电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CDR31BP8R2B

产品描述CERAMIC CHIP/MIL-PRF-55681
文件大小1MB,共10页
制造商KEMET(基美)
官网地址http://www.kemet.com
下载文档 全文预览

CDR31BP8R2B概述

CERAMIC CHIP/MIL-PRF-55681

文档预览

下载PDF文档
CERAMIC CHIP/MIL-PRF-55681
CAPACITOR OUTLINE DRAWINGS
BW
DIMENSIONS—MILLIMETERS AND (INCHES)
STYLE
KEMET
SIZE
CODE
T
L
W
MIN.
MAX.
BW
CDR01
CDR02
CDR03
CDR04
CDR05
CDR06
CDR31
CDR32
CDR33
CDR34
CDR35
C0805
C1805
C1808
C1812
C1825
C2225
C0805
C1206
C1210
C1812
C1825
2.03 ±.38 (.080 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
+.51
+.020
4.57
.180
–.38
–.015
5.72 ±.51 (.225 ±.020)
2.00 ±.20 (.078 ±.008)
3.20 ±.20 (.125 ±.008)
3.20 ±.25 (.125 ±.010)
4.50 ±.25 (.176 ±.010)
4.50 ±.30 (.176 ±.012)
(
)
1.27 ±.38 (.050 ±.015)
1.27 ±.38 (.050 ±.015)
2.03 ±.38 (.080 ±.015)
3.18 ±.38 (.125 ±.015)
+.51
+.020
6.35
.250
–.38
–.015
6.35 ±.51 (.250 ±.020)
1.25 ±.20 (.049 ±.008)
1.60 ±.20 (.062 ±.008)
2.50 ±.25 (.098 ±.010)
3.20 ±.25 (.125 ±.010)
6.40 ±.30 (.250 ±.012)
.56 (.022)
.56 (.022)
.56 (.022)
.56 (.022)
.51 (.020)
.51 (.020)
1.40 (.055)
1.40 (.055)
2.03 (.080)
2.03 (.080)
2.03 (.080)
2.03 (.080)
1.30 (.051)
1.30 (.051)
1.50 (.059)
1.50 (.059)
1.50 (.059)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.30 (.020 ±.012)
(
)
Note:
For MIL-C55681 “S” Endmet, the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following
amounts:
Length
Width
Length
CDR01
0.51MM (.020)
0.38MM (.015)
CDR02-06
0.64MM (.025)
0.38MM (.015)
CDR31-35
0.60MM (.023)
0.30MM (.012)
MIL-PRF-55681 PART NUMBER ORDERING INFORMATION
CDR01
B P
101 B K
Z
M
STYLE & SIZE CODE
STYLE
C — Ceramic
D — Dielectric, Fixed Chip
R — Established Reliability
FAILURE RATE LEVEL
(%/1000 hrs.)
TERMINATION FINISH
S — Solder Coated, Final
(SolderGuard I)
U — Base Metalization—
Barrier Metal—Solder
Coated
(SolderGuard I)
W — Base Metalization—
Barrier Metal—Tinned
Tin or (Tin/Lead Alloy)
SolderGuard II
Y — Base Metalization
Barrier Metal—Tinned
(100% Tin)
Solderguard II
RATED TEMPERATURE
–55°C to +125°C
DIELECTRICS
P —± 30 PPM/°C—WITH OR WITHOUT VOLTAGE
X —± 15%—without voltage
+ 15%, –25%—with voltage
CAPACITANCE
Expressed in picofarads (pF).
First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.
(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)
CAPACITANCE TOLERANCE
B
C
D
F
±.1 pF ±.25 pF ±.5 pF ±1%
J
±5%
K
M
±10% ±20%
Z – Base metallization -
barrier metal-tinned (tin/lead
alloy, with a min. of 4% lead)
RATED VOLTAGE
A — 50; B — 100
KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS
C 0805
P 101 K
1 G M
L
CERAMIC
SIZE CODE
See Table Above
END METALIZATION
L — 70Sn/30Pb Plated (Military codes Z,W,U )
C— 100% Tin Plated (Military code Y)
H – Sn60 Coated (Military code S)
SPECIFICATION
P -MIL-PRF-55681 = CDR01-CDR06
N-MIL-PRF-55681 = CDR31-CDR35
FAILURE RATE
(%/1,000 hrs.)
R — 0.01
S — 0.001
M — 1.0
P — 0.1
CAPACITANCE CODE
Expressed in picofarads (pF).
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9 pF. Example: 2.2 pF –229)
VOLTAGE TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G — BP (C0G/NP0) (±30 PPM/°C)
X — BX (±15% Without Voltage
+15% -25% With Voltage)
CAPACITANCE TOLERANCE
B
C
D
F
J
K
M
±
.1 pF
±
.25 pF
±
.5 pF
±
1%
±
5%
±
10%
±
20%
VOLTAGE
1 — 100V, 5 — 50V
*
Part Number Example: C0805P101K1GML
(14 digits - no spaces)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
87
Ceramic Surface Mount
M — 1.0
P — 0.1
R — 0.01
S — 0.001
不可不知的PCB布局陷阱
工业、科学和医疗射频(ISM-RF)产品的无数应用案例表明,这些产品的印制板(PCB)布局很容易出现各种缺陷。人们时常发现相同IC 安装到两块不同电路板上,所表现的性能指标会有显著差异。工作条 ......
ohahaha PCB设计
【花雕动手做】有趣好玩的音乐可视化系列小项目(10)---WS2812硬板屏
偶然心血来潮,想要做一个声音可视化的系列专题。这个专题的难度有点高,涉及面也比较广泛,相关的FFT和FHT等算法也相当复杂,不过还是打算从最简单的开始,实际动手做做试验,耐心尝试一下各种 ......
eagler8 DIY/开源硬件专区
89s5X系列在线编程是否需要外接电源
想做一个ISP下载线,请问是否需要给单片机外接电源来编程,是否可以利用并口供电,如果利用并口供电应该接并口的哪几个脚...
max 嵌入式系统
『新手第一帖』dsPIC的性能如何?怎样选型?
:)『新手第一帖』dsPIC的性能如何?怎样选型?各位好: 最近在准备做一个控制板,上与电脑通过232通讯,下与变频器通过485和4-20mA 相连,以模拟电流来控制电动机的转矩。 看到有的论文资料上, ......
jadeyu Microchip MCU
【linknode评测】03 mbed之用户交互-串口
LinkNode上的用户交互主要有按键、LED、buzzer,但是更重要的是uart,一般mbed除了虚拟U盘(MSD programmer) 外,还有两个设备,分别是CMSIS-DAP Debug和虚拟串口。 238899 不过虚拟串口和de ......
johnrey 无线连接
电磁阀控制电路
我做的这个电磁阀是柴油机喷油系统测试装置中用的,该测试装置中有一个用来测喷油量的量筒,该量筒上下两端各有一光电传感器,底部有一电磁阀用来放油.当开始测量时电磁阀关闭,当油面上升到顶端的 ......
xuan1985 测试/测量

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2865  2314  611  872  2526  18  13  28  27  21 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved