperature sensor; internal
bandgap reference channel; operation in stop3; fully functional
from 3.6V to 1.8V, Configurable hardware trigger for 8 Channel
select and result registers
PDB
— Programmable delay block with 16-bit counter and
modulus and prescale to set reference clock to bus divided by 1 to
bus divided by 2048; 8 trigger outputs for ADC16 module provides
periodic coordination of ADC sampling sequence with sequence
completion interrupt; Back-to-Back mode and Timed mode
DAC
— 12-bit resolution; 16-word data buffers with configurable
watermark.
OPAMP
— Two flexible operational amplifiers configurable for
general operations; Low offset and temperature drift.
TRIAMP
— Two trans-impedance amplifiers dedicated for
converting current inputs into voltages.
Up to 47 GPIOs and 2 output-only pin and 1 input-only pin.
Voltage Reference output (VREFO).
Dedicated infrared output pin (IRO) with
high current sink capability.
Up to 16 KBI pins with selectable polarity.
81-MBGA 10x10 mm
80-LQFP 12x12 mm
64-LQFP 10x10 mm
Input/Output
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Peripherals
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Package Options
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Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© Freescale Semiconductor, Inc., 2009-2010. All rights reserved.
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
Contents
1 Devices in the MC9S08MM128 series. . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1.1 64-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1.2 80-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1.3 81-Pin MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.2 Pin Assignments by Packages . . . . . . . . . . . . . . . . . . . 10
2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.1 Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . . 13
2.2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . 14
2.3 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 15
2.4 ESD Protection Characteristics . . . . . . . . . . . . . . . . . . 16
2.5 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.6 Supply Current Characteristics . . . . . . . . . . . . . . . . . . . 20
2.7 PRACMP Electricals . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.8 12-Bit DAC Electricals. . . . . . . . . . . . . . . . . . . . . . . . . . 24
2.9 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.10 MCG and External Oscillator (XOSC) Characteristics .33
2.11 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
2.11.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . .36
2.11.2 TPM Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
2.12 SPI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
2.13 Flash Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .42
2.14 USB Electricals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
2.15 VREF Electrical Specifications . . . . . . . . . . . . . . . . . . .44
2.16 TRIAMP Electrical Parameters . . . . . . . . . . . . . . . . . . .46
2.17 OPAMP Electrical Parameters. . . . . . . . . . . . . . . . . . . .47
3 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
3.1 Device Numbering System . . . . . . . . . . . . . . . . . . . . . .48
3.2 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . .49
3.3 Mechanical Drawings . . . . . . . . . . . . . . . . . . . . . . . . . .49
4 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
Related Documentation
Find the most current versions of all documents at:
http://www.freescale.com.
Reference Manual
—MC9S08MM128RM
Contains extensive product information including modes of operation, memory,
resets and interrupts, register definition, port pins, CPU, and all module
information.
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2
Freescale Semiconductor
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
Devices in the MC9S08MM128 series
1
Devices in the MC9S08MM128 series
Table 1. MC9S08MM128 series Features by MCU and Package
Feature
MC9S08MM128
81
80
131072
12K
yes
yes
yes
yes
yes
16
47
16
46
12
8
yes
yes
yes
yes
yes
yes
yes
4
4
4
yes
yes
yes
yes
4
8
4
8
yes
yes
yes
yes
3
6
2
6
33
64
MC9S08MM64 MC9S08MM32 MC9S08MM32A
64
65535
12K
yes
yes
yes
yes
yes
6
33
12
8
yes
yes
yes
yes
yes
yes
yes
4
2
yes
yes
yes
yes
3
6
yes
yes
yes
yes
64
32768
4K
yes
yes
yes
yes
yes
6
33
12
8
yes
yes
yes
yes
yes
yes
yes
4
2
yes
yes
yes
yes
3
6
yes
yes
yes
yes
64
32768
2K
yes
yes
yes
yes
yes
6
33
12
8
yes
yes
yes
yes
yes
yes
yes
4
2
yes
yes
no
yes
3
6
yes
yes
yes
yes
The following table summarizes the feature set available in the MC9S08MM128 series of MCUs.
Pin quantity
FLASH size (bytes)
RAM size (bytes)
Programmable Analog Comparator (PRACMP)
Debug Module (DBG)
Multipurpose Clock Generator (MCG)
Inter-Integrated Communication (IIC)
Interrupt Request Pin (IRQ)
Keyboard Interrupt (KBI)
Port I/O
1
Dedicated Analog Input Pins
Power and Ground Pins
Time Of Day (TOD)
Serial Communications (SCI1)
Serial Communications (SCI2)
Serial Peripheral Interface 1 (SPI1 (FIFO))
Serial Peripheral Interface 2 (SPI2)
Carrier Modulator Timer pin (IRO)
TPM input clock pin (TPMCLK)
TPM1 channels
TPM2 channels
XOSC1
XOSC2
USB
Programmable Delay Block (PDB)
SAR ADC differential channels
2
SAR ADC single-ended channels
DAC ouput pin (DACO)
Voltage reference output pin (VREFO)
General Purpose OPAMP (OPAMP)
Trans-Impedance Amplifier (TRIAMP)
1
2
Port I/O count does not include two (2) output-only and one (1) input-only pins.
Each differential channel is comprised of 2 pin inputs.
Freescale Semiconductor
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
3
Devices in the MC9S08MM128 series
A complete description of the modules included on each device is provided in the following table.
Table 2. Versions of On-Chip Modules
Module
Analog-to-Digital Converter (ADC16)
General Purpose Operational Amplifier (OPAMP)
Trans-Impedance Operational Amplifier (TRIAMP)
Digital to Analog Converter (DAC)
Programmable Delay Block
Inter-Integrated Circuit (IIC)
Central Processing Unit (CPU)
On-Chip In-Circuit Debug/Emulator (DBG)
Multi-Purpose Clock Generator (MCG)
Low Power Oscillator (XOSCVLP)
Carrier Modulator Timer (CMT)
Programable Analog Comparator (PRACMP)
Serial Communications Interface (SCI)
Serial Peripheral Interface (SPI)
Time of Day (TOD)
Universal Serial Bus (USB)
1
Timer Pulse-Width Modulator (TPM)
System Integration Module (SIM)
Cyclic Redundancy Check (CRC)
Keyboard Interrupt (KBI)
Voltage Reference (VREF)
Voltage Regulator (VREG)
Interrupt Request (IRQ)
Flash Wrapper
GPIO
Port Control
1
Version
1
1
1
1
1
3
5
3
3
1
1
1
4
5
1
1
3
1
3
2
1
1
3
1
2
1
USB Module not available on MC9S08MM32A devices.
The block diagram in
Figure 1
shows the structure of the MC9S08MM128 series MCU.
4
Freescale Semiconductor
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
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