Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
ICE3AR10080CJZ
MA001147534
PG-DIP-7-4
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
3.854
0.049
0.194
3.884
157.726
0.269
1.429
46.217
428.819
6.460
1.911
0.287
1.628
Average
Mass
[%]
0.59
0.01
0.03
0.60
24.16
0.04
0.22
7.08
65.70
0.99
0.29
0.04
0.25
29. August 2013
652.73 mg
Sum
[%]
0.59
Average
Mass
[ppm]
5905
74
298
5951
24.80
0.04
241641
413
2190
70806
73.00
0.99
0.29
656965
9896
2927
440
0.29
2494
2934
1000000
729961
9896
2927
247964
413
Sum
[ppm]
5905
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com