Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4275G
MA000714082
PG-TO263-5-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
3.794
0.483
0.145
482.096
0.201
1.455
66.936
659.177
12.370
0.243
0.001
0.131
0.105
4.995
0.442
0.133
441.456
Average
Mass
[%]
0.23
0.03
0.01
28.80
0.01
0.09
4.00
39.35
0.74
0.01
0.00
0.01
0.01
0.30
0.03
0.01
26.37
7. May 2015
1674.16 mg
Sum
[%]
0.23
Average
Mass
[ppm]
2266
288
87
28.84
0.01
287964
120
869
39982
43.44
0.74
393736
7389
145
0.01
393735
78
62
0.32
2983
264
79
26.41
263688
264031
1000000
3123
145
434587
7389
288339
120
Sum
[ppm]
2266
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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