MIXA30W1200TED
Six-Pack
XPT IGBT
V
CES
= 1200 V
I
C25
= 43 A
V
CE(sat)
= 1.8 V
Part name
(Marking on product)
MIXA30W1200TED
25, 26
15, 16
1
17
2
NTC
5
6
9
10
23, 24
21, 22
19, 20
E 72873
18
3
4
27, 28
7
8
11
12
13, 14
Pin configuration see outlines.
Features:
• Easy paralleling due to the positive
temperature coefficient of the on-state
voltage
• Rugged XPT design
(Xtreme light Punch Through) results in:
- short circuit rated for 10 µsec.
- very low gate charge
- square RBSOA @ 3x I
C
- low EMI
• Thin wafer technology combined with
the XPT design results in a competitive
low V
CE(sat)
• SONIC™ diode
- fast and soft reverse recovery
- low operating forward voltage
Application:
• AC motor drives
• Solar inverter
• Medical equipment
• Uninterruptible power supply
• Air-conditioning systems
• Welding equipment
• Switched-mode and
resonant-mode power supplies
Package:
• "E2-Pack" standard outline
• Insulated copper base plate
• Soldering pins for PCB mounting
• Temperature sense included
IXYS reserves the right to change limits, test conditions and dimensions.
20100622b
© 2010 IXYS All rights reserved
1-6
MIXA30W1200TED
Ouput Inverter T1 - T6
Ratings
Symbol
V
CES
V
GES
V
GEM
I
C25
I
C80
P
tot
V
CE(sat)
V
GE(th)
I
CES
I
GES
Q
G(on)
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
RBSOA
SCSOA
t
SC
I
SC
R
thJC
Definitions
collector emitter voltage
max. DC gate voltage
max. transient collector gate voltage
collector current
Conditions
T
VJ
= 25°C
continuous
transient
T
C
= 25°C
T
C
= 80°C
T
C
= 25°C
I
C
= 25 A; V
GE
= 15 V
I
C
= 1 mA; V
GE
= V
CE
V
CE
= V
CES
; V
GE
= 0 V
V
GE
= ±20 V
V
CE
= 600 V; V
GE
= 15 V; I
C
= 25 A
inductive load
V
CE
= 600 V; I
C
= 25 A
V
GE
= ±15 V; R
G
= 39
W
V
GE
= ±15 V; R
G
= 39
W;
T
VJ
= 125°C
T
VJ
= 25°C
T
VJ
= 125°C
T
VJ
= 25°C
T
VJ
= 25°C
T
VJ
= 125°C
min.
typ.
max.
1200
±20
±30
43
30
150
Unit
V
V
V
A
A
W
V
V
V
mA
mA
nA
nC
ns
ns
ns
ns
mJ
mJ
total power dissipation
collector emitter saturation voltage
gate emitter threshold voltage
collector emitter leakage current
gate emitter leakage current
total gate charge
turn-on delay time
current rise time
turn-off delay time
current fall time
turn-on energy per pulse
turn-off energy per pulse
reverse bias safe operating area
short circuit safe operating area
short circuit duration
short circuit current
thermal resistance junction to case
1.8
2.1
5.4
6.0
0.01
0.2
76
70
40
250
100
2.5
3.0
2.1
6.5
2.1
500
T
VJ
= 125°C
V
CEK
= 1200 V
T
VJ
= 125°C
75
10
100
0.84
A
µs
A
K/W
V
CE
= 900 V; V
GE
= ±15 V;
R
G
= 39
W;
non-repetitive
(per IGBT)
Output Inverter D1 - D6
Ratings
Symbol
V
RRM
I
F25
I
F80
V
F
Q
rr
I
RM
t
rr
E
rec
R
thJC
Definitions
max. repetitve reverse voltage
forward current
forward voltage
reverse recovery charge
max. reverse recovery current
reverse recovery time
reverse recovery energy
thermal resistance junction to case
Conditions
T
VJ
= 25°C
T
C
= 25°C
T
C
= 80°C
I
F
= 30 A; V
GE
= 0 V
V
R
= 600 V
di
F
/dt = -600 A/µs
I
F
= 30 A; V
GE
= 0 V
(per diode)
T
VJ
= 25°C
T
VJ
= 125°C
T
VJ
= 125°C
min.
typ.
max.
1200
44
29
Unit
V
A
A
V
V
µC
A
ns
mJ
1.95
1.95
3.5
30
350
0.9
2.2
1.2
T
C
= 25°C unless otherwise stated
K/W
IXYS reserves the right to change limits, test conditions and dimensions.
20100622b
© 2010 IXYS All rights reserved
2-6
MIXA30W1200TED
Temperature Sensor NTC
Symbol
R
25
B
25/50
Definitions
resistance
Conditions
T
C
= 25°C
min.
4.75
Ratings
typ. max.
5.0
5.25
3375
Unit
kW
K
Module
Symbol
T
VJ
T
VJM
T
stg
V
ISOL
CTI
M
d
d
S
d
A
R
pin-chip
R
thCH
Weight
Definitions
operating temperature
max. virtual junction temperature
storage temperature
isolation voltage
comparative tracking index
mounting torque (M5)
creep distance on surface
strike distance through air
resistance pin to chip
thermal resistance case to heatsink
Conditions
min.
-40
-40
Ratings
typ. max.
125
150
125
2500
-
Unit
°C
°C
°C
V~
Nm
mm
mm
I
ISOL
< 1 mA; 50/60 Hz
3
10
7.5
2.5
with heatsink compound
0.02
180
6
mW
K/W
g
Equivalent Circuits for Simulation
I
V
0
R
0
Symbol
V
0
R
0
V
0
R
0
Definitions
IGBT
free wheeling diode
Conditions
T1 - T6
D1 - D6
min.
T
VJ
= 150°C
T
VJ
= 150°C
Ratings
typ. max.
1.1
55
1.2
27
Unit
V
mW
V
mW
T
C
= 25°C unless otherwise stated
IXYS reserves the right to change limits, test conditions and dimensions.
20100622b
© 2010 IXYS All rights reserved
3-6
MIXA30W1200TED
Circuit Diagram
25, 26
15, 16
1
17
NTC
2
5
6
9
10
23, 24
21, 22
19, 20
18
3
4
27, 28
7
8
11
12
13, 14
Outline Drawing
3.5
-0.5
Y
Ø 2.1; l=6
Z
Dimensions in mm (1 mm = 0.0394“)
Detail X
±0.02
Detail Y
15°
±1°
20.5
±0.1
7
-0.5
17
±0.5
0.8
baseplate typ. 100 µm convex
over 75 mm before mounting
Detail Z
82.3
75.7
72.7
38.88
23.64
42.69
57.93
61.74
19.83
73.17
76.98
0
86.1
±0.1
Ø6
+0.3
Ø 2.5
Ø 2.1
1.5
0.8
1.2
±0.05
±0.05
B
24 23
±0.2
X
22 21
20 19
18 17
16
15
20.95
11.43
7.62
0
7.62
38.4
32
±0.2
25
26
Ø5.5
45
11
27
28
1 2
3 4
5 6
7 8
9 10
1112
14
13
A
11.43
20.95
31.26
50.31
54.12
61.74
65.55
16.02
19.83
38.88
27.45
42.69
93
107.5
±0.2
±0.3
Product Marking
Part number
M
I
X
A
30
W
1200
T
ED
= Module
= IGBT
= XPT
= Standard
= Current Rating [A]
= Six-Pack
= Reverse Voltage [V]
= NTC
= E2-Pack
Ordering
Standard
Part Name
MIXA30W1200 TED
Marking on Product
MIXA30W1200TED
73.17
76.98
j n0.4 A B
Delivering Mode Base Qty Ordering Code
Box
6
508635
20100622b
IXYS reserves the right to change limits, test conditions and dimensions.
6
© 2010 IXYS All rights reserved
4-6
MIXA30W1200TED
Inverter T1 - T6
50
40
30
I
C
[A]
20
V
GE
= 15 V
50
40
V
GE
= 15 V
17 V
19 V
13 V
11 V
T
VJ
= 25°C
T
VJ
= 125°C
I
C
30
T
VJ
= 125°C
[A]
20
9V
10
0
10
0
0
1
V
CE
[V]
2
3
0
1
2
V
CE
[V]
3
4
5
Fig. 1 Typ. output characteristics
Fig. 2 Typ. output characteristics
20
I
C
= 25 A
V
CE
= 600 V
15
50
40
I
C
30
[A]
V
GE
[V]
T
VJ
= 125°C
10
20
10
0
5
T
VJ
= 25°C
5
6
7
8
9
V
GE
[V]
10
11
12
13
0
0
20
40
60
80
100
Q
G
[nC]
Fig. 4 Typ. turn-on gate charge
E
on
Fig. 3 Typ. tranfer characteristics
6
5
E
4.0
3.5
3.0
E
off
E
[mJ]
E
off
E
on
R
G
= 39
Ω
V
CE
= 600 V
V
GE
= ±15 V
T
VJ
= 125°C
4
2.5
2.0
1.5
1.0
[mJ]
3
2
1
0
I
C
=
25 A
V
CE
= 600 V
V
GE
= ±15 V
T
VJ
= 125°C
0.5
0
10
20
30
40
50
I
C
[A]
Fig. 5 Typ. switching energy vs. collector current
IXYS reserves the right to change limits, test conditions and dimensions.
0.0
20
40
60
80
100 120 140 160
R
G
[Ω]
Fig. 6 Typ. switching energy vs. gate resistance
20100622b
© 2010 IXYS All rights reserved
5-6
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