RU1H40L
N-Channel Advanced Power MOSFET
MOSFET
Features
• 100V/40A,
R
DS (ON)
=22mΩ(tpy.)@V
GS
=10V
R
DS (ON)
=28mΩ(tpy.)@V
GS
=4.5V
•
Super High Dense Cell Design
•
Fast Switching and Fully Avalanche Rated
•
Reliable and Rugged
•
100% avalanche tested
• Lead Free and Green Devices Available
(RoHS Compliant)
Pin Description
TO252
Applications
• High Speed
Power Switching.
N-Channel MOSFET
Absolute Maximum Ratings
Symbol
Parameter
Rating
100
±25
175
-55 to 175
T
C
=25°C
40
①
Unit
Common Ratings
(T
C
=25°C Unless Otherwise Noted)
V
DSS
V
GSS
T
J
T
STG
I
S
I
DP
I
D
Drain-Source Voltage
Gate-Source Voltage
Maximum Junction Temperature
Storage Temperature Range
Diode Continuous Forward Current
V
°C
°C
A
Mounted on Large Heat Sink
300μs Pulse Drain Current Tested
Continuous Drain Current(V
GS
=10V)
T
C
=25°C
T
C
=25°C
T
C
=100°C
P
D
R
θJC
③
160
40
A
A
②
30
97
48
1.55
W
°C/W
Maximum Power Dissipation
Thermal Resistance-Junction to Case
T
C
=25°C
T
C
=100°C
Drain-Source Avalanche Ratings
E
AS
Avalanche Energy, Single Pulsed
110
mJ
Copyright© Ruichips Semiconductor Co., Ltd
Rev. A– NOV., 2011
www.ruichips.com
RU1H40L
Electrical Characteristics
Symbol
Static Characteristics
BV
DSS
I
DSS
V
GS(th)
I
GSS
R
DS(ON)
④
(T
C
=25°C Unless Otherwise Noted)
RU1H40L
Min.
Typ.
Max.
Parameter
Test Condition
Unit
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate Threshold Voltage
Gate Leakage Current
Drain-Source On-state Resistance
V
GS
=0V, I
DS
=250µA
V
DS
= 100V, V
GS
=0V
T
J
=85°C
V
DS
=V
GS
, I
DS
=250µA
V
GS
=±25V, V
DS
=0V
V
GS
= 10V, I
DS
=20A
V
GS
= 4.5V, I
DS
=14A
100
1
30
1.5
2
3
±100
22
28
25
50
V
µA
V
nA
mΩ
mΩ
Diode Characteristics
V
SD
t
rr
Q
rr
④
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
⑤
I
SD
=20A, V
GS
=0V
I
SD
=20A, dl
SD
/dt=100A/µs
95
415
V
GS
=0V,V
DS
=0V,F=1MHz
V
GS
=0V,
V
DS
= 50V,
Frequency=1.0MHz
2.6
1940
210
110
20
V
DD
=50V, R
L
=2.5Ω,
I
DS
=20A, V
GEN
= 10V,
R
G
=4.7Ω
55
50
22
1.2
V
ns
nC
Ω
pF
Dynamic Characteristics
R
G
Gate Resistance
C
iss
C
oss
C
rss
t
d(ON)
t
r
t
d(OFF)
t
f
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Turn-on Rise Time
Turn-off Delay Time
Turn-off Fall Time
⑤
ns
Gate Charge Characteristics
Q
g
Q
gs
Q
gd
Notes:
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
DS
=80V, V
GS
= 10V,
I
DS
=20A
40
8
16
nC
Pulse width limited by safe operating area.
Calculated continuous current based on maximum allowable junction temperature.
Limited by T
Jmax
, I
AS
=21A, V
DD
= 48V, R
G
= 50Ω , Starting T
J
= 25°C.
Pulse test ; Pulse width≤300µs, duty cycle≤2%.
Guaranteed by design, not subject to production testing.
Copyright© Ruichips Semiconductor Co., Ltd
Rev. A– NOV., 2011
2
www.ruichips.com
RU1H40L
Typical Characteristics
Power Dissipation
Drain Current
T
j
- Junction Temperature (°C)
I
D
- Drain Current (A)
T
j
- Junction Temperature (°C)
Safe Operation Area
P
tot
- Power (W)
Thermal Transient Impedance
V
DS
- Drain-Source Voltage (V)
Normalized Effective Transient
Square Wave Pulse Duration (sec)
3
Copyright© Ruichips Semiconductor Co., Ltd
Rev. A– NOV., 2011
I
D
- Drain Current (A)
www.ruichips.com
RU1H40L
Typical Characteristics
Output Characteristics
Drain-Source On Resistance
V
DS
- Drain-Source Voltage (V)
R
DS(ON)
- On Resistance (mΩ)
I
D
- Drain Current (A)
I
D
- Drain Current (A)
Drain-Source On Resistance
Gate Threshold Voltage
V
GS
- Gate-Source Voltage (V)
Normalized Threshold Voltage
T
j
- Junction Temperature (°C)
4
Copyright© Ruichips Semiconductor Co., Ltd
Rev. A– NOV., 2011
R
DS(ON)
- On - Resistance (m)
www.ruichips.com
RU1H40L
Typical Characteristics
Drain-Source On Resistance
Source-Drain Diode Forward
Normalized On Resistance
T
j
- Junction Temperature (°C)
I
S
- Source Current (A)
V
SD
- Source-Drain Voltage (V)
Capacitance
Gate Charge
V
DS
- Drain-Source Voltage (V)
V
GS
- Gate-Source Voltage (V)
C - Capacitance (pF)
Q
G
- Gate Charge (nC)
Copyright© Ruichips Semiconductor Co., Ltd
Rev. A– NOV., 2011
5
www.ruichips.com
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