SM30TY
Automotive 3000 W Transil™
Datasheet
−
production data
A
•
ISO 7637-2
(a)
:
– Pulse 1: V
S
= -100 V
– Pulse 2a: V
S
= +50 V
– Pulse 3a: V
S
= -150 V
– Pulse 3b: V
S
= +100 V
Description
K
Unidirectional
Bidirectional
SMC
(JEDEC DO-214AB)
The SM30TY Transil series has been designed to
protect automotive sensitive circuits against
surges defined in ISO 7637-2 and against
electrostatic discharges according to ISO 10605.
The Planar technology makes it compatible with
high-end circuits where low leakage current and
high junction temperature are required to provide
reliability and stability over time. The SM30TY
devices are packaged in SMC (SMC footprint in
accordance with IPC 7531 standard).
Features
•
Peak pulse power:
– 3000 W (10/1000 µs)
– Up to 28 kW (8/20 µs)
•
Stand off voltage range: from 13 V to 33 V
•
Unidirectional and bidirectional types
•
Operating T
j max
: 150 °C
•
High power capability at T
jmax
:
– 2200 W (10/1000 µs)
•
JEDEC registered package outline
•
Resin meets UL 94, V0
•
AEC-Q101 qualified
Complies with the following standards
•
ISO 10605 - C = 150 pF, R = 330
Ω
:
– 30 kV (air discharge)
– 30 kV (contact discharge)
•
ISO 10605 - C = 330 pF, R = 330
Ω
– 30 kV (air discharge)
– 30 kV (contact discharge)
TM:
Transil is a trademark of STMicroelectronics
a. Not applicable to parts with stand-off voltage lower
than the average battery voltage (13.5 V)
June 2014
This is information on a product in full production.
DocID022065 Rev 3
1/12
www.st.com
Characteristics
SM30TY
1
Characteristics
Table 1. Absolute maximum ratings (T
amb
= 25
°C
)
Symbol
Parameter
ISO10605 (C = 330 pF, R = 330
Ω
)
contact discharge
air discharge
IEC 61000-4-2 /ISO10605 (C = 150 pF, R = 330
Ω
)
contact discharge
air discharge
T
j initial
= T
amb
Value
Unit
V
PP
Peak pulse voltage
30
30
30
30
3000
-65 to + 150
-55 to + 150
260
kV
P
PP
T
stg
T
j
T
L
Peak pulse power dissipation
(1)
Storage temperature range
Operating junction temperature range
Maximum lead temperature for soldering during 10 s.
W
°C
°C
°C
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Figure 1. Electrical characteristics - definitions
I
I
I
PP
Symbol
V
RM
V
BR
V
CL
I
RM
I
PP
α
T
V
F
R
D
Parameter
Stand-off voltage
Breakdown voltage
Clamping voltage
Leakage current @ V
RM
Peak pulse current
Voltage temperature coefficient
Forward voltage drop
Dynamic resistance
Unidirectional
I
F
V
CL
V
BR
V
RM
I
RM
I
R
V
F
V
V
CL
V
BR
V
RM
I
R
I
RM
I
RM
I
R
V
V
RM
V
BR
V
CL
I
PP
I
PP
Bidirectional
Figure 2. Pulse definition for electrical characteristics
%I
PP
100
50
Pulse waveform
tr = rise time (µs)
tp = pulse duration time (µs)
0
tr
tp
t
2/12
DocID022065 Rev 3
SM30TY
Table 2. Electrical characteristics, parameter values (T
amb
= 25 °C)
I
RM
max
at V
RM
Order code
µA
SM30T15AY/CAY
SM30T18AY/CAY
SM30T19AY/CAY
SM30T21AY/CAY
SM30T23AY/CAY
SM30T26AY/CAY
SM30T28AY/CAY
SM30T30AY/CAY
SM30T33AY/CAY
SM30T35AY/CAY
SM30T39AY/CAY
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
V
13
15
16
18
20
22
24
26
28
30
33
min
V
BR
at I
R (1)
typ
V
14.4 15.2
16
max
mA
1
1
1
1
1
1
1
1
1
1
1
Characteristics
V
CL
at I
PP
R
D
V
CL
at I
PP
R
D
10/1000 µs 10/1000 µs 8/20 µs 8/20 µs
max
V
(3)
21.5
A
(4)
140
max
⍺
T
(2)
max
Ω
0.045
0.055
0.063
0.079
0.097
0.116
0.140
0.164
0.192
0.215
0.261
V
(3)
25
30.0
31.5
35.0
37.5
40.5
43.9
47.0
50.0
53.0
58.0
A
(4)
930
910
870
790
730
680
630
600
560
530
490
Ω
0.011
0.014
0.015
0.018
0.019
0.022
0.025
0.028
0.031
0.034
0.040
10-4/ °C
8.4
8.8
8.8
9.2
9.4
9.6
9.6
9.7
9.8
9.9
10
16.7 17.6 18.5
17.8 18.7 19.6
20
21.1 22.2
24.4 123.0
26.0 115.4
29.2 102.7
32.4
35.5
38.9
42.1
45.4
48.4
53.3
92.6
84.5
77.1
71.3
66.1
62.0
56.3
22.2 23.4 24.6
24.4 25.7 27.0
26.7 28.1 29.5
28.9 30.4 31.9
31.1 32.7 34.3
33.3 35.1 36.9
36.7 38.6 40.5
1. Pulse test: t
p
< 50 ms
2. To calculate maximum clamping voltage at other surge level, use the following formula: V
CL
max = V
CL
- R
D
x (I
PP
- I
PPappli
)
where I
PPappli
is the surge current in the application
3. To calculate V
BR
or V
CL
versus junction temperature, use the following formulas:
V
BR
at T
J
= V
BR
at 25 °C x (1 + T x (T
J
- 25))
V
CL
at T
J
= V
CL
at 25 °C x (1 + T x (T
J
- 25))
4. Surge capability given for both directions for unidirectional and bidirectional types.
DocID022065 Rev 3
3/12
12
Characteristics
SM30TY
Figure 3. Peak pulse power dissipation versus Figure 4. Peak pulse power versus exponential
initial junction temperature (typical value)
pulse duration (T
j
initial = 25 °C)
3500
3000
100.0
2500
2000
10.0
1500
1000
1.0
500
0
0
25
50
75
100
125
P
PP
(W)
10/1000 µs
1000.0
P
PP
(kW)
T
j
initial = 25 °C
T
j
(°C)
150
175
0.1
1.E-03
1.E-02
t
P
(
ms
)
1.E-01
1.E+00
1.E+01
1.E+02
Figure 5. Clamping voltage versus peak pulse
current
(exponential waveform, maximum values)
1000.0
Figure 6. Junction capacitance versus reverse
applied voltage for unidirectional types
(typical values)
10.0
I
PP
(A)
T
j
initial = 25 °C
8/20 µs
C(nF)
F = 1 MHz
V
OSC
= 30 mV
RMS
T
j
= 25 °C
SM30T18AY
100.0
10/1000 µs
10.0
SM30T26AY/CAY
SM30T18AY/CAY
SM30T39AY/CAY
1.0
SM30T39AY
1.0
0.1
10
V
CL
(V)
100
0.1
1
10
V
R
(V)
100
Figure 7. Junction capacitance versus reverse
applied voltage for bidirectional types
(typical values)
10.0
Figure 8. Leakage current versus junction
temperature (typical values)
1.E+03
C(nF)
F = 1 MHz
V
OSC
= 30 mV
RMS
T
j
= 25 °C
I
R
(nA)
V
R
= V
RM
1.E+02
SM30T18CAY
1.0
SM30T39CAY
1.E+01
0.1
1
10
V
R
(V)
100
1.E+00
25
T
j
(°C)
50
75
100
125
150
4/12
DocID022065 Rev 3
SM30TY
Characteristics
Figure 9. Peak forward voltage drop versus
peak forward current
(typical values)
100.0
Figure 10. Relative variation of thermal
impedance, junction to ambient, versus pulse
duration
1.00
I
FM
(A)
Z
th(j-a)
/R
th(j-a)
Recommended pad layout
10.0
T
j
= 150 °C
T
j
= 25 °C
1.0
epoxy printed board, FR4 copper thickness = 35 µm
0.10
Single pulse
0.1
0.0
V
FM
(V)
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.01
1.E-03
t
p
(s)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 11. Thermal resistance junction to ambient versus copper surface under each
lead
100
90
80
70
60
50
40
30
20
10
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
R
th(j-a)
(°C/W)
epoxy printed board, FR4 copper thickness = 35 µm
S
Cu
(cm )
4.5
5.0
2
DocID022065 Rev 3
5/12
12
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