digital signal processors & controllers - dsp, dsc 16b dsc 28ld32kb motor40 mips
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP28,.31 |
| 针数 | 28 |
| Reach Compliance Code | compli |
| ECCN代码 | 3A991.A.2 |
| Factory Lead Time | 18 weeks |
| 具有ADC | YES |
| 地址总线宽度 | |
| 桶式移位器 | YES |
| 位大小 | 16 |
| 边界扫描 | YES |
| 最大时钟频率 | 40 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| 格式 | FIXED-POINT |
| 集成缓存 | NO |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | R-PDIP-T28 |
| JESD-609代码 | e3 |
| 长度 | 34.671 mm |
| 低功率模式 | YES |
| 外部中断装置数量 | 3 |
| I/O 线路数量 | 21 |
| 端子数量 | 28 |
| 计时器数量 | 3 |
| 片上数据RAM宽度 | 8 |
| 片上程序ROM宽度 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.31 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT APPLICABLE |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 2048 |
| ROM可编程性 | FLASH |
| 筛选级别 | TS 16949 |
| 座面最大高度 | 5.08 mm |
| 速度 | 40 MHz |
| 最大压摆率 | 300 mA |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT APPLICABLE |
| 宽度 | 7.62 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, CONTROLLER |
| DSPIC33FJ32MC202-E/SP | DSPIC33FJ32MC204-I/PT | DSPIC33FJ32MC202T-I/MM | DSPIC33FJ32MC202-I/MM | DSPIC33FJ32MC202T-I/SO | DSPIC33FJ32MC204T-I/ML | DSPIC33FJ16MC304T-I/PT | DSPIC33FJ16MC304-E/PT | DSPIC33FJ32MC202-E/SO | DSPIC33FJ16MC304-E/ML | |
|---|---|---|---|---|---|---|---|---|---|---|
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| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | DIP | QFP | QFN | QFN | SOIC | QFN | QFP | QFP | SOIC | QFN |
| 包装说明 | DIP, DIP28,.31 | TQFP, TQFP44,.47SQ,32 | HVQCCN, LCC28,.24SQ,25 | HVQCCN, LCC28,.24SQ,25 | 7.50 MM, LEAD FREE, PLASTIC, SOIC-28 | 8 X 8 MM, LEAD FREE, PLASTIC, QFN-44 | TQFP, TQFP44,.47SQ,32 | TQFP, TQFP44,.47SQ,32 | 7.50 MM, LEAD FREE, PLASTIC, SOIC-28 | HVQCCN, LCC44,.32SQ,25 |
| 针数 | 28 | 44 | 28 | 28 | 28 | 44 | 44 | 44 | 28 | 44 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compliant | compliant | compliant |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
| Factory Lead Time | 18 weeks | 4 weeks 5 days | 19 weeks | 19 weeks | 18 weeks | 19 weeks | 19 weeks | 19 weeks | 18 weeks | 6 weeks |
| 具有ADC | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 位大小 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最大时钟频率 | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 格式 | FIXED-POINT | FLOATING POINT | FLOATING POINT | FIXED-POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FIXED-POINT | FLOATING POINT | FLOATING POINT |
| JESD-30 代码 | R-PDIP-T28 | S-PQFP-G44 | S-PQCC-N28 | S-PQCC-N28 | R-PDSO-G28 | S-PQCC-N44 | S-PQFP-G44 | S-PQFP-G44 | R-PDSO-G28 | S-PQCC-N44 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 34.671 mm | 10 mm | 6 mm | 6 mm | 17.9 mm | 8 mm | 10 mm | 10 mm | 17.9 mm | 8 mm |
| I/O 线路数量 | 21 | 35 | 21 | 21 | 21 | 35 | 35 | 35 | 21 | 35 |
| 端子数量 | 28 | 44 | 28 | 28 | 28 | 44 | 44 | 44 | 28 | 44 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | TQFP | HVQCCN | HVQCCN | SOP | HVQCCN | TQFP | TQFP | SOP | HVQCCN |
| 封装等效代码 | DIP28,.31 | TQFP44,.47SQ,32 | LCC28,.24SQ,25 | LCC28,.24SQ,25 | SOP28,.4 | LCC44,.32SQ,25 | TQFP44,.47SQ,32 | TQFP44,.47SQ,32 | SOP28,.4 | LCC44,.32SQ,25 |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | FLATPACK, THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | FLATPACK, THIN PROFILE | FLATPACK, THIN PROFILE | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT APPLICABLE | 260 | 260 | 260 | 250 | 260 | 260 | 260 | 250 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 2048 | 1024 | 1024 | 2048 | 1024 | 1024 | 1024 | 2048 | 1024 | 1024 |
| ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 座面最大高度 | 5.08 mm | 1.2 mm | 1 mm | 1 mm | 2.65 mm | 1 mm | 1.2 mm | 1.2 mm | 2.65 mm | 1 mm |
| 速度 | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| 最大压摆率 | 300 mA | 70 mA | 70 mA | 300 mA | 70 mA | 70 mA | 70 mA | 300 mA | 80 mA | 80 mA |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) | Matte Tin (Sn) - annealed |
| 端子形式 | THROUGH-HOLE | GULL WING | NO LEAD | NO LEAD | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 2.54 mm | 0.8 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.8 mm | 0.8 mm | 1.27 mm | 0.65 mm |
| 端子位置 | DUAL | QUAD | QUAD | QUAD | DUAL | QUAD | QUAD | QUAD | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT APPLICABLE | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| 宽度 | 7.62 mm | 10 mm | 6 mm | 6 mm | 7.5 mm | 8 mm | 10 mm | 10 mm | 7.5 mm | 8 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, CONTROLLER | MICROCONTROLLER | MICROCONTROLLER | DIGITAL SIGNAL PROCESSOR, CONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | DIGITAL SIGNAL PROCESSOR, CONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| 厂商名称 | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | - | Microchip(微芯科技) |
| 湿度敏感等级 | - | 3 | 1 | 1 | 1 | 1 | 3 | 3 | 1 | 1 |
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