REVISIONS
LTR
A
DESCRIPTION
Add device type 02. Add ground bounce limits. Change input high and low
current. Change quiescent supply current, delta. Change input and input/output
capacitance. Change propagation delay times for device type 01 - jak.
Change I
IH
, I
IL
,
∆I
CC
, V
OLP
, V
OLV
, V
OHP
, and V
OHV
for device type 02.
B
C
D
Editorial changes throughout. - jak.
Changes IAW NOR 5962-058-98 – jak.
Correct V
OH3
and I
IL
in Table I. Editorial changes throughout – jak.
DATE (YR-MO-DA)
95-04-05
APPROVED
Monica L. Poelking
97-09-22
Thomas M. Hess
98-03-27
99-11-24
Monica L. Poelking
Monica L. Poelking
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
D
15
D
16
D
17
REV
SHEET
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
D
12
D
13
D
14
PREPARED BY
Joseph A. Kerby
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Thanh V. Nguyen
APPROVED BY
Monica L. Poelking
DRAWING APPROVAL DATE
93-12-15
REVISION LEVEL
D
MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR
CMOS, OCTAL TRANSCEIVER WITH THREE-STATE
OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC
SILICON
SIZE
CAGE CODE
AMSC N/A
A
SHEET
67268
1
OF
17
5962-92148
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E021-00
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
92148
01
Q
R
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
\/
Drawing number
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
54ABT245
54ABT245A
Circuit function
Octal Bus transceiver with 3-state outputs TTL compatible inputs
Octal Bus transceiver with 3-state outputs TTL compatible inputs
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
R
S
2
Descriptive designator
GDIP1-T20 or CDIP2-T20
GDFP2-F20 or CDFP3-F20
CQCC1-N20
Terminals
20
20
20
Package style
Dual-in-line
Flat pack
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
D
5962-92148
SHEET
2
1.3 Absolute maximum ratings. 1/ 2/ 3/
Supply voltage range (V
CC
)..............................................................................
DC input voltage range except I/O ports (V
IN
)...................................................
DC output voltage range (V
OUT
) .......................................................................
DC input clamp current (I
IK
) .............................................................................
DC output clamp current (I
OK
)..........................................................................
DC output current (I
OL
) (per output) .................................................................
Storage temperature range (T
STG
) ...................................................................
Lead temperature (soldering, 10 seconds) .......................................................
Thermal resistance, junction-to-case (θ
JC
) .......................................................
Junction temperature (T
J
) ................................................................................
Maximum power dissipation (P
D
) .....................................................................
1.4 Recommended operating conditions. 2/ 3/
Supply voltage range (V
CC
) (Operating) ...........................................................
Input voltage range (V
IN
)..................................................................................
Output voltage range (V
OUT
) ............................................................................
Maximum low level input voltage (V
IL
)..............................................................
Maximum high level input voltage (V
IH
) ............................................................
Case operating temperature range (T
C
) ...........................................................
Maximum input rise and fall rate (∆t/∆V)..........................................................
Maximum high level output current (I
OH
) ..........................................................
Maximum low level output current (I
OL
) ............................................................
+4.5 V dc to +5.5 V dc
+0.0 V dc to V
CC
+0.0 V dc to V
CC
0.8 V
2.0 V
-55°C to +125°C
5 ns/V
-24 mA
48 mA
-0.5 V dc to +7.0 V dc
-0.5 V dc to +7.0 V dc 4/
-0.5 V dc to +5.5 V dc 4/
-18 mA
-50 mA
+96 mA
-65°C to +150°C
+300°C
See MIL-STD-1835
+175°C
500 mW
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this
drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the
Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
MIL-STD-973
MIL-STD-1835
_____
1/
2/
3/
4/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels
may degrade performance and affect reliability.
Unless otherwise noted, all voltages are referenced to GND.
The limits for the parameters specified herein shall apply over the full specified V
CC
range and case temperature range of -55°C to
+125°C.
The input and output negative voltage ratings may be exceeded provided that the input and output clamp current ratings are observed.
-
-
-
Test Method Standard Microcircuits.
Configuration Management.
Interface Standard For Microcircuit Case Outlines.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
D
5962-92148
SHEET
3
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103
MIL-HDBK-780
-
-
List of Standard Microcircuit Drawings (SMD's).
Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this
drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has
been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-
38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.
3.2.5 Ground bounce test circuit and waveforms. The ground bounce test circuit and waveforms shall be as specified on figure 4.
3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5.
3.2.7 Radiation exposure circuit. The radiation exposure circuit shall be as specified when available.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical
performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating
temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each
subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed
in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked.
Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with
MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-
38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed
manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall
be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate
of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's
product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-
PRF-38535, appendix A and herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
D
5962-92148
SHEET
4
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or
for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 126 See MIL-PRF-38535, appendix A).
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be
in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing or acquiring activity upon request. The
test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance
with the intent specified in test method 1015.
(2) T
A
= +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein.
4.2.2 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in
the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be
maintained under document revision level control of the device manufacturer's Technology Review Board
(TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity
upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable,
in accordance with the intent specified in test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II herein.
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for
groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.3.1 Electrostatic discharge sensitivity qualification inspection . Electrostatic discharge sensitivity (ESDS) testing shall
be performed in accordance with MIL-STD-883, method 3015. ESDS testing shall be measured only for initial qualification
and after process or design changes which may affect ESDS classification.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
D
5962-92148
SHEET
5
微控制器 MCU
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