RB495D
40V, 350mA, SMD Schottky Diode
Small Signal Diode
3
A
SOT-23
F
1
2
B
E
Features
Epitaxial planar die construction
Surface device type mounting
Mositure sensitivity level 1
Matte tin (Sn) lead finishe with Nickel (Ni) underplate
Pb-free version and RoHS compliant
Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code.
C
D
H
G
Dimensions
A
B
C
D
E
F
G
H
Unit (mm)
Min
2.80
1.20
0.30
1.80
2.25
0.90
0.08
Max
3.00
1.40
0.50
2.00
2.55
1.20
0.19
Unit (inch)
Min
0.110
0.047
0.012
0.071
0.089
0.035
0.003
Max
0.118
0.055
0.020
0.079
0.100
0.047
0.010
Mechanical Data
Case : SOT- 23 small outline plastic package
Terminal: Matte tin plated, lead free, solderable
per MIL-STD-202, Method 208 guranteed
High temperature soldering guaranted: 260℃/10s
Weight: 0.008 grams (approximate)
Marking:D3Q
0.550 REF
0.022 REF
Ordering Information
Part No.
RB495D
RB495D
Packing Code Package
RF
RFG
SOT-23
SOT-23
Packing
3K / 7" Reel
3K / 7" Reel
Marking
D3Q
D3Q
Suggested PAD Layout
0.95
0.037
2.0
0.079
0.9
0.035
Maximum Ratings
Rating at 25°C ambient temperature unless otherwise specified.
0.8
0.031
Maximum Ratings
Type Number
Power dissipation
Repetitive Peak Reverse Voltage
Reverse Voltage
Mean Forward Current
Non-Repetitive Peak Forward Surge Current ( Note 1)
Junction Temperature
Storage Temperature Range
Note 1: Mean output current per element: I
O
/2.
Note 2: The suggested land pattern dimensions have been provided for reference only,
as actual pad layouts may vary despending on application.
Symbol
P
D
V
RRM
V
R
I
O
I
FSM
T
J
T
STG
Value
200
40
25
350
1.5
125
-40 ~+125
Units
mW
V
V
mA
A
℃
℃
Version : E10
RB495D
40V, 350mA, SMD Schottky Diode
Small Signal Diode
Electrical Characteristics
Type Number
Reverse Breakdown Voltage
Forward Voltage
Reverse Leakage Current
Junction Capacitance
I
R
= 100uA
I
F
= 10mA
I
F
= 200mA
V
R
= 25V
V
R
=0, f=1.0MHz
Symbol
V
(BR)
V
F
I
R
C
J
Min
40
-
-
-
-
Max
-
0.32
0.55
70
50.0
Units
V
V
uA
pF
Carrier & Reel specification
TSC label
Top Cover Tape
Item
Carrier depth
Sprocket hole
Reel outside diameter
Reel inner diameter
Feed hole width
Sprocke hole position
Punch hole position
Sprocke hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
Symbol
K
D
A
D1
D2
E
F
P0
P1
T
W
W1
Dimension(mm)
2.40 Max.
1.50 +0.10
178 ± 1
50 Min.
13.0 ± 0.5
1.75 ±0.10
3.50 ±0.05
4.00 ±0.10
2.00 ±0.10
0.6 Max.
8.30 Max.
14.4 Max.
Carieer Tape
Any Additional Label (If Required)
Macking
W1
User direction of Feed
A
D2
D1
Note 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be
within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10o within the determined cavity.
Note 2: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders.
Version : E10
RB495D
40V, 350mA, SMD Schottky Diode
Small Signal Diode
Rating and Characteristic Curves
FIG 1 Typical Forward Characteristics
1000
1000
FIG 2 Reverse Current vs Reverse Voltage
Ta=75°C
100
Forward Current (mA)
Reverse Current (nA)
100
10
Ta=75°
Ta=25°C
Ta=25°C
10
1
1
0.1
0.01
0
0.2
0.4
0.6
0.8
0.1
0
10
20
30
40
50
60
70
80
90
100
Instantanceous Forward Voltage (V)
Reverse Voltage (V)
FIG 3 Admissible Power Dissipation Curve
250
70
60
FIG 4 Typical Junction Capacitance
Power Dissipation (mW)
200
Total Capacitance (pF)
50
40
30
20
10
150
100
Macking
50
Reverse Voltage (V)
0
0
25
50
75
100
125
150
0
0
5
10
15
20
25
30
35
40
Ambient Temperature (°C)
Reverse Voltage (V)
Version : E10
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