High-Performance Impact<TM> PAL<R> Circuits 28-LCCC -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QLCC |
| 包装说明 | HQCCN, LCC28,.45SQ |
| 针数 | 28 |
| Reach Compliance Code | _compli |
| ECCN代码 | 3A001.A.2.C |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 28.5 MHz |
| JESD-30 代码 | S-CQCC-N28 |
| 长度 | 11.43 mm |
| 专用输入次数 | 14 |
| I/O 线路数量 | 6 |
| 输入次数 | 20 |
| 输出次数 | 8 |
| 产品条款数 | 64 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 14 DEDICATED INPUTS, 6 I/O |
| 输出函数 | COMBINATORIAL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | HQCCN |
| 封装等效代码 | LCC28,.45SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 可编程逻辑类型 | OT PLD |
| 传播延迟 | 25 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 2.03 mm |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 11.43 mm |
| Base Number Matches | 1 |
| TIBPAL20L8-20MFKB | 8412904KA | 8412904XA | 8412903LA | TIBPAL20R8-20MFKB | TIBPAL20R6-20MWB | |
|---|---|---|---|---|---|---|
| 描述 | High-Performance Impact<TM> PAL<R> Circuits 28-LCCC -55 to 125 | High-Performance Impact<TM> PAL<R> Circuits 24-CFP -55 to 125 | High-Performance Impact<TM> PAL<R> Circuits 28-LCCC -55 to 125 | High-Performance Impact PAL Circuits 24-CDIP -55 to 125 | High-Performance Impact<TM> PAL<R> Circuits 28-LCCC -55 to 125 | High-Performance Impact<TM> PAL<R> Circuits 24-CFP -55 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QLCC | DFP | QLCC | DIP | QLCC | DFP |
| 包装说明 | HQCCN, LCC28,.45SQ | DFP, FL24,.4 | HQCCN, LCC28,.45SQ | DIP, DIP24,.3 | HQCCN, LCC28,.45SQ | DFP, FL24,.4 |
| 针数 | 28 | 24 | 28 | 24 | 28 | 24 |
| Reach Compliance Code | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| 最大时钟频率 | 28.5 MHz | 28.5 MHz | 28.5 MHz | 28.5 MHz | 28.5 MHz | 28.5 MHz |
| JESD-30 代码 | S-CQCC-N28 | R-GDFP-F24 | S-CQCC-N28 | R-GDIP-T24 | S-CQCC-N28 | R-GDFP-F24 |
| 长度 | 11.43 mm | 14.355 mm | 11.43 mm | 32.005 mm | 11.43 mm | 14.355 mm |
| 专用输入次数 | 14 | 12 | 12 | 12 | 12 | 12 |
| I/O 线路数量 | 6 | 4 | 4 | 2 | - | 2 |
| 输入次数 | 20 | 16 | 16 | 14 | 12 | 14 |
| 输出次数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 产品条款数 | 64 | 64 | 64 | 64 | 64 | 64 |
| 端子数量 | 28 | 24 | 28 | 24 | 28 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 14 DEDICATED INPUTS, 6 I/O | 12 DEDICATED INPUTS, 4 I/O | 12 DEDICATED INPUTS, 4 I/O | 12 DEDICATED INPUTS, 2 I/O | 12 DEDICATED INPUTS, 0 I/O | 12 DEDICATED INPUTS, 2 I/O |
| 输出函数 | COMBINATORIAL | MIXED | MIXED | MIXED | REGISTERED | MIXED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | HQCCN | DFP | HQCCN | DIP | HQCCN | DFP |
| 封装等效代码 | LCC28,.45SQ | FL24,.4 | LCC28,.45SQ | DIP24,.3 | LCC28,.45SQ | FL24,.4 |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG | FLATPACK | CHIP CARRIER, HEAT SINK/SLUG | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
| 传播延迟 | 25 ns | 25 ns | 25 ns | 25 ns | 20 ns | 25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-STD-883 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 座面最大高度 | 2.03 mm | 2.29 mm | 2.03 mm | 5.08 mm | 2.03 mm | 2.29 mm |
| 最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 11.43 mm | 9.085 mm | 11.43 mm | 7.62 mm | 11.43 mm | 9.085 mm |
| 是否无铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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