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EPF10K100ABC356-2

产品描述fpga - field programmable gate array fpga - flex 10k 624 labs 274 ios
产品类别可编程逻辑器件    可编程逻辑   
文件大小2MB,共128页
制造商Altera (Intel)
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EPF10K100ABC356-2概述

fpga - field programmable gate array fpga - flex 10k 624 labs 274 ios

EPF10K100ABC356-2规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Altera (Intel)
零件包装代码BGA
包装说明BGA-356
针数356
Reach Compliance Codenot_compliant
ECCN代码3A991
JESD-30 代码S-PBGA-B356
JESD-609代码e0
长度35 mm
湿度敏感等级3
专用输入次数4
I/O 线路数量274
输入次数274
逻辑单元数量4992
输出次数274
端子数量356
最高工作温度70 °C
最低工作温度
组织4 DEDICATED INPUTS, 274 I/O
输出函数REGISTERED
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装等效代码BGA356,26X26,50
封装形状SQUARE
封装形式GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度)220
电源2.5/3.3,3.3 V
可编程逻辑类型LOADABLE PLD
传播延迟0.7 ns
认证状态Not Qualified
座面最大高度1.63 mm
最大供电电压3.6 V
最小供电电压3 V
标称供电电压3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度35 mm
Base Number Matches1

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Includes
FLEX 10KA
FLEX 10K
Embedded Programmable
Logic Device Family
Data Sheet
®
January 2003, ver. 4.2
Features...
The industry’s first embedded programmable logic device (PLD)
family, providing System-on-a-Programmable-Chip (SOPC)
integration
Embedded array for implementing megafunctions, such as
efficient memory and specialized logic functions
Logic array for general logic functions
High density
10,000 to 250,000 typical gates (see
Tables 1
and
2)
Up to 40,960 RAM bits; 2,048 bits per embedded array block
(EAB), all of which can be used without reducing logic capacity
System-level features
MultiVolt
TM
I/O interface support
5.0-V tolerant input pins in FLEX
®
10KA devices
Low power consumption (typical specification less than 0.5 mA
in standby mode for most devices)
FLEX 10K and FLEX 10KA devices support peripheral
component interconnect Special Interest Group (PCI SIG)
PCI
Local Bus Specification, Revision 2.2
FLEX 10KA devices include pull-up clamping diode, selectable
on a pin-by-pin basis for 3.3-V PCI compliance
Select FLEX 10KA devices support 5.0-V PCI buses with eight or
fewer loads
Built-in Joint Test Action Group (JTAG) boundary-scan test
(BST) circuitry compliant with IEEE Std. 1149.1-1990, available
without consuming any device logic
Table 1. FLEX 10K Device Features
Feature
Typical gates (logic and RAM)
(1)
Maximum system gates
Logic elements (LEs)
Logic array blocks (LABs)
Embedded array blocks (EABs)
Total RAM bits
Maximum user I/O pins
EPF10K10
EPF10K10A
10,000
31,000
576
72
3
6,144
150
EPF10K20
20,000
63,000
1,152
144
6
12,288
189
EPF10K30
EPF10K30A
30,000
69,000
1,728
216
6
12,288
246
EPF10K40
40,000
93,000
2,304
288
8
16,384
189
EPF10K50
EPF10K50V
50,000
116,000
2,880
360
10
20,480
310
Altera Corporation
DS-F10K-4.2
1

 
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