ADVANCED
®
INTERCONNECTIONS
®
Ball Grid Array
Socketing System
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BGAAdapters
BGA
Ball Grid Array
BGA
Adapter
BGA
Adapter
BGA
Adapter
Socket
Solder
Joints
BGA
Adapter
Socket
PCB
PCB
Before Soldering
AfterSoldering
Features:
Soldering BGA to adapter subjects
BGA to less thermal stress than
soldering BGA to a mother board
due to the adapters lower mass.
Countersink in head of pin allows
easy positioning of BGA onto
adapter.
Head above insulator in adapter
allows visual inspection for solder
shorts in both X & Y axis.
Custom adapters available for heat
sink attachment.
Extraction slot for tool #5082-2
shown on page 163.
Terminals:
Brass - Copper Alloy 360,
ASTM-B-16
Plating:
Terminal TL: Tin Lead over Nickel
Terminal G: Gold over Nickel
BodyMaterial:
FR-4 Glass Epoxy, U.L. Rated 94V-O
Terminals
Type-638
FR-4 only
StandardAdapter
(Mates with Standard Socket)
BGA Body + .079/(2.0)
.039/(1.0)
B.G.A.
Detail C
ExtractionSlotAdapter
(Mates with Extraction Slot & Guide Box Socket)
BGA Body + .157/(4.0)
.079/(2.0)
B.G.A.
Detail A
Surface Mount
Sockets
HowToOrder
1FGAXXX638X
FootprintDash#
If Applicable
BodyType
F - FR-4
M - Molded
Pitch
B = .059 (1.5mm) Pitch
G = .050 (1.27mm) Pitch
A
= Standard Adapter
(BGA Body + .079(2mm))
AX
= Extraction Slot Adapter
(BGA Body + .157(4mm))
TerminalPlating
G - Gold
T - Tin
TerminalType
See Left
Type-647
Molded only
.031/(0.78)
Dia. C' Sink
.182
(4.62)
.193
(4.90)
.018/(0.45)
Dia.
.018/(0.45)
Dia.
NumberofPins
96 - 736
See BGA Footprint pages
Rev. 14-A
inch/(mm)
Page155