IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, FP-16, Multiplexer/Demultiplexer
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DFP, FL16,.3 |
| Reach Compliance Code | unknow |
| 系列 | ACT |
| JESD-30 代码 | R-GDFP-F16 |
| JESD-609代码 | e0 |
| 长度 | 9.6645 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER |
| 最大I（ol） | 0.024 A |
| 功能数量 | 1 |
| 输入次数 | 8 |
| 输出次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装等效代码 | FL16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| Prop。Delay @ Nom-Su | 16 ns |
| 传播延迟（tpd） | 16 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class S |
| 座面最大高度 | 2.032 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 6.604 mm |
| Base Number Matches | 1 |
| 5962-8875601SFA | 5962R8875601BEA | JM54ACT151S2A-R | 5962R8875601BFA | WCR0402-1K58FA | |
|---|---|---|---|---|---|
| 描述 | IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, FP-16, Multiplexer/Demultiplexer | IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDIP16, CERDIP-16, Multiplexer/Demultiplexer | IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CQCC20, CERAMIC, LCC-20, Multiplexer/Demultiplexer | IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDFP16, CERPACK-16, Multiplexer/Demultiplexer | Fixed Resistor, 0.063W, 1580ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 |
| 包装说明 | DFP, FL16,.3 | DIP, DIP16,.3 | CERAMIC, LCC-20 | DFP, FL16,.3 | SMT, 0402 |
| Reach Compliance Code | unknow | compliant | compliant | compliant | compliant |
| 端子数量 | 16 | 16 | 20 | 16 | 2 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 155 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装形式 | FLATPACK | IN-LINE | CHIP CARRIER | FLATPACK | SMT |
| 表面贴装 | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | METAL GLAZE/THICK FILM |
| 系列 | ACT | ACT | ACT | ACT | - |
| JESD-30 代码 | R-GDFP-F16 | R-GDIP-T16 | S-CQCC-N20 | R-GDFP-F16 | - |
| JESD-609代码 | e0 | e0 | - | e0 | e3 |
| 长度 | 9.6645 mm | 19.43 mm | 8.89 mm | 9.6645 mm | - |
| 负载电容（CL） | 50 pF | 50 pF | - | 50 pF | - |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | - |
| 最大I（ol） | 0.024 A | 0.024 A | - | 0.024 A | - |
| 功能数量 | 1 | 1 | 1 | 1 | - |
| 输入次数 | 8 | 8 | 8 | 8 | - |
| 输出次数 | 1 | 1 | 1 | 1 | - |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | - |
| 封装代码 | DFP | DIP | QCCN | DFP | - |
| 封装等效代码 | FL16,.3 | DIP16,.3 | - | FL16,.3 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | - |
| 电源 | 5 V | 5 V | - | 5 V | - |
| 传播延迟（tpd） | 16 ns | 16 ns | 16 ns | 16 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 筛选级别 | MIL-PRF-38535 Class S | MIL-STD-883 | - | MIL-STD-883 | - |
| 座面最大高度 | 2.032 mm | 5.08 mm | 1.905 mm | 2.032 mm | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | - |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | - | Tin/Lead (Sn/Pb) - hot dipped | MATTE TIN OVER NICKEL |
| 端子形式 | FLAT | THROUGH-HOLE | NO LEAD | FLAT | - |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | - |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | - |
| 宽度 | 6.604 mm | 7.62 mm | 8.89 mm | 6.604 mm | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
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