BY251 THRU BY255
MEDIUM CURRENT PLASTIC RECTIFIER
VOLTAGE - 200 to 1300 Volts CURRENT - 3.0 Amperes
FEATURES
l
l
l
l
l
l
High surge current capability
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O
Low leakage
Void-free molded in DO-201AD plastic package
High current operation of 3 Amperes at T
A
=95
with no thermal runaway
Exceeds environmental standards of MIL-S-19500/228
DO-201AD
MECHANICAL DATA
Case: JEDEC DO-201AD Molded plastic
Terminals: Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode
Mounting Position: Any
Weight: 0.04 ounce, 1.1 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 ambient temperature unless otherwise specified.
60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
SYMBOLS
BY251
BY252
BY253
BY254
BY255
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified
Current .375"(9.5mm) Lead Length at
T
A
=95
Peak Forward Surge Current 8.3ms single
half sine-wave superimposed on rated load
(JEDEC method)
Maximum Instantaneous Forward Voltage T
J
=25
at 3.0A
T
J
=100
Maximum DC Reverse Current T
A
=25
at Rated DC Blocking Voltage T
A
=100
Typical Junction capacitance (Note 2) T
J
=25
Typical Reverse Recovery Time (Note 3)
Typical Thermal Resistance (Note 1)
Operating Junction Temperature Range
Storage Temperature Range
V
RRM
V
RMS
V
DC
I
(AV)
200
140
200
400
280
400
600
420
600
3.0
800
560
800
UNITS
1300 Volts
910
Volts
1300 Volts
Amps
I
FSM
100.0
Amps
V
F
I
R
C
J
T
RR
R JA
T
J
T
STG
1.1
1.0
5.0
1000
40
2.5
15.0
-50 to +150
-50 to +150
Volts
Volts
A
A
P
F
A
/W
NOTES:
1. Thermal Resistance From Junction to applied at Ambient 0.375"(9.5mm) lead length P.C.Board mounted.
2. Measured at 1 MHz and applied reverse voltage of 4.0 volts.
3. Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, Irr=0.25A.
RATING AND CHARACTERISTIC CURVES BY251 THRU BY255
Fig. 1-FORWARD CURRENT DERATING CURVE
Fig. 2-MAXIMUM PEAK FORWARD
SURGE CURRENT
Fig. 3-TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS
Fig. 4-TYPICAL JUNCTION CHARACTERISTICS
Fig. 5-TYPICAL REVERSE CHARACTERISTICS
Microchip MCU
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