电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

EPF10K100EFC484-2N

产品描述fpga - field programmable gate array fpga - flex 10k 624 labs 338 ios
产品类别可编程逻辑器件    可编程逻辑   
文件大小1MB,共100页
制造商Altera (Intel)
标准
下载文档 详细参数 全文预览

EPF10K100EFC484-2N在线购买

供应商 器件名称 价格 最低购买 库存  
EPF10K100EFC484-2N - - 点击查看 点击购买

EPF10K100EFC484-2N概述

fpga - field programmable gate array fpga - flex 10k 624 labs 338 ios

EPF10K100EFC484-2N规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Altera (Intel)
零件包装代码BGA
包装说明BGA, BGA484,22X22,40
针数484
Reach Compliance Codecompli
ECCN代码3A991
JESD-30 代码S-PBGA-B484
JESD-609代码e1
长度23 mm
湿度敏感等级3
I/O 线路数量338
输入次数338
逻辑单元数量4992
输出次数338
端子数量484
最高工作温度70 °C
最低工作温度
组织338 I/O
输出函数MIXED
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA484,22X22,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)260
电源2.5,2.5/3.3 V
可编程逻辑类型LOADABLE PLD
传播延迟0.5 ns
认证状态Not Qualified
座面最大高度2.1 mm
最大供电电压2.625 V
最小供电电压2.375 V
标称供电电压2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间40
宽度23 mm

文档预览

下载PDF文档
FLEX 10KE
®
Embedded Programmable
Logic Device
Data Sheet
January 2003, ver. 2.5
Features...
Embedded programmable logic devices (PLDs), providing
system-on-a-programmable-chip (SOPC) integration in a single
device
Enhanced embedded array for implementing megafunctions
such as efficient memory and specialized logic functions
Dual-port capability with up to 16-bit width per embedded array
block (EAB)
Logic array for general logic functions
High density
30,000 to 200,000 typical gates (see
Tables 1
and
2)
Up to 98,304 RAM bits (4,096 bits per EAB), all of which can be
used without reducing logic capacity
System-level features
MultiVolt
TM
I/O pins can drive or be driven by 2.5-V, 3.3-V, or
5.0-V devices
Low power consumption
Bidirectional I/O performance (t
SU
and
t
CO
) up to 212 MHz
Fully compliant with the PCI Special Interest Group (PCI SIG)
PCI Local Bus Specification, Revision 2.2
for 3.3-V operation at
33 MHz or 66 MHz
-1 speed grade devices are compliant with
PCI Local Bus
Specification, Revision 2.2,
for 5.0-V operation
Built-in Joint Test Action Group (JTAG) boundary-scan test
(BST) circuitry compliant with IEEE Std. 1149.1-1990, available
without consuming additional device logic
f
For information on 5.0-V FLEX
®
10K or 3.3-V FLEX 10KA devices, see the
FLEX 10K Embedded Programmable Logic Family Data Sheet.
Table 1. FLEX 10KE Device Features
Feature
Typical gates
(1)
Maximum system gates
Logic elements (LEs)
EABs
Total RAM bits
Maximum user I/O pins
Altera Corporation
DS-F10KE-2.5
EPF10K30E
30,000
119,000
1,728
6
24,576
220
EPF10K50E
EPF10K50S
50,000
199,000
2,880
10
40,960
254
1

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 69  1984  1177  2850  2060  16  38  46  50  35 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved