Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS724G
MA001116400
PG-DSO-20-32
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
9.466
0.036
0.143
2.862
116.197
0.459
0.687
31.590
311.098
5.492
0.341
0.001
1.177
0.434
2.045
Average
Mass
[%]
1.96
0.01
0.03
0.59
24.11
0.10
0.14
6.55
64.55
1.14
0.07
0.00
0.24
0.09
0.42
5. December 2014
482.03 mg
Sum
[%]
1.96
Average
Mass
[ppm]
19639
74
297
5937
24.74
0.10
241058
952
1425
65537
71.24
1.14
645395
11393
708
2
0.31
2441
900
0.51
4242
5142
1000000
3151
712357
11393
247366
952
Sum
[ppm]
19639
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
