We, Samsung, declare that our component Chip Resistor is produced
in accordance with EU RoHS directive.
1.RoHS Compliance and restriction of Br
The following restricted materials are not used in packaging materials as well as products in compliance with the law and restriction.
- Cd, Pb, Hg, Cr6+, As, Br and the compounds, PCB, asbestos
- Bromic materials : PBBs, PBBOs, PBDO, PBDE, PBB
2.No use of materials breaking Ozone layer
The following ODS materials are not used in our fabrication process.
- ODS material : Freon, Haron, 1-1-1 TCE, CCl4, HCFC
If you want more detailed Information,Please Visit Samsung Electro-mechanics Website
[http://www.sem.samsung.com, http://www.semlcr.com]
Operation Notes
Applications
Chip resistors are designed for general electronic devices
such as home appliances, computer, mobile communications,
digital circuit, etc. If you require our products with high
reliability-performing at more than 125℃ or below -55℃ - for
medical equipments, aircrafts, high speed machines, military
usage, and items that can affect human life or if you need to
use in specific conditions (corrosive gas atmosphere like H
2
S
etc.), please contact us beforehand.
Normal operation temperature ranges (℃ ): -55℃ ~+155℃
Others (small sizes and flat type arrays) : -55℃ ~+125℃
Although resistor body is coated, sharp excessive impact
should be avoided to prevent damages and adverse effects
on characteristics (resistor value, open circuited, T.C.R.).
Storage
To maintain proper quality of chip components, the following
precautions are required for storage environment, method and
period.
Storage Environment
- Make sure that the ambient temperature is within 5℃ ~40℃
and the ambient humidity is within 20~70%RH.
- Chip components may be deformed, if the temperature of
packaged components exceeds 40℃ .
- Do not store where the soldering properties can be
deteriorated by harmful gas such as sulphurous gas,
chlorine gas, etc.
- Bulk packed chip components should be used as soon as
the seal is opened, thus preventing the solderability from
deteriorating.
- The remaining unused chips should be put in the original
bag and sealed again or store in a desiccator containing a
desiccating agent.
Storage Time Period
Stored chip components should be used within 6 months
after receiving the components. If 6 months or more have
elapsed, please check the solderability before actually using.
Mounting
Please give more attention not to press the chip owing to the
nozzle's improper height when it is mounted on PCB.
(Excessive pressure may cause exterior damage, change in
resistance, circuit open, etc.)
Safety precautions
These products are designed and produced for applying
to the ordinary electronic equipments.
(AV equipment, OA equipment,Telecommunication
equipment, etc)
Consult with our sales department before applying
in the devices that require extremely high
reliability such as medical equipments, transport
equipments, aircrafts/spacecrafts, nuclear power
controllers, fuel controllers, car equipments including
car accessories and other safety devices.
Following special environments, and such
environmental conditions may affect the performance
of the product. Please verify the performance
and reliability thoroughly prior to use.
a) Using in various type of Liquid including water,
oil, organic solvent and other chemicals.
b) Using in the places where the products are exposed
to direct sunlight, sea wind, corrosive
gases (including Cl
2
, H
2
S, NH
3
, SO
2
, NO
2
),
static electricity, electromagnetic waves and dusty air.
c) Using close to heat generating components or
other flammable items.
d) Using in the places that is sealed or coated
with resins or other coating materials after
soldering.
e) Using in places subject to dew condensation.
These products are not radiation resistant.
The company is not responsible for any problems
resulting from using of the products under the
conditions not recommended herein.
The company should notify any safety issues of the
products to the customer. And the safety of the
products should be monitored by the customer
periodically.
Cleaning
After Soldering Cleaning, soldering flux & Ionic cleaning
liquid should be avoided on product.
If any possibility on product, please take a test before usage.
Caution for Chip Resistor
Seperation from PCB.
Chip resistor installation on PCB is a similar phenomenon on
to a chocolate chip on top of a cake.
PCB has enough flexibility on outer force but Chip resistor
can be defected without any bending.
(By chip resistor use of Ceramic, solder, metal)
Therefore, when separating a Chip resistor from a PCB,
beware of any crack on the chip.
Others
Manual work
Whenever separating chip resistor from PCB, do not re-use
the chip resistor for circuit safety.
Electrical specification of chip resistors can be changed
by soldering iron after separation.
Re-use of separated chip resistor should be prohibited.
Do not use more than rated voltage.
(Please check the contents of each product)
FPGA/CPLD
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