Freescale Semiconductor
Technical Data
Document Number: MRF6VP3091N
Rev. 1, 12/2011
RF Power LDMOS Transistors
Enhancement--Mode Lateral MOSFETs
Designed for commercial and industrial broadband applications with
frequencies from 470 to 860 MHz. Devices are suitable for use in broadcast
applications.
•
Typical Performance (Broadband Reference Circuit): V
DD
= 50 Volts,
I
DQ
= 450 mA, 64 QAM, Input Signal PAR = 9.5 dB @ 0.01% Probability
on CCDF.
P
out
(W)
18 Avg.
f
(MHz)
470
650
860
G
ps
(dB)
21.8
21.6
21.7
η
D
(%)
31.0
26.4
27.6
Output
Signal PAR
(dB)
7.9
8.4
7.1
IMD
Shoulder
(dBc)
--27.8
--37.6
--30.4
MRF6VP3091NR1
MRF6VP3091NR5
MRF6VP3091NBR1
MRF6VP3091NBR5
470-
-860 MHz, 90 W, 50 V
BROADBAND
RF POWER LDMOS TRANSISTORS
Signal Type
DVB--T (8k OFDM)
Features
•
Capable of Handling 10:1 VSWR, All Phase Angles, @ 50 Vdc, 860 MHz,
90 Watts CW Output Power
•
Characterized with Series Equivalent Large--Signal Impedance Parameters
•
Internally Input Matched for Ease of Use
•
Qualified Up to a Maximum of 50 V
DD
Operation
•
Excellent Thermal Stability
•
Device can be used Single--Ended or in a Push--Pull Configuration
•
Integrated ESD Protection
•
Greater Negative Gate--Source Voltage Range for Improved Class C
Operation
•
225°C Capable Plastic Package
•
In Tape and Reel. R1 Suffix = 500 Units, 44 mm Tape Width, 13 inch Reel.
R5 Suffix = 50 Units, 56 mm Tape Width, 13 inch Reel.
CASE 1486-
-03, STYLE 1
TO-
-270 WB-
-4
PLASTIC
MRF6VP3091NR1(NR5)
CASE 1484-
-04, STYLE 1
TO-
-272 WB-
-4
PLASTIC
MRF6VP3091NBR1(NBR5)
PARTS ARE PUSH-
-PULL
Gate 1
Drain 1
Table 1. Maximum Ratings
Rating
Drain--Source Voltage
Gate--Source Voltage
Storage Temperature Range
Case Operating Temperature
Operating Junction Temperature
(1,2)
Symbol
V
DSS
V
GS
T
stg
T
C
T
J
Value
--0.5, +115
--6.0, +10
--65 to +150
150
225
Unit
Vdc
Vdc
°C
°C
°C
Gate 2
Drain 2
(Top View)
Note: Exposed backside of the package is
the source terminal for the transistor.
Figure 1. Pin Connections
Table 2. Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Case
Case Temperature 76°C, 18 W CW, 50 Vdc, I
DQ
= 350 mA, 860 MHz
Case Temperature 80°C, 90 W CW, 50 Vdc, I
DQ
= 350 mA, 860 MHz
Symbol
R
θJC
Value
(2,3)
0.79
0.82
Unit
°C/W
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF
calculators by product.
3. Refer to AN1955,
Thermal Measurement Methodology of RF Power Amplifiers.
Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
©
Freescale Semiconductor, Inc., 2011. All rights reserved.
MRF6VP3091NR1
MRF6VP3091NR5 MRF6VP3091NBR1 MRF6VP3091NBR5
1
RF Device Data
Freescale Semiconductor, Inc.
Table 3. ESD Protection Characteristics
Test Methodology
Human Body Model (per JESD22--A114)
Machine Model (per EIA/JESD22--A115)
Charge Device Model (per JESD22--C101)
Class
2 (2001--4000 V)
B (201--400 V)
IV (>1000 V)
Table 4. Moisture Sensitivity Level
Test Methodology
Per JESD22--A113, IPC/JEDEC J--STD--020
Rating
3
Package Peak Temperature
260
Unit
°C
Table 5. Electrical Characteristics
(T
A
= 25°C unless otherwise noted)
Characteristic
Off Characteristics
(1)
Gate--Source Leakage Current
(V
GS
= 5 Vdc, V
DS
= 0 Vdc)
Drain--Source Breakdown Voltage
(I
D
= 50 mA, V
GS
= 0 Vdc)
Zero Gate Voltage Drain Leakage Current
(V
DS
= 50 Vdc, V
GS
= 0 Vdc)
Zero Gate Voltage Drain Leakage Current
(V
DS
= 100 Vdc, V
GS
= 0 Vdc)
On Characteristics
Gate Threshold Voltage
(1)
(V
DS
= 10 Vdc, I
D
= 100
μAdc)
Gate Quiescent Voltage
(V
DD
= 50 Vdc, I
D
= 350 mAdc, Measured in Functional Test)
Drain--Source On--Voltage
(1)
(V
GS
= 10 Vdc, I
D
= 0.25 Adc)
Dynamic Characteristics
Reverse Transfer Capacitance
(2)
(V
DS
= 50 Vdc
±
30 mV(rms)ac @ 1 MHz, V
GS
= 0 Vdc)
Output Capacitance
(2)
(V
DS
= 50 Vdc
±
30 mV(rms)ac @ 1 MHz, V
GS
= 0 Vdc)
Input Capacitance
(2)
(V
DS
= 50 Vdc, V
GS
= 0 Vdc
±
30 mV(rms)ac @ 1 MHz)
C
rss
C
oss
C
iss
—
—
—
41
65.4
591
—
—
—
pF
pF
pF
V
GS(th)
V
GS(Q)
V
DS(on)
0.9
2.0
—
1.6
2.7
0.2
2.4
3.5
—
Vdc
Vdc
Vdc
I
GSS
V
(BR)DSS
I
DSS
I
DSS
—
115
—
—
—
—
—
—
0.5
—
10
20
μAdc
Vdc
μAdc
μAdc
Symbol
Min
Typ
Max
Unit
Functional Tests
(In Freescale Single--Ended Narrowband Test Fixture, 50 ohm system) V
DD
= 50 Vdc, I
DQ
= 350 mA, P
out
= 18 W Avg.,
f = 860 MHz, DVB--T (8k OFDM) Single Channel. ACPR measured in 7.61 MHz Channel Bandwidth @
±4
MHz Offset @ 4 kHz Bandwidth.
Power Gain
Drain Efficiency
Adjacent Channel Power Ratio
Input Return Loss
1. Each side of device measured separately.
2. Part internally input matched.
G
ps
η
D
ACPR
IRL
21.0
27.5
—
—
22.0
28.5
--62.0
--14
24.0
—
--60.0
--9
dB
%
dBc
dB
MRF6VP3091NR1 MRF6VP3091NR5 MRF6VP3091NBR1 MRF6VP3091NBR5
2
RF Device Data
Freescale Semiconductor, Inc.
V
BIAS
+
C1
R1
C2
C3
Z8
Z10
C4 R2
+
C8
C9
C10
V
SUPPLY
RF
INPUT
Z1
C5
Z2
Z3
Z4
Z5
Z6
Z7
DUT
Z9
Z12
Z13
Z14
Z15 Z16
Z17
C14
Z18
RF
OUTPUT
C6
C7
Z11
C15
C11
C12
C13
+
C16
C17
C18
Z1
Z2
Z3
Z4
Z5
Z6
Z7
Z8
Z9
0.266″
×
0.067″ Microstrip
0.331″
×
0.067″ Microstrip
0.598″
×
0.067″ Microstrip
0.315″
×
0.276″ Microstrip
0.054″
×
0.669″ Microstrip
0.419″
×
0.669″ Microstrip
0.256″
×
0.669″ Microstrip
0.986″
×
0.071″ Microstrip
0.201″
×
0.571″ Microstrip
Z10, Z11
Z12
Z13
Z14
Z15
Z16
Z17
Z18
1.292″
×
0.079″ Microstrip
0.680″
×
0.571″ Microstrip
0.132″
×
0.117″ Microstrip
0.705″
×
0.117″ Microstrip
0.159″
×
0.117″ Microstrip
0.140″
×
0.067″ Microstrip
0.077″
×
0.067″ Microstrip
0.163″
×
0.067″ Microstrip
Figure 2. MRF6VP3091NR1(NBR1) 860 MHz Single-
-Ended Narrowband Test Circuit Schematic
Table 6. MRF6VP3091NR1(NBR1) 860 MHz Single-
-Ended Narrowband Test Circuit Component Designations and
Values
Part
C1
C2, C9, C17
C3, C5, C8, C14, C16
C4
C6
C7
C10, C18
C11, C15
C12
C13
R1
R2
PCB
Description
22
μF,
35 V Tantalum Capacitor
10
μF,
50 V Chip Capacitors
43 pF Chip Capacitors
6.2 pF Chip Capacitor
2.2 pF Chip Capacitor
9.1 pF Chip Capacitor
220
μF,
100 V Electrolytic Capacitors
7.5 pF Chip Capacitors
3.0 pF Chip Capacitor
0.7 pF Chip Capacitor
10 kΩ, 1/4 W Chip Resistor
10
Ω,
1/4 W Chip Resistor
0.030″,
ε
r
= 3.5
Part Number
T491X226K035AT
GRM55DR61H106KA88L
ATC100B430JT500XT
ATC100B6R2BT500XT
ATC100B2R2JT500XT
ATC100B9R1CT500XT
EEVFK2A221M
ATC100B7R5CT500XT
ATC100B3R0CT500XT
ATC100B0R7BT500XT
CRCW120610KOJNEA
CRCW120610ROJNEA
RF--35
Manufacturer
Kermet
Murata
ATC
ATC
ATC
ATC
Panasonic--ECG
ATC
ATC
ATC
Vishay
Vishay
Taconic
MRF6VP3091NR1 MRF6VP3091NR5 MRF6VP3091NBR1 MRF6VP3091NBR5
RF Device Data
Freescale Semiconductor, Inc.
3
C1
C10
C8
R1
C2
C3
C9
C4
R2
CUT OUT AREA
C15
C11
C5
C6
C7
MRF6V3090N
Rev. 0
C12
C16
C17
C18
--
Figure 3. MRF6VP3091NR1(NBR1) 860 MHz Single-
-Ended Narrowband Test Circuit Component Layout
MRF6VP3091NR1 MRF6VP3091NR5 MRF6VP3091NBR1 MRF6VP3091NBR5
4
RF Device Data
Freescale Semiconductor, Inc.
--
C14
C13
TYPICAL CHARACTERISTICS
1000
C
iss
24
23
G
ps
, POWER GAIN (dB)
C, CAPACITANCE (pF)
22
21
20
19
18
17
50
1
10
P
out
, OUTPUT POWER (WATTS)
100
η
D
G
ps
V
DD
= 50 Vdc, I
DQ
= 350 mA, f = 860 MHz
70
60
50
40
30
20
10
0
200
η
D,
DRAIN EFFICIENCY (%)
100
C
oss
C
rss
10
0
Measured with
±30
mV(rms)ac @ 1 MHz, V
GS
= 0 Vdc
10
20
30
40
V
DS
, DRAIN--SOURCE VOLTAGE (VOLTS)
Figure 4. Capacitance versus Drain-
-Source Voltage
Figure 5. CW Power Gain and Drain Efficiency
versus Output Power (Single-
-Ended
Narrowband Test Circuit)
25
I
DQ
= 350 mA, f = 860 MHz
56
55
P
out
, OUTPUT POWER (dBm)
54
53
52
51
50
49
48
47
--6
--5
P3dB = 51.28 dBm (134.3 W)
P2dB = 51.06 dBm (127.6 W)
Ideal
24
23
G
ps
, POWER GAIN (dB)
22
21
20
19
18
17
16
4
P1dB = 50.7 dBm (117.5 W)
Actual
50 V
45 V
V
DD
= 40 V
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
P
out
, OUTPUT POWER (WATTS)
V
DD
= 50 Vdc, I
DQ
= 350 mA, f = 860 MHz
--4
--3
--2
--1
0
1
2
3
P
in
, INPUT POWER (dBm)
Figure 6. CW Output Power versus Input Power
(Single-
-Ended Narrowband Test Circuit)
25
24
G
ps
, POWER GAIN (dB)
23
22
21
20
19
18
85_C
G
ps
T
C
= --30_C
Figure 7. CW Power Gain versus Output Power
(Single-
-Ended Narrowband Test Circuit)
70
60
η
D,
DRAIN EFFICIENCY (%)
85_C
50
25_C
40
30
η
D
20
10
0
200
V
DD
= 50 Vdc, I
DQ
= 350 mA, f = 860 MHz
T
C
= --30_C
25_C
1
10
P
out
, OUTPUT POWER (WATTS)
100
Figure 8. CW Power Gain and Drain Efficiency
versus Output Power versus Temperature
(Single-
-Ended Narrowband Test Circuit)
MRF6VP3091NR1 MRF6VP3091NR5 MRF6VP3091NBR1 MRF6VP3091NBR5
RF Device Data
Freescale Semiconductor, Inc.
5