Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IFX20001MB V50
MA000633850
PG-SCT595-5-1
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.294
0.001
0.006
0.018
6.019
0.029
0.055
0.069
0.138
1.254
5.376
0.335
0.142
0.025
0.117
Average
Mass
[%]
2.12
0.01
0.04
0.13
43.36
0.21
0.40
0.50
0.99
9.04
38.74
2.42
1.02
0.18
0.84
29. August 2013
13.88 mg
Sum
[%]
2.12
Average
Mass
[ppm]
21155
87
436
1307
43.54
0.21
433721
2064
3973
4967
9933
90391
49.67
2.42
1.02
387388
24170
10197
1787
1.02
8424
10211
1000000
496652
24170
10197
435551
2064
Sum
[ppm]
21155
wire
encapsulation
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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