Document No
TRBP-XXOS002D
2011/3/14
3/15
Metal Thin Film Chip Resistors
( RBP series Standard )
Issued date
page
5. Ratings & Characteristics
Type
Power
Rating
at 70℃
Rated
Voltage
Max.
Working
Voltage
Max.
Over- Load
Voltage
T.C.R
(PPM/℃)
Resistance Range
Resistance
tolerance(%)
RBP06
1/8 W
Refer 5.2
75V
150V
±50
±100
±10
±25
±50
±100
±50
±100
±10
±25
±50
±100
±50
±100
±10
±25
±50
±100
±50
±100
±10
±25
±50
±100
±50
±100
±10
±25
±50
±100
±50
±100
±10
±25
±50
±100
1Ω~9.1Ω
±0.5~5
RBP06
1/8W
Refer 5.2
75V
150V
10Ω~390KΩ
± 0.1 ~ ±5
RBP10
1/4 W
Refer 5.2
150V
300V
1Ω~9.1Ω
±0.5~5
RBP10
1/4 W
Refer 5.2
150V
300V
10Ω~800KΩ
± 0.1 ~ ±5
RBP12
1/2 W
Refer 5.2
150V
300V
1Ω~9.1Ω
±0.5~5
RBP12
1/2 W
Refer 5.2
150V
300V
10Ω~1MΩ
± 0.1 ~ ±5
RBP13
1/2 W
Refer 5.2
150V
300V
1Ω~9.1Ω
±0.5~5
RBP13
1/2 W
Refer 5.2
150V
300V
10Ω~1MΩ
± 0.1 ~ ±5
RBP20
1W
Refer 5.2
150V
300V
1Ω~9.1Ω
±0.5~5
RBP20
1W
Refer 5.2
150V
300V
10Ω~1MΩ
± 0.1 ~ ±5
RBP25
2W
Refer 5.2
150V
300V
1Ω~9.1Ω
±0.5~5
RBP25
2W
Refer 5.2
150V
300V
10Ω~1MΩ
± 0.1 ~ ±5
Operating Temp(℃): -55℃ ~ +155℃
Note : Except for the above standardized products, we also provide the
customized products.
TA-I TECHNOLOGY CO., LTD
Document No
TRBP-XXOS002D
2011/3/14
4/15
Metal Thin Film Chip Resistors
( RBP series Standard )
Issued date
page
5.1 Derating Curve :
For resistors operated at ambient temperature over 70℃ , power rating shall be derated
according to figure 1.
100
P max.
Power ratio ( % )
50
0
-55
50
70
100
155
Ambient
Figure 1
Temp. (
C
)
5.2 Rated Voltage:
The rated voltage is calculated by the following formula:
E= P * R
E=
Rated Voltage(V)
P=
Rated Power(W)
R=
Resistance Value
(Ω
TA-I TECHNOLOGY CO., LTD
Document No
TRBP-XXOS002D
2011/3/14
5/15
Metal Thin Film Chip Resistors
( RBP series Standard )
Issued date
page
6. Reliability Tests:( As specified in JIS C 5201-1 or IEC60115-1)
Reference
standard
Temperature Coefficient of IEC60115-1-4.8
Resistance
JIS C5201-1-4.8
IEC60115-1-4.19
Rapid Change of Temp.
JIS C 5201-1-4.19
IEC60115-1-4.13
Short Time Overload
JIS C5201-1-4.13
Test Items
Resistance to Dry Heat
Load Life
Resistance to Solder Heat
Bending
Condition of Test
+25 ~ +125
℃
Test Limits
Refer 5.0
-55℃(30 min. ) / +155℃(30 min. ),
±(0.5%+0.05Ω)
300 cycles
2.5 X rated voltage for 5sec
±(0.5%
+ 0.05Ω)
±(0.5%
+0.05Ω)
IEC60115-1-4.23.2
155±5℃ for 96±4Hrs
JIS C5201-1-4.23.2
IEC60115-1-4.25.1 1000 hours at rated power , 70℃ ,
±(0.5%
+0.05Ω)
JIS C5201-1-4.25.1 1.5hours “ON “, 0.5hour “OFF”
IEC60115-1-4.18
JIS C5201-1-4.18
IEC60115-1-4.33
JIS C5201-1-4.33
260
±5℃
solder , 10
±1
sec dwell .
±(0.1%
+0.05Ω)
3mm deflection
±(0.5%
+0.05Ω)
Dielectric
Withstanding IEC60115-1-4.7
Voltage (Voltage Proof)
JIS C5201-1-4.7
Load Life with Humidity
IEC60115-1-4.24
JIS C5201-1-4.24
Applying voltage :
No abnormalities such
0402 & 0603 : 300V The other
as flashover, burning
500V
dielectric
breakdown
for a minute .
shall appear.
1000 hours 85°C/85%RH. Note:
Specified conditions: 10% of
operating power(not exceeding max
±(0.5%
+0.05Ω)
working voltage). Measurement at
24±2 hours after test conclusion.
Applying voltage 100V for 1 minute.
≧1GΩ
At least 95% of surface
245
±5℃
solder, 2
±0.5
sec dwell. area of electrode shall
Solder : Sn96.5 / Ag3.0 / Cu0.5
be covered with new
solder.
Insulation Resistance
IEC60115-1-4.6
JIS C5201-1-4.6
Solderability
IEC60115-1-4.17
JIS C5201-1-4.17
Note* :RCWV : Rated continuous working voltage .
TA-I TECHNOLOGY CO., LTD
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
