F-213
QTE–014–01–F–D–DP–A
®
QTE–040–01–L–D–A
(0,80 mm) .0315"
QTE SERIES
QTE–060–01–L–D–A
HIGH SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contacts:
1.3A per contact @ 95°C
Ground Plane:
10.1A per ground plane @ 95°C
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC mated with QSE
& 5 mm Stack Height
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QSE
Cable Mates:
EQCD, EQSD, EQDP, EQRF
(See Application Specific note)
Integral metal plane
for power or ground
Standard stack heights
from 5 mm to 25 mm
®
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TM
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EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QSE
cols
roto rted
P
o
Supp
100 GbE
XAUI
®
PCI Express
SATA
et I/O)
MGT (Rock
™
InfiniBand
QTE/QSE
5 mm Stack Height
Processing:
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
Single-Ended Signaling
–D 9 GHz / 18 Gbps
9 GHz / 18 Gbps
Differential Pair Signaling –D 8 GHz / 16 Gbps
14 GHz / 28 Gbps
Differential Pair Signaling –DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QTE or contact sig@samtec.com
Type
notes at
Download app ppnote
com/a
www.samtec.
m
@ samtec.co
Contact SIG
tocols
on pro
for questions
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (020-060)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
QTE
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
PLATING
OPTION
TYPE
A
OTHER
OPTION
APPLICATION
SPECIFIC OPTION
• 14mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 56(-DP), 80, 100
positions per row
• Guide Posts, Screw Down
& Friction Lock
• Retention Option
Call Samtec.
–020, –040, –060
(40 total pins per bank = –D)
–014, –028, –042
(14 pairs per bank = –D–DP)
Specify
LEAD
STYLE
from
chart
–K
–F
= Gold Flash
on Signal Pins and
Ground Plane,
Matte Tin on tails
–D
= Single-Ended
–D–DP
= Differential Pair
(–01 only)
= (7,00 mm)
.275" DIA
Polyimide
Film Pick &
Place Pad
–D–DP = (No. of Positions per Row/14)
x (20,00) .7875
–D = (No. of Positions per Row/20)
x (20,00) .7875
(20,00) .7875
(7,11)
.280
02
–L
= 10µ" (0,25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–TR
= Tape & Reel
Packaging
(N/A on 56 &
80 positions
or -05 & -07
lead style)
01
(5,97)
.235
(0,80)
.0315
(0,20)
.008
–C*
= Electro-Polished
Selective
50µ" (1,27 µm) min
Au over 150µ"
(3,81 µm) Ni on Signal
Pins in contact area,
10µ" (0,25 µm) min Au
over 50µ" (1,27 µm) Ni
on Ground Plane
in contact area,
Matte Tin over 50µ"
(1,27 µm) min Ni on
all solder tails
QTE
LEAD
STYLE
A
(4,27)
.168
(7,26)
.286
(10,27)
.404
(15,25)
.600
(18,26)
.718
(24,24)
.954
HEIGHT
WITH
QSE*
(5,00)
.197
(8,00)
.315
(11,00)
.433
(16,00)
.630
(19,00)
.748
(25,00)
.984
–01
–02
–03
–04
–05
–07
–L
= Latching
Option
(N/A on 42,
56, 60 & 80
positions)
A
*Processing conditions
will affect mated height.
(0,76)
.030
(0,89)
.035 DIA
(0,64)
.025
*Note:
–C Plating passes
10 year MFG testing
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
ALSO AVAILABLE
Board Spacing Standoffs.
See SO Series.
––L
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